Datasheet TB67B000HG (Toshiba) - 7
| Manufacturer | Toshiba |
| Description | Bi-CMOS Power Integrated Circuit Multi-Chip Package (MCP). High voltage 3-Phase Full-Wave Sine-Wave PWM Brushless Motor Driver |
| Pages / Page | 32 / 7 — Absolute Maximum Ratings (Ta = 25°C). Operating conditions (Ta = 25°C) |
| File Format / Size | PDF / 464 Kb |
| Document Language | English |
Absolute Maximum Ratings (Ta = 25°C). Operating conditions (Ta = 25°C)
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Text Version of Document
TB67B000HG
Absolute Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit VBB 500 Power supply voltage V VCC 18 −0.3 to V V CC in (1) (Note 1) Input voltage V Vin (2) −0.3 to Vrefout +0.3 (Note 2) Output current (DC) IOUT 2 A Output current (pulse 1ms) IOUTP 3 A (Note 3) Vreg current Ireg 30 mA Vrefout current Irefout 35 mA 35 Power dissipation PD W (Note 4) Operating temperature Topr −30 to 115 °C (Note 5) Strage temperature Tstg −55 to 150 °C Note: The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating (s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion.Please use the TB67B000HG within the specified operating ranges. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Vin (1) pin: VSP and LA Note 2: Vin (2) pin: HUP, HUM, HVP, HVM, HWP, HWM, SS, FGC, CW/CCW, and Idc. Note 3: Apply pulse Note 4: Package thermal resistance (θ j-c = 1 °C/W) with an infinite heat sink at Ta = 25°C Note 5: The operating temperature range is determined according to the PD MAX − Ta characteristics.
Operating conditions (Ta = 25°C)
Characteristics Symbol Min Typ. Max Unit VBB 50 280 450 Power supply voltage V VCC 13.5 15 16.5 Oscillation frequency FOSC 3.5 5 6.4 MHz Output current Iout ― ― 2 A 115 Operating temperature Topr −30 °C (Note 6) ― (Note 6) Note 6: The operating temperature range is determined according to the PD MAX − Ta characteristics. 7 2013-5-9 Document Outline TOSHIBA Bi-CMOS Power Integrated Circuit Multi-Chip Package (MCP) Features Block Diagram Pin Assignment Pin Description Absolute Maximum Ratings (Ta = 25°C) Operating conditions (Ta = 25°C) Package Power Dissipation Electrical Characteristics (Ta = 25°C) Functional Description Timing Chart of FG Signal Timing Chart 1: Output waveform of sine-wave PWM drive Timing Chart 2: Output waveform of sine-wave PWM drive Timing Chart 3: Output waveform of wide-angle commutation Timing Chart 4: Output waveform of wide-angle commutation Timing Chart 5: Output waveform of square-wave drive Timing Chart 6: Output waveform of square-wave drive Timing Chart 7: Output waveform of square-wave drive Timing Chart 8: Output waveform of square-wave drive Application Circuit External Parts Package Dimensions
Absolute Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit VBB 500 Power supply voltage V VCC 18 −0.3 to V V CC in (1) (Note 1) Input voltage V Vin (2) −0.3 to Vrefout +0.3 (Note 2) Output current (DC) IOUT 2 A Output current (pulse 1ms) IOUTP 3 A (Note 3) Vreg current Ireg 30 mA Vrefout current Irefout 35 mA 35 Power dissipation PD W (Note 4) Operating temperature Topr −30 to 115 °C (Note 5) Strage temperature Tstg −55 to 150 °C Note: The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating (s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion.Please use the TB67B000HG within the specified operating ranges. Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Vin (1) pin: VSP and LA Note 2: Vin (2) pin: HUP, HUM, HVP, HVM, HWP, HWM, SS, FGC, CW/CCW, and Idc. Note 3: Apply pulse Note 4: Package thermal resistance (θ j-c = 1 °C/W) with an infinite heat sink at Ta = 25°C Note 5: The operating temperature range is determined according to the PD MAX − Ta characteristics.
Operating conditions (Ta = 25°C)
Characteristics Symbol Min Typ. Max Unit VBB 50 280 450 Power supply voltage V VCC 13.5 15 16.5 Oscillation frequency FOSC 3.5 5 6.4 MHz Output current Iout ― ― 2 A 115 Operating temperature Topr −30 °C (Note 6) ― (Note 6) Note 6: The operating temperature range is determined according to the PD MAX − Ta characteristics. 7 2013-5-9 Document Outline TOSHIBA Bi-CMOS Power Integrated Circuit Multi-Chip Package (MCP) Features Block Diagram Pin Assignment Pin Description Absolute Maximum Ratings (Ta = 25°C) Operating conditions (Ta = 25°C) Package Power Dissipation Electrical Characteristics (Ta = 25°C) Functional Description Timing Chart of FG Signal Timing Chart 1: Output waveform of sine-wave PWM drive Timing Chart 2: Output waveform of sine-wave PWM drive Timing Chart 3: Output waveform of wide-angle commutation Timing Chart 4: Output waveform of wide-angle commutation Timing Chart 5: Output waveform of square-wave drive Timing Chart 6: Output waveform of square-wave drive Timing Chart 7: Output waveform of square-wave drive Timing Chart 8: Output waveform of square-wave drive Application Circuit External Parts Package Dimensions
