Datasheet AD9272 (Analog Devices) - 9
| Manufacturer | Analog Devices |
| Description | Octal LNA/VGA/AAF/ADC and Crosspoint Switch |
| Pages / Page | 44 / 9 — AD9272. SWITCHING SPECIFICATIONS. Table 3. Parameter1. Temp. Min. Typ. … |
| Revision | C |
| File Format / Size | PDF / 994 Kb |
| Document Language | English |
AD9272. SWITCHING SPECIFICATIONS. Table 3. Parameter1. Temp. Min. Typ. Max. Unit
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AD9272 SWITCHING SPECIFICATIONS
AVDD1 = 1.8 V, AVDD2 = 3.0 V, DRVDD = 1.8 V, 1.0 V internal ADC reference, fIN = 5 MHz, full temperature, unless otherwise noted.
Table 3. Parameter1 Temp Min Typ Max Unit
CLOCK2 Clock Rate Full 10 80 MSPS Clock Pulse Width High (tEH) Full 6.25 ns Clock Pulse Width Low (tEL) Full 6.25 ns OUTPUT PARAMETERS2, 3 Propagation Delay (tPD) Full (tSAMPLE/2) + 1.5 (tSAMPLE/2) + 2.3 (tSAMPLE/2) + 3.1 ns Rise Time (tR) (20% to 80%) Full 300 ps Fall Time (tF) (20% to 80%) Full 300 ps FCO± Propagation Delay (tFCO) Full (tSAMPLE/2) + 1.5 (tSAMPLE/2) + 2.3 (tSAMPLE/2) + 3.1 ns DCO± Propagation Delay (tCPD)4 Full tFCO + (tSAMPLE/24) ns DCO± to Data Delay (tDATA)4 Full (tSAMPLE/24) − 300 (tSAMPLE/24) (tSAMPLE/24) + 300 ps DCO± to FCO± Delay (tFRAME)4 Full (tSAMPLE/24) − 300 (tSAMPLE/24) (tSAMPLE/24) + 300 ps Data-to-Data Skew Full ±100 ±350 ps (tDATA-MAX − tDATA-MIN) Wake-Up Time (Standby), GAIN+ = 0.8 V 25°C 2 μs Wake-Up Time (Power-Down) 25°C 1 ms Pipeline Latency Full 8 Clock cycles APERTURE Aperture Uncertainty (Jitter) 25°C <1 ps rms 1 See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and information about how these tests were completed. 2 Can be adjusted via the SPI. 3 Measurements were made using a part soldered to FR-4 material. 4 tSAMPLE/24 is based on the number of bits divided by 2 because the delays are based on half duty cycles. Rev. C | Page 9 of 44 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY PRODUCT HIGHLIGHTS SPECIFICATIONS AC SPECIFICATIONS DIGITAL SPECIFICATIONS SWITCHING SPECIFICATIONS ADC Timing Diagrams ABSOLUTE MAXIMUM RATINGS THERMAL IMPEDANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS EQUIVALENT CIRCUITS THEORY OF OPERATION ULTRASOUND CHANNEL OVERVIEW Low Noise Amplifier (LNA) Recommendation Active Impedance Matching LNA Noise INPUT OVERDRIVE Input Overload Protection CW DOPPLER OPERATION Crosspoint Switch TGC OPERATION Variable Gain Amplifier Gain Control VGA Noise Antialiasing Filter ADC CLOCK INPUT CONSIDERATIONS Clock Duty Cycle Considerations Clock Jitter Considerations Power Dissipation and Power-Down Mode Digital Outputs and Timing SDIO Pin SCLK Pin CSB Pin RBIAS Pin Voltage Reference Power and Ground Recommendations Exposed Paddle Thermal Heat Slug Recommendations SERIAL PORT INTERFACE (SPI) HARDWARE INTERFACE MEMORY MAP READING THE MEMORY MAP TABLE Caution RESERVED LOCATIONS DEFAULT VALUES LOGIC LEVELS OUTLINE DIMENSIONS ORDERING GUIDE
AD9272 SWITCHING SPECIFICATIONS
AVDD1 = 1.8 V, AVDD2 = 3.0 V, DRVDD = 1.8 V, 1.0 V internal ADC reference, fIN = 5 MHz, full temperature, unless otherwise noted.
Table 3. Parameter1 Temp Min Typ Max Unit
CLOCK2 Clock Rate Full 10 80 MSPS Clock Pulse Width High (tEH) Full 6.25 ns Clock Pulse Width Low (tEL) Full 6.25 ns OUTPUT PARAMETERS2, 3 Propagation Delay (tPD) Full (tSAMPLE/2) + 1.5 (tSAMPLE/2) + 2.3 (tSAMPLE/2) + 3.1 ns Rise Time (tR) (20% to 80%) Full 300 ps Fall Time (tF) (20% to 80%) Full 300 ps FCO± Propagation Delay (tFCO) Full (tSAMPLE/2) + 1.5 (tSAMPLE/2) + 2.3 (tSAMPLE/2) + 3.1 ns DCO± Propagation Delay (tCPD)4 Full tFCO + (tSAMPLE/24) ns DCO± to Data Delay (tDATA)4 Full (tSAMPLE/24) − 300 (tSAMPLE/24) (tSAMPLE/24) + 300 ps DCO± to FCO± Delay (tFRAME)4 Full (tSAMPLE/24) − 300 (tSAMPLE/24) (tSAMPLE/24) + 300 ps Data-to-Data Skew Full ±100 ±350 ps (tDATA-MAX − tDATA-MIN) Wake-Up Time (Standby), GAIN+ = 0.8 V 25°C 2 μs Wake-Up Time (Power-Down) 25°C 1 ms Pipeline Latency Full 8 Clock cycles APERTURE Aperture Uncertainty (Jitter) 25°C <1 ps rms 1 See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and information about how these tests were completed. 2 Can be adjusted via the SPI. 3 Measurements were made using a part soldered to FR-4 material. 4 tSAMPLE/24 is based on the number of bits divided by 2 because the delays are based on half duty cycles. Rev. C | Page 9 of 44 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY PRODUCT HIGHLIGHTS SPECIFICATIONS AC SPECIFICATIONS DIGITAL SPECIFICATIONS SWITCHING SPECIFICATIONS ADC Timing Diagrams ABSOLUTE MAXIMUM RATINGS THERMAL IMPEDANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS EQUIVALENT CIRCUITS THEORY OF OPERATION ULTRASOUND CHANNEL OVERVIEW Low Noise Amplifier (LNA) Recommendation Active Impedance Matching LNA Noise INPUT OVERDRIVE Input Overload Protection CW DOPPLER OPERATION Crosspoint Switch TGC OPERATION Variable Gain Amplifier Gain Control VGA Noise Antialiasing Filter ADC CLOCK INPUT CONSIDERATIONS Clock Duty Cycle Considerations Clock Jitter Considerations Power Dissipation and Power-Down Mode Digital Outputs and Timing SDIO Pin SCLK Pin CSB Pin RBIAS Pin Voltage Reference Power and Ground Recommendations Exposed Paddle Thermal Heat Slug Recommendations SERIAL PORT INTERFACE (SPI) HARDWARE INTERFACE MEMORY MAP READING THE MEMORY MAP TABLE Caution RESERVED LOCATIONS DEFAULT VALUES LOGIC LEVELS OUTLINE DIMENSIONS ORDERING GUIDE
