Datasheet BC846BPN (NXP) - 5

ManufacturerNXP
Description65 V, 100 mA NPN/PNP general-purpose transistor
Pages / Page15 / 5 — NXP Semiconductors. BC846BPN. 65 V, 100 mA NPN/PNP general-purpose …
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NXP Semiconductors. BC846BPN. 65 V, 100 mA NPN/PNP general-purpose transistor. Characteristics. Table 8. Symbol Parameter

NXP Semiconductors BC846BPN 65 V, 100 mA NPN/PNP general-purpose transistor Characteristics Table 8 Symbol Parameter

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NXP Semiconductors BC846BPN 65 V, 100 mA NPN/PNP general-purpose transistor 7. Characteristics Table 8. Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit TR1 (NPN)
ICBO collector-base cut-off VCB = 50 V; IE = 0 A - - 15 nA current VCB = 30 V; IE = 0 A; - - 5 µA Tj = 150 °C IEBO emitter-base cut-off VEB = 6 V; IC = 0 A - - 100 nA current hFE DC current gain VCE = 5 V IC = 10 µA - 280 - IC = 2 mA 200 300 450 VCEsat collector-emitter IC = 10 mA; IB = 0.5 mA - 55 100 mV saturation voltage IC = 100 mA; IB = 5 mA - 200 300 mV VBEsat base-emitter IC = 10 mA; IB = 0.5 mA - 755 850 mV saturation voltage IC = 100 mA; IB = 5 mA - 1000 - mV VBE base-emitter voltage VCE = 5 V IC = 2 mA 580 650 700 mV IC = 10 mA - - 770 mV Cc collector capacitance VCB = 10 V; IE = ie = 0 A; - 1.9 - pF f = 1 MHz Ce emitter capacitance VEB = 0.5 V; IC = ic = 0 A; - 11 - pF f = 1 MHz fT transition frequency VCE = 5 V; IC = 10 mA; 100 - - MHz f = 100 MHz NF noise figure VCE = 5 V; IC = 0.2 mA; - 1.9 - dB RS = 2 kΩ; f = 10 Hz to 15.7 kHz VCE = 5 V; IC = 0.2 mA; - 3.1 - dB RS = 2 kΩ; f = 1 kHz; B = 200 Hz
TR2 (PNP)
ICBO collector-base cut-off VCB = −50 V; IE = 0 A - - −15 nA current VCB = −30 V; IE = 0 A; - - −5 µA Tj = 150 °C IEBO emitter-base cut-off VEB = −6 V; IC = 0 A - - −100 nA current hFE DC current gain VCE = −5 V IC = −10 µA - 270 - IC = −2 mA 200 290 450 VCEsat collector-emitter IC = −10 mA; - −55 −100 mV saturation voltage IB = −0.5 mA IC = −100 mA; IB = −5 mA - −200 −300 mV BC846BPN_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 17 July 2009 5 of 15
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 8.1 Quality information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents