Datasheet XCL303, XCL304 (Torex) - 3
| Manufacturer | Torex |
| Description | Inductor Built-in Negative Output Voltage “micro DC/DC” Converters |
| Pages / Page | 24 / 3 — XC9140. XCL303/XCL304. Series |
| File Format / Size | PDF / 791 Kb |
| Document Language | English |
XC9140. XCL303/XCL304. Series
Model Line for this Datasheet
Text Version of Document
XC9140
(De
XCL303/XCL304 Series
■PIN CONFIGURATION L1 7 VIN 6 1 L X GND 5 2 FB 3 V CE 4 REF 8 L2 (BOTTOM VIEW) * The dissipation pad should be solder-plated in recommended mount pattern and metal masking to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the GND (No. 5) pin. ■PIN ASSIGNMENT PIN NUMBER PIN NAME FUNCTIONS CL-2025-02 1 LX Switching Output 2 FB Feedback Voltage 3 VREF Reference Voltage 4 CE Chip Enable 5 GND Ground 6 VIN Power Input 7 L1 Inductor Electrodes 8 L2 Inductor Electrodes ■ FUNCTION PIN NAME SIGNAL STATUS H Operation CE L Stand-by * Please do not leave the CE pin open. ■ABSOLUTE MAXIMUM RATINGS Ta=25˚C PARAMETER SYMBOL RATINGS UNITS VIN Pin Voltage VIN -0.3 ~ +6.2 V LX Pin Voltage VLX VIN-13.0 ~ VIN+0.3 or +6.2 (*1) V FB Pin Voltage VFB -0.3 ~ VIN+0.3 or +6.2 (*1) V VREF Pin Current IREF -1.0 ~ +1.0 (*3) mA VREF Pin Voltage VREF -0.3 ~ VIN+0.3 or +6.2 (*1) V CE Pin Voltage VCE -0.3 ~ +6.2 V Power Dissipation Pd 1000 (40mm x 40mm Standard board) (*2) mW Operating Ambient Temperature Topr -40 ~ +105 ˚C Storage Temperature Tstg -55 ~ +125 ˚C * All voltages are described based on the GND pin. (*1) The maximum value should be either VIN+0.3V or +6.2V in the lowest. (*2) The power dissipation figure shown is PCB mounted and is for reference only. The mounting condition is please refer to PACKAGING INFORMATION. (*3) Please do not apply voltage to the VREF pin from outside. 3/24
(De
XCL303/XCL304 Series
■PIN CONFIGURATION L1 7 VIN 6 1 L X GND 5 2 FB 3 V CE 4 REF 8 L2 (BOTTOM VIEW) * The dissipation pad should be solder-plated in recommended mount pattern and metal masking to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the GND (No. 5) pin. ■PIN ASSIGNMENT PIN NUMBER PIN NAME FUNCTIONS CL-2025-02 1 LX Switching Output 2 FB Feedback Voltage 3 VREF Reference Voltage 4 CE Chip Enable 5 GND Ground 6 VIN Power Input 7 L1 Inductor Electrodes 8 L2 Inductor Electrodes ■ FUNCTION PIN NAME SIGNAL STATUS H Operation CE L Stand-by * Please do not leave the CE pin open. ■ABSOLUTE MAXIMUM RATINGS Ta=25˚C PARAMETER SYMBOL RATINGS UNITS VIN Pin Voltage VIN -0.3 ~ +6.2 V LX Pin Voltage VLX VIN-13.0 ~ VIN+0.3 or +6.2 (*1) V FB Pin Voltage VFB -0.3 ~ VIN+0.3 or +6.2 (*1) V VREF Pin Current IREF -1.0 ~ +1.0 (*3) mA VREF Pin Voltage VREF -0.3 ~ VIN+0.3 or +6.2 (*1) V CE Pin Voltage VCE -0.3 ~ +6.2 V Power Dissipation Pd 1000 (40mm x 40mm Standard board) (*2) mW Operating Ambient Temperature Topr -40 ~ +105 ˚C Storage Temperature Tstg -55 ~ +125 ˚C * All voltages are described based on the GND pin. (*1) The maximum value should be either VIN+0.3V or +6.2V in the lowest. (*2) The power dissipation figure shown is PCB mounted and is for reference only. The mounting condition is please refer to PACKAGING INFORMATION. (*3) Please do not apply voltage to the VREF pin from outside. 3/24
