Datasheet MIC920 (Microchip) - 9
| Manufacturer | Microchip |
| Description | 80 MHz Low-Power SC70 Op Amp |
| Pages / Page | 24 / 9 — MIC920. FIGURE 2-19:. FIGURE 2-22:. FIGURE 2-20:. FIGURE 2-23:. FIGURE … |
| File Format / Size | PDF / 3.3 Mb |
| Document Language | English |
MIC920. FIGURE 2-19:. FIGURE 2-22:. FIGURE 2-20:. FIGURE 2-23:. FIGURE 2-21:. FIGURE 2-24:
Model Line for this Datasheet
Text Version of Document
MIC920
50 90 55 V 40 r = r9V Vr = r9V ) 80 B 30 z 50 d( H 70 q) 20 M N ( I 121pF ( 45 A H 60 N 10 50pF I G 1.7pF T G D Phase Margin P 40 0 I 50 R 1000pF O W A O -10 471pF D 40 M L 35 - 200pF N E N -20 A 30 S E B 30 A P -30 N H I 20 Gain O P A Bandwidth -40 G 10 25 -50 0 20 1x106 1M 10x106 10M 100x106 200x106 100M 0 200 400 600 800 1000 FREQUENCY (Hz) CAPACITIVE LOAD (pF)
FIGURE 2-19:
Open-Loop Gain vs.
FIGURE 2-22:
Gain Bandwidth and Phase Frequency. Margin vs. Load. 85 37 100 225 Phase Margin Vr = r5V ) 80 180 z 80 ) H 35 B 60 100: d 135 M q) ( q) ( 75 H 40 Phase 90 H 33 NI NI T T G No Load G D D 70 20 45 I R I R W 31 A W 0 Gain 0 A D M D M 65 100: N E N -20 -45 E A S A S B 29 B 60 A -40 -90 A N H N H I P I P A A -60 -135 55 27 G G -80 -180 Gain Bandwidth 50 25 0 1 2 3 4 5 6 7 8 9 10 -100 -225 100k 1M 10M 100M SUPPLY VOLTAGE (rV) CAPACITIVE LOAD (pF)
FIGURE 2-20:
Gain Bandwidth and Phase
FIGURE 2-23:
Open-Loop Frequency Margin vs. Supply Voltage. Response. 70 50 Vr = r5V 100 225 ) z 60 Vr = r9V H 45 80 180 M q) ( 50 B 60 100: d 135 H 40 NI ( (q) T G H 40 Phase 90 D 40 N I Phase Margin R T I No Load G W 35 A D 20 I 45 R D M 30 W A N E 0 D Gain 0 A S M N 100: B 30 -20 -45 E 20 A A S N H B I Gain P -40 -90 A A Bandwidth N H 10 25 I G A -60 -135 P G 0 20 -80 -180 0 200 400 600 800 1000 -100 -225 CAPACITIVE LOAD (pF) 100k 1M 10M 100M CAPACITIVE LOAD (pF)
FIGURE 2-21:
Gain Bandwidth and Phase
FIGURE 2-24:
Open-Loop Frequency Margin vs. Load. Response. 2019 Microchip Technology Inc. DS20006268A-page 9 Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves 3.0 Test Circuits 4.0 Pin Descriptions 5.0 Application Information 5.1 Driving High Capacitance 5.2 Feedback Resistor Selection 5.3 Layout Considerations 5.4 Power Supply Bypassing 5.5 Thermal Considerations 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Worldwide Sales and Service
50 90 55 V 40 r = r9V Vr = r9V ) 80 B 30 z 50 d( H 70 q) 20 M N ( I 121pF ( 45 A H 60 N 10 50pF I G 1.7pF T G D Phase Margin P 40 0 I 50 R 1000pF O W A O -10 471pF D 40 M L 35 - 200pF N E N -20 A 30 S E B 30 A P -30 N H I 20 Gain O P A Bandwidth -40 G 10 25 -50 0 20 1x106 1M 10x106 10M 100x106 200x106 100M 0 200 400 600 800 1000 FREQUENCY (Hz) CAPACITIVE LOAD (pF)
FIGURE 2-19:
Open-Loop Gain vs.
FIGURE 2-22:
Gain Bandwidth and Phase Frequency. Margin vs. Load. 85 37 100 225 Phase Margin Vr = r5V ) 80 180 z 80 ) H 35 B 60 100: d 135 M q) ( q) ( 75 H 40 Phase 90 H 33 NI NI T T G No Load G D D 70 20 45 I R I R W 31 A W 0 Gain 0 A D M D M 65 100: N E N -20 -45 E A S A S B 29 B 60 A -40 -90 A N H N H I P I P A A -60 -135 55 27 G G -80 -180 Gain Bandwidth 50 25 0 1 2 3 4 5 6 7 8 9 10 -100 -225 100k 1M 10M 100M SUPPLY VOLTAGE (rV) CAPACITIVE LOAD (pF)
FIGURE 2-20:
Gain Bandwidth and Phase
FIGURE 2-23:
Open-Loop Frequency Margin vs. Supply Voltage. Response. 70 50 Vr = r5V 100 225 ) z 60 Vr = r9V H 45 80 180 M q) ( 50 B 60 100: d 135 H 40 NI ( (q) T G H 40 Phase 90 D 40 N I Phase Margin R T I No Load G W 35 A D 20 I 45 R D M 30 W A N E 0 D Gain 0 A S M N 100: B 30 -20 -45 E 20 A A S N H B I Gain P -40 -90 A A Bandwidth N H 10 25 I G A -60 -135 P G 0 20 -80 -180 0 200 400 600 800 1000 -100 -225 CAPACITIVE LOAD (pF) 100k 1M 10M 100M CAPACITIVE LOAD (pF)
FIGURE 2-21:
Gain Bandwidth and Phase
FIGURE 2-24:
Open-Loop Frequency Margin vs. Load. Response. 2019 Microchip Technology Inc. DS20006268A-page 9 Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves 3.0 Test Circuits 4.0 Pin Descriptions 5.0 Application Information 5.1 Driving High Capacitance 5.2 Feedback Resistor Selection 5.3 Layout Considerations 5.4 Power Supply Bypassing 5.5 Thermal Considerations 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Worldwide Sales and Service
