Datasheet PCMFxUSB3BA/C (Nexperia) - 3
| Manufacturer | Nexperia |
| Description | Common-mode EMI filter for differential channels with integrated bidirectional ESD protection |
| Pages / Page | 15 / 3 — Nexperia. PCMFxUSB3BA/C series |
| Revision | 14082019 |
| File Format / Size | PDF / 857 Kb |
| Document Language | English |
Nexperia. PCMFxUSB3BA/C series
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Nexperia PCMFxUSB3BA/C series Common-mode EMI filter for differential channels with integrated bidirectional ESD protection 5. Ordering information Table 3. Ordering information Type number Package Name Description
PCMF1USB3BA/C WLCSP5 wafer level chip-size package; 5 bumps (2-1-2) PCMF2USB3BA/C WLCSP10 wafer level chip-size package; 10 bumps (4-2-4) PCMF3USB3BA/C WLCSP15 wafer level chip-size package; 15 bumps (6-3-6)
6. Marking Table 4. Marking codes Type number Marking code
PCMF1USB3BA/C PF1A PCMF2USB3BA/C PF2A PCMF3USB3BA/C PF3A
7. Limiting values Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VI input voltage -4 4 V VESD electrostatic discharge IEC 61000-4-2, level 4;all voltage input pins to ground • contact discharge -15 15 kV • air discharge -15 15 kV IEC 61000-4-2, level 4;all output pins to ground • contact discharge -2 2 kV • air discharge -2 2 kV IPPM rated peak-pulse tp = 8/20 μs -7.5 7.5 A current Tstg storage temperature -40 +125 °C Tamb ambient temperature -40 +125 °C PCMFXUSB3BA_C_SER All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2019. Al rights reserved
Product data sheet Rev. 2 — 14 August 2019 3 / 15
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Pinning information 5. Ordering information 6. Marking 7. Limiting values 8. Characteristics 8.1. Channel characteristics 8.2. Frequency characteristics 9. Application information 10. Package outline 11. Soldering 12. Revision history Contents
PCMF1USB3BA/C WLCSP5 wafer level chip-size package; 5 bumps (2-1-2) PCMF2USB3BA/C WLCSP10 wafer level chip-size package; 10 bumps (4-2-4) PCMF3USB3BA/C WLCSP15 wafer level chip-size package; 15 bumps (6-3-6)
6. Marking Table 4. Marking codes Type number Marking code
PCMF1USB3BA/C PF1A PCMF2USB3BA/C PF2A PCMF3USB3BA/C PF3A
7. Limiting values Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VI input voltage -4 4 V VESD electrostatic discharge IEC 61000-4-2, level 4;all voltage input pins to ground • contact discharge -15 15 kV • air discharge -15 15 kV IEC 61000-4-2, level 4;all output pins to ground • contact discharge -2 2 kV • air discharge -2 2 kV IPPM rated peak-pulse tp = 8/20 μs -7.5 7.5 A current Tstg storage temperature -40 +125 °C Tamb ambient temperature -40 +125 °C PCMFXUSB3BA_C_SER All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2019. Al rights reserved
Product data sheet Rev. 2 — 14 August 2019 3 / 15
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Pinning information 5. Ordering information 6. Marking 7. Limiting values 8. Characteristics 8.1. Channel characteristics 8.2. Frequency characteristics 9. Application information 10. Package outline 11. Soldering 12. Revision history Contents
