HMC8120Data Sheet2028320IDD = 250mAIDD = 150mAIDD = 110mAIDD = 225mAIDD = 140mAIDD = 100mAIII15DD = 200mADD = 130mADD = 90mAIDD = 175mAIDD = 120mAIDD = 80mA24310) (%10E 20300A P ),)BB5)d16290(dA(ININA(m0GGA12280I DD), m B–5(d T 8270OUPP–104OUT260GAINPAEIDD–15025071.0 71.5 72.0 72.5 73.0 73.5 74.0 74.5 75.0 75.5 76.0 -028 –15–13–11–9–7–5–3–113 029 0- FREQUENCY (GHz)INPUT POWER (dBm) 13150 1315 Figure 29. Gain vs. Frequency at Various Drain Currents, Figure 32. POUT, Gain, PAE, and IDD vs. Input Power, PIN = −10 dBm/Tone, VCTL1/VCTL2 = −1 V, VCTL1/VCTL2 = −5 V, RF = 71 GHz Drain Current = (IDD1/IDD2 Fixed at 50 mA) + (IDD3 to IDD6 Swept) 28320283202431024310))(%(%E 20300EA20300A P),P),BB16290))(dA16290(dAININA(mA(m12280I DDG), G12280I DD), mBmB(d(dT8270T8270OUOUPPPPOUTOUT4GAIN2604GAIN 260PAEPAEIDDIDD02500250–15–13–11–9–7–5–3–113 032 –15–13–11–9–7–5–3–113 -030 50- INPUT POWER (dBm)INPUT POWER (dBm) 131 13150 Figure 30. POUT, Gain, PAE, and IDD vs. Input Power, Figure 33. POUT, Gain, PAE, and IDD vs. Input Power, VCTL1/VCTL2 = −5 V, RF = 73.5 GHz VCTL1/VCTL2 = −5 V, RF = 76 GHz 100.40RF = 71.0GHz100MHz TONE SPACINGRF = 73.5GHz300MHz TONE SPACINGRF = 76.0GHz) 0.35V500MHz TONE SPACING(750MHz TONE SPACINGE10.30LTAG)O V(V0.25T UDETP0.1UT 0.20– V FOREAKV0.15E -P O0.01-T 0.10 AK E P 0.050.0010–4048121620 031 –20–18–16–14–12–10–8–6–4 134 0- 50- OUTPUT POWER (dBm)TOTAL INPUT POWER (dBm) 1315 131 Figure 31. Detector Output Voltage (VREF – VDET) vs. Output Power at Various Figure 34. Envelope Detector Peak-to-Peak Output Voltage vs. Total Input RF Frequencies, VCTL1/VCTL2 = −5 V Power at Various Tone Spacings, RF = 71 GHz, VCTL1/VCTL2 = −5 V, VDET = 4 V with 150 Ω Load Impedance at ENVDET Rev. A | Page 10 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE