Datasheet BM83 (Microchip) - 6
| Manufacturer | Microchip |
| Description | BM83 Bluetooth Stereo Audio Module |
| Pages / Page | 76 / 6 — BM83. Quick References. 1.1. Reference Documentation. Note: . 1.2. Design … |
| File Format / Size | PDF / 4.9 Mb |
| Document Language | English |
BM83. Quick References. 1.1. Reference Documentation. Note: . 1.2. Design Packages. 1.3
Model Line for this Datasheet
Text Version of Document
BM83 Quick References 1. Quick References 1.1 Reference Documentation
For further study, refer to the following: • IS2083 Bluetooth® Stereo Audio SoC Data Sheet (DS70005403) • BM83 Bluetooth® Audio Development Board User's Guide (DS50002902) • IS2083 SDK User Guide (DS50002894) • BM83 Host MCU Firmware Development Guide (DS50002896) • IS2083 Bluetooth® Audio Application Design Guide (DS00003118) • IS2083 SDK Debugger User’s Guide (DS50002892) • IS2083 Reference Design Application Note • Introduction to DSP Configuration Tool and AEC Tuning Guide (AN2432) • AN233 Solder Reflow Recommendation Application Note (DS00233)
Note:
1. For a complete list of development support tools and documents, visit: – http://www.microchip.com/BM83 – https://www.microchip.com/IS2083 2. Contact your local sales representative for more information about the Software Development Kit (SDK).
1.2 Design Packages
For reference schematics, refer to https://www.microchip.com/wwwproducts/en/BM83.
1.3 Acronyms/Abbreviations Table 1-1. Acronyms/Abbreviations Acronyms/Abbreviations Description
A2DP Advanced Audio Distribution Profile AAC Advanced Audio Codec ADC Analog-to-Digital Converter AEC Acoustic Echo Cancellation AFH Adaptive Frequency Hopping ANCS Apple Notification Center Service API Application Programming Interfaces AVRCP Audio/Video Remote Control Profile AW Audio Widening BDR Basic Data Rate BER Bit Error Rate BLE Bluetooth Low Energy BOM Bill of Materials BPF Band Pass Filter BR Basic Rate © 2019 Microchip Technology Inc.
Datasheet
DS70005402B-page 6 Document Outline Introduction Features Table of Contents 1. Quick References 1.1. Reference Documentation 1.2. Design Packages 1.3. Acronyms/Abbreviations 2. Device Overview 2.1. BM83 Module Pin Diagram 2.2. BM83 Module Pin Description 3. Audio Subsystem 3.1. Digital Signal Processor 3.2. Codec 3.2.1. DAC Performance 3.2.2. ADC Performance 3.3. Auxiliary Port 3.4. Analog Speaker Output 3.5. Microphone Inputs 4. Bluetooth Transceiver 4.1. Transmitter 4.2. Receiver 4.3. Synthesizer 4.4. Modulator-Demodulator 4.5. Adaptive Frequency Hopping 5. Power Management Unit 5.1. Power Supply 5.2. SAR ADC 5.3. LED Drivers 6. Application Information 6.1. Power On/Off Sequence 6.2. Reset 6.3. Configuring and Programming 6.3.1. Test Mode 6.3.2. 2-wire JTAG Program and Debug 6.3.2.1. Serial Program Clock (TCK_CPU) 6.3.2.2. Serial Program Data (TDI_CPU) 6.4. General Purpose I/O Pins 6.5. I2S Interface 6.6. Host MCU Interface Over UART 7. PCB Antenna Information 7.1. Antenna Radiation Pattern 7.2. Module Placement Guidelines 8. Physical Dimensions 9. Electrical Specifications 9.1. Timing Specifications 10. Soldering Recommendations 11. Ordering Information 12. Appendix A: Regulatory Approval 12.1. United States 12.1.1. Labeling and User Information Requirements 12.1.2. RF Exposure 12.1.3. Helpful Web Sites 12.2. Canada 12.2.1. Labeling and User Information Requirements 12.2.2. RF Exposure 12.2.3. Helpful Web Sites 12.3. Europe 12.3.1. Labeling and User Information Requirements 12.3.2. Conformity Assessment 12.3.2.1. Simplified EU Declaration of Conformity 12.3.3. Helpful Websites 12.4. Japan 12.4.1. Labeling and User Information Requirements 12.4.2. Helpful Web Sites 12.5. Korea 12.5.1. Labeling and User Information Requirements 12.5.2. Helpful Websites 12.6. Taiwan 12.6.1. Labeling and User Information Requirements 12.6.2. Helpful Web Sites 12.7. China 12.7.1. Labeling and User Information Requirements 12.8. Other Regulatory Information 13. Document Revision History The Microchip Website Product Change Notification Service Customer Support Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Worldwide Sales and Service
For further study, refer to the following: • IS2083 Bluetooth® Stereo Audio SoC Data Sheet (DS70005403) • BM83 Bluetooth® Audio Development Board User's Guide (DS50002902) • IS2083 SDK User Guide (DS50002894) • BM83 Host MCU Firmware Development Guide (DS50002896) • IS2083 Bluetooth® Audio Application Design Guide (DS00003118) • IS2083 SDK Debugger User’s Guide (DS50002892) • IS2083 Reference Design Application Note • Introduction to DSP Configuration Tool and AEC Tuning Guide (AN2432) • AN233 Solder Reflow Recommendation Application Note (DS00233)
Note:
1. For a complete list of development support tools and documents, visit: – http://www.microchip.com/BM83 – https://www.microchip.com/IS2083 2. Contact your local sales representative for more information about the Software Development Kit (SDK).
