Datasheet BC817DPN (Nexperia) - 6
| Manufacturer | Nexperia |
| Description | NPN/PNP general purpose transistor |
| Pages / Page | 9 / 6 — Nexperia. BC817DPN. NPN/PNP general purpose transistor. 13. Soldering |
| Revision | 27112019 |
| File Format / Size | PDF / 223 Kb |
| Document Language | English |
Nexperia. BC817DPN. NPN/PNP general purpose transistor. 13. Soldering
Model Line for this Datasheet
Text Version of Document
Nexperia BC817DPN NPN/PNP general purpose transistor 13. Soldering
3.45 1.95 0.45 0.55 solder lands 0.95 (6×) (6×) 3.3 2.825 solder resist 0.95 solder paste occupied area 0.7 Dimensions in mm (6×) 0.8 (6×) 2.4 sot457_fr
Fig. 10. Reflow soldering footprint for SC-74; TSOP6 (SOT457)
5.3 1.5 (4×) solder lands 1.475 solder resist 5.05 0.45 (2×) occupied area 1.475 Dimensions in mm preferred transport direction during soldering 1.45 (6×) 2.85 sot457_fw
Fig. 11. Wave soldering footprint for SC-74; TSOP6 (SOT457)
BC817DPN All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2019. Al rights reserved
Product data sheet 27 November 2019 6 / 9
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Test information 12. Package outline 13. Soldering 14. Revision history 15. Legal information Contents
3.45 1.95 0.45 0.55 solder lands 0.95 (6×) (6×) 3.3 2.825 solder resist 0.95 solder paste occupied area 0.7 Dimensions in mm (6×) 0.8 (6×) 2.4 sot457_fr
Fig. 10. Reflow soldering footprint for SC-74; TSOP6 (SOT457)
5.3 1.5 (4×) solder lands 1.475 solder resist 5.05 0.45 (2×) occupied area 1.475 Dimensions in mm preferred transport direction during soldering 1.45 (6×) 2.85 sot457_fw
Fig. 11. Wave soldering footprint for SC-74; TSOP6 (SOT457)
BC817DPN All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2019. Al rights reserved
Product data sheet 27 November 2019 6 / 9
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Test information 12. Package outline 13. Soldering 14. Revision history 15. Legal information Contents
