VM3000 Low Noise PDM Digital Bottom Port Piezoelectric MEMS Microphone PRELIMINARY DATASHEETPCB DESIGN AND LAND PATTERN LAYOUT PCB and Solder Stencil Pattern – Al dimensions are in mm Lightly shaded pads are No Connect and are optional for the footprint. If they are included they should be left floating. TAPE AND REEL SPECIFICATIONS Tape and Reel specification - All dimensions in millimeters (inches) Document Name: VM3000_Datasheet Page 10 of 12 Vesper reserves the right to alter the datasheet specifications Revision: U0.0.0 without notification. Vesper assumes no liability for the use of engineering samples and offers no warranty for this product. info@vespermems.com Document Outline GENERAL DESCRIPTION FEATURES APPLICATIONS ORDERING INFORMATION BLOCK DIAGRAM TYPICAL APPLICATION CIRCUIT TABLE OF CONTENTS SPECIFICATIONS PDM DIGITAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ENVIRONMENTAL ROBUSTNESS RELIABILITY SPECIFCATIONS MICROPHONE OPERATION MICROPHONE MODES TIMING SPECIFICATIONS TYPICAL PERFORMANCE CHARACTERISTICS SOLDER REFLOW PROFILE HANDLING INSTRUCTIONS DIMENSIONS AND PIN LAYOUT PCB DESIGN AND LAND PATTERN LAYOUT TAPE AND REEL SPECIFICATIONS LID MARKING SUPPORTING DOCUMENTS COMPLIANCE INFORMATION CONTACT DETAILS LEGAL INFORMATION REVISION HISTORY