1.2 Design Packages
For reference schematics, refer to https://www.microchip.com/wwwproducts/en/BM83.
1.3 Acronyms/Abbreviations Table 1-1. Acronyms/Abbreviations Acronyms/Abbreviations Description
A2DP Advanced Audio Distribution Profile AAC Advanced Audio Codec ADC Analog-to-Digital Converter AEC Acoustic Echo Cancellation AFH Adaptive Frequency Hopping ANCS Apple Notification Center Service API Application Programming Interfaces AVRCP Audio/Video Remote Control Profile AW Audio Widening BDR Basic Data Rate BER Bit Error Rate BLE Bluetooth Low Energy BOM Bill of Materials BPF Band Pass Filter BR Basic Rate © 2019 Microchip Technology Inc.
Datasheet
DS70005402B-page 6 Document Outline Introduction Features Table of Contents 1. Quick References 1.1. Reference Documentation 1.2. Design Packages 1.3. Acronyms/Abbreviations 2. Device Overview 2.1. BM83 Module Pin Diagram 2.2. BM83 Module Pin Description 3. Audio Subsystem 3.1. Digital Signal Processor 3.2. Codec 3.2.1. DAC Performance 3.2.2. ADC Performance 3.3. Auxiliary Port 3.4. Analog Speaker Output 3.5. Microphone Inputs 4. Bluetooth Transceiver 4.1. Transmitter 4.2. Receiver 4.3. Synthesizer 4.4. Modulator-Demodulator 4.5. Adaptive Frequency Hopping 5. Power Management Unit 5.1. Power Supply 5.2. SAR ADC 5.3. LED Drivers 6. Application Information 6.1. Power On/Off Sequence 6.2. Reset 6.3. Configuring and Programming 6.3.1. Test Mode 6.3.2. 2-wire JTAG Program and Debug 6.3.2.1. Serial Program Clock (TCK_CPU) 6.3.2.2. Serial Program Data (TDI_CPU) 6.4. General Purpose I/O Pins 6.5. I2S Interface 6.6. Host MCU Interface Over UART 7. PCB Antenna Information 7.1. Antenna Radiation Pattern 7.2. Module Placement Guidelines 8. Physical Dimensions 9. Electrical Specifications 9.1. Timing Specifications 10. Soldering Recommendations 11. Ordering Information 12. Appendix A: Regulatory Approval 12.1. United States 12.1.1. Labeling and User Information Requirements 12.1.2. RF Exposure 12.1.3. Helpful Web Sites 12.2. Canada 12.2.1. Labeling and User Information Requirements 12.2.2. RF Exposure 12.2.3. Helpful Web Sites 12.3. Europe 12.3.1. Labeling and User Information Requirements 12.3.2. Conformity Assessment 12.3.2.1. Simplified EU Declaration of Conformity 12.3.3. Helpful Websites 12.4. Japan 12.4.1. Labeling and User Information Requirements 12.4.2. Helpful Web Sites 12.5. Korea 12.5.1. Labeling and User Information Requirements 12.5.2. Helpful Websites 12.6. Taiwan 12.6.1. Labeling and User Information Requirements 12.6.2. Helpful Web Sites 12.7. China 12.7.1. Labeling and User Information Requirements 12.8. Other Regulatory Information 13. Document Revision History The Microchip Website Product Change Notification Service Customer Support Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Worldwide Sales and Service
