Datasheet AD8331-EP (Analog Devices) - 6
| Manufacturer | Analog Devices |
| Description | Single VGA with Ultralow Noise Preamplifier and Programmable RIN |
| Pages / Page | 9 / 6 — AD8331-EP. Enhanced Product. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL … |
| File Format / Size | PDF / 214 Kb |
| Document Language | English |
AD8331-EP. Enhanced Product. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE. Parameter. Rating. Table 3. Thermal Resistance
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AD8331-EP Enhanced Product ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board Voltage (PCB) design and operating environment. Careful attention to Supply Voltage (VPSL, VPOS) 5.5 V PCB thermal design is required. Input Voltage (INH) VS + 200 mV θJA is the natural convection junction to ambient thermal ENBL, ENBV, HILO Voltage VS + 200 mV resistance measured in a one cubic foot sealed enclosure, and GAIN Voltage 2.5 V θJC is the junction to case thermal resistance measured at Power Dissipation See Figure 2 package top. Temperature Extended Industrial Range −55°C to +105°C
Table 3. Thermal Resistance
Junction Temperature (T
1 2
J) 125°C
Package Type θJA θJC Unit
Storage Temperature Range −65°C to +150°C RQ-20 86 34 °C/W Lead Temperature (Soldering, 60 sec) 300°C 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal Stresses at or above those listed under Absolute Maximum test board. See JEDEC JESD-51. 2 Thermal impedance simulated values are based on a JEDEC 1S0P thermal Ratings may cause permanent damage to the product. This is a test board. See JEDEC JESD-51. stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond
ESD CAUTION
the maximum operating conditions for extended periods may affect product reliability.
POWER DERATING CURVES
Figure 2 shows the maximum power dissipation vs. ambient temperature.
1.2 ) 1.0 (W N IO T 0.8 PA ISSI D 0.6 ER W 0.4 M PO MU XI 0.2 MA 0 –55 –35 –15 5 25 45 65 85 105
002
AMBIENT TEMPERATURE (°C)
20775- Figure 2. Maximum Power Dissipation vs. Ambient Temperature Rev. 0 | Page 6 of 9 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS POWER DERATING CURVES THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE
AD8331-EP Enhanced Product ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board Voltage (PCB) design and operating environment. Careful attention to Supply Voltage (VPSL, VPOS) 5.5 V PCB thermal design is required. Input Voltage (INH) VS + 200 mV θJA is the natural convection junction to ambient thermal ENBL, ENBV, HILO Voltage VS + 200 mV resistance measured in a one cubic foot sealed enclosure, and GAIN Voltage 2.5 V θJC is the junction to case thermal resistance measured at Power Dissipation See Figure 2 package top. Temperature Extended Industrial Range −55°C to +105°C
Table 3. Thermal Resistance
Junction Temperature (T
1 2
J) 125°C
Package Type θJA θJC Unit
Storage Temperature Range −65°C to +150°C RQ-20 86 34 °C/W Lead Temperature (Soldering, 60 sec) 300°C 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal Stresses at or above those listed under Absolute Maximum test board. See JEDEC JESD-51. 2 Thermal impedance simulated values are based on a JEDEC 1S0P thermal Ratings may cause permanent damage to the product. This is a test board. See JEDEC JESD-51. stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond
ESD CAUTION
the maximum operating conditions for extended periods may affect product reliability.
POWER DERATING CURVES
Figure 2 shows the maximum power dissipation vs. ambient temperature.
1.2 ) 1.0 (W N IO T 0.8 PA ISSI D 0.6 ER W 0.4 M PO MU XI 0.2 MA 0 –55 –35 –15 5 25 45 65 85 105
002
AMBIENT TEMPERATURE (°C)
20775- Figure 2. Maximum Power Dissipation vs. Ambient Temperature Rev. 0 | Page 6 of 9 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS POWER DERATING CURVES THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE
