Datasheet HMC8121 (Analog Devices) - 6
| Manufacturer | Analog Devices |
| Description | 81 GHz to 86 GHz, E-Band Variable Gain Amplifier |
| Pages / Page | 16 / 6 — HMC8121. Data Sheet. INTERFACE SCHEMATICS. VDD6, VDD5, VDD4,. VDD3, VDD2, … |
| Revision | B |
| File Format / Size | PDF / 352 Kb |
| Document Language | English |
HMC8121. Data Sheet. INTERFACE SCHEMATICS. VDD6, VDD5, VDD4,. VDD3, VDD2, VDD1. GND. RFIN. 1.6kΩ. GG6 TO VGG3,. GG1/VGG2. RFOUT. VCTL2, VCTL1
Model Line for this Datasheet
Text Version of Document
HMC8121 Data Sheet INTERFACE SCHEMATICS VDD6, VDD5, VDD4, VDD3, VDD2, VDD1 GND
003 007 13154- 13154- Figure 3. GND Interface Figure 7. VDD6 to VDD1 Interface
RFIN 1.6kΩ
004
V
008
GG6 TO VGG3, V
13154-
GG1/VGG2
13154- Figure 4. RFIN Interface Figure 8. VGG6 to VGG3, VGG1/VGG2 Interface
RFOUT
009
1.6kΩ
005
VCTL2, VCTL1
13154- 13154- Figure 5. RFOUT Interface Figure 9. VCTL2, VCTL1 Interface 006 010
VDET, VREF ENV
13154-
DET
13154- Figure 6. VDET, VREF Interface Figure 10. ENVDET Interface Rev. B | Page 6 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE
003 007 13154- 13154- Figure 3. GND Interface Figure 7. VDD6 to VDD1 Interface
RFIN 1.6kΩ
004
V
008
GG6 TO VGG3, V
13154-
GG1/VGG2
13154- Figure 4. RFIN Interface Figure 8. VGG6 to VGG3, VGG1/VGG2 Interface
RFOUT
009
1.6kΩ
005
VCTL2, VCTL1
13154- 13154- Figure 5. RFOUT Interface Figure 9. VCTL2, VCTL1 Interface 006 010
VDET, VREF ENV
13154-
DET
13154- Figure 6. VDET, VREF Interface Figure 10. ENVDET Interface Rev. B | Page 6 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE
