Datasheet T5808 (TDK)
| Manufacturer | TDK |
| Description | Bottom-Port SoundWire Digital