Datasheet AD8331, AD8332, AD8334 (Analog Devices) - 7
| Manufacturer | Analog Devices |
| Description | Quad VGA with Ultralow Noise Preamplifier and Programmable RIN |
| Pages / Page | 55 / 7 — Data Sheet. AD8331/AD8332/AD8334. ABSOLUTE MAXIMUM RATINGS Table 2. … |
| Revision | I |
| File Format / Size | PDF / 2.2 Mb |
| Document Language | English |
Data Sheet. AD8331/AD8332/AD8334. ABSOLUTE MAXIMUM RATINGS Table 2. Parameter. Rating. ESD CAUTION
Model Line for this Datasheet
Text Version of Document
Data Sheet AD8331/AD8332/AD8334 ABSOLUTE MAXIMUM RATINGS Table 2.
Stresses at or above those listed under Absolute Maximum
Parameter Rating
Ratings may cause permanent damage to the product. This is a Voltage stress rating only; functional operation of the product at these Supply Voltage (VPSn, VPSV, VPSL, VPOS) 5.5 V or any other conditions above those indicated in the operational Input Voltage (INHx) VS + 200 mV section of this specification is not implied. Operation beyond ENB, ENBL, ENBV, HILO Voltage VS + 200 mV the maximum operating conditions for extended periods may GAIN Voltage 2.5 V affect product reliability. Power Dissipation
ESD CAUTION
RU Package1 (AD8332) 0.96 W CP-32 Package (AD8332) 1.97 W RQ Package1 (AD8331) 0.78 W CP-64 Package (AD8334) 0.91 W Temperature Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering 60 sec) 300°C θJA RU Package1 (AD8332) 68°C/W CP-32 Package22 (AD8332) 33°C/W RQ Package1 (AD8331) 83°C/W CP-64 Package3 (AD8334) 24.2°C/W 1 4-layer JEDEC board (2S2P). 2 Exposed pad soldered to board, nine thermal vias in pad—JEDEC, 4-layer board J-STD-51-9. 3 Exposed pad soldered to board, 25 thermal vias in pad—JEDEC, 4-layer board J-STD-51-9. Rev. I | Page 7 of 55 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS MEASUREMENT CONSIDERATIONS THEORY OF OPERATION OVERVIEW LOW NOISE AMPLIFIER (LNA) Active Impedance Matching LNA Noise VARIABLE GAIN AMPLIFIER X-AMP VGA Gain Control VGA Noise Common-Mode Biasing POSTAMPLIFIER Noise Output Clamping APPLICATIONS INFORMATION LNA—EXTERNAL COMPONENTS Gain Input VCM Input Logic Inputs—ENB, MODE, and HILO Optional Output Voltage Limiting Output Decoupling DRIVING ADCs OVERLOAD OPTIONAL INPUT OVERLOAD PROTECTION LAYOUT, GROUNDING, AND BYPASSING MULTIPLE INPUT MATCHING DISABLING THE LNA ULTRASOUND TGC APPLICATION HIGH DENSITY QUAD LAYOUT AD8331 EVALUATION BOARD GENERAL DESCRIPTION USER-SUPPLIED OPTIONAL COMPONENTS MEASUREMENT SETUP BOARD LAYOUT AD8331 EVALUATION BOARD SCHEMATICS AD8331 EVALUATION BOARD PCB LAYERS AD8332 EVALUATION BOARD GENERAL DESCRIPTION USER-SUPPLIED OPTIONAL COMPONENTS MEASUREMENT SETUP BOARD LAYOUT EVALUATION BOARD SCHEMATICS AD8332 EVALUATION BOARD PCB LAYERS AD8334 EVALUATION BOARD GENERAL DESCRIPTION CONFIGURING THE INPUT IMPEDANCE Driving the VGA from an External Source or Using the LNA to Drive an External Load Using the Clamp Circuit Viewing Signals MEASUREMENT SETUP BOARD LAYOUT EVALUATION BOARD SCHEMATICS AD8334 EVALUATION BOARD PCB LAYERS OUTLINE DIMENSIONS ORDERING GUIDE
Stresses at or above those listed under Absolute Maximum
Parameter Rating
Ratings may cause permanent damage to the product. This is a Voltage stress rating only; functional operation of the product at these Supply Voltage (VPSn, VPSV, VPSL, VPOS) 5.5 V or any other conditions above those indicated in the operational Input Voltage (INHx) VS + 200 mV section of this specification is not implied. Operation beyond ENB, ENBL, ENBV, HILO Voltage VS + 200 mV the maximum operating conditions for extended periods may GAIN Voltage 2.5 V affect product reliability. Power Dissipation
ESD CAUTION
RU Package1 (AD8332) 0.96 W CP-32 Package (AD8332) 1.97 W RQ Package1 (AD8331) 0.78 W CP-64 Package (AD8334) 0.91 W Temperature Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering 60 sec) 300°C θJA RU Package1 (AD8332) 68°C/W CP-32 Package22 (AD8332) 33°C/W RQ Package1 (AD8331) 83°C/W CP-64 Package3 (AD8334) 24.2°C/W 1 4-layer JEDEC board (2S2P). 2 Exposed pad soldered to board, nine thermal vias in pad—JEDEC, 4-layer board J-STD-51-9. 3 Exposed pad soldered to board, 25 thermal vias in pad—JEDEC, 4-layer board J-STD-51-9. Rev. I | Page 7 of 55 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS MEASUREMENT CONSIDERATIONS THEORY OF OPERATION OVERVIEW LOW NOISE AMPLIFIER (LNA) Active Impedance Matching LNA Noise VARIABLE GAIN AMPLIFIER X-AMP VGA Gain Control VGA Noise Common-Mode Biasing POSTAMPLIFIER Noise Output Clamping APPLICATIONS INFORMATION LNA—EXTERNAL COMPONENTS Gain Input VCM Input Logic Inputs—ENB, MODE, and HILO Optional Output Voltage Limiting Output Decoupling DRIVING ADCs OVERLOAD OPTIONAL INPUT OVERLOAD PROTECTION LAYOUT, GROUNDING, AND BYPASSING MULTIPLE INPUT MATCHING DISABLING THE LNA ULTRASOUND TGC APPLICATION HIGH DENSITY QUAD LAYOUT AD8331 EVALUATION BOARD GENERAL DESCRIPTION USER-SUPPLIED OPTIONAL COMPONENTS MEASUREMENT SETUP BOARD LAYOUT AD8331 EVALUATION BOARD SCHEMATICS AD8331 EVALUATION BOARD PCB LAYERS AD8332 EVALUATION BOARD GENERAL DESCRIPTION USER-SUPPLIED OPTIONAL COMPONENTS MEASUREMENT SETUP BOARD LAYOUT EVALUATION BOARD SCHEMATICS AD8332 EVALUATION BOARD PCB LAYERS AD8334 EVALUATION BOARD GENERAL DESCRIPTION CONFIGURING THE INPUT IMPEDANCE Driving the VGA from an External Source or Using the LNA to Drive an External Load Using the Clamp Circuit Viewing Signals MEASUREMENT SETUP BOARD LAYOUT EVALUATION BOARD SCHEMATICS AD8334 EVALUATION BOARD PCB LAYERS OUTLINE DIMENSIONS ORDERING GUIDE
