Datasheet BC556, BC557 (NXP) - 6
| Manufacturer | NXP |
| Description | PNP general purpose transistors |
| Pages / Page | 8 / 6 — PACKAGE OUTLINE. Plastic single-ended leaded (through hole) package; 3 … |
| File Format / Size | PDF / 252 Kb |
| Document Language | English |
PACKAGE OUTLINE. Plastic single-ended leaded (through hole) package; 3 leads. SOT54
Model Line for this Datasheet
Text Version of Document
NXP Semiconductors Product data sheet PNP general purpose transistors BC556; BC557
PACKAGE OUTLINE Plastic single-ended leaded (through hole) package; 3 leads SOT54
c E d A L b
1
e1
2
D e
3
b1 L1 0 2.5 5 mm scale
DIMENSIONS (mm are the original dimensions) L (1) UNIT A b b c D d E e e L 1 1 1 max.
5.2 0.48 0.66 0.45 4.8 1.7 4.2 14.5 mm 2.54 1.27 2.5 5.0 0.40 0.55 0.38 4.4 1.4 3.6 12.7
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC JEITA
04-06-28 SOT54 TO-92 SC-43A 04-11-16 2004 Oct 11 6 Document Outline Features Applications Description Pinning Ordering information Limiting values Thermal characteristics Characteristics Package outline Data sheet status Disclaimers
PACKAGE OUTLINE Plastic single-ended leaded (through hole) package; 3 leads SOT54
c E d A L b
1
e1
2
D e
3
b1 L1 0 2.5 5 mm scale
DIMENSIONS (mm are the original dimensions) L (1) UNIT A b b c D d E e e L 1 1 1 max.
5.2 0.48 0.66 0.45 4.8 1.7 4.2 14.5 mm 2.54 1.27 2.5 5.0 0.40 0.55 0.38 4.4 1.4 3.6 12.7
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
REFERENCES OUTLINE EUROPEAN ISSUE DATE VERSION PROJECTION IEC JEDEC JEITA
04-06-28 SOT54 TO-92 SC-43A 04-11-16 2004 Oct 11 6 Document Outline Features Applications Description Pinning Ordering information Limiting values Thermal characteristics Characteristics Package outline Data sheet status Disclaimers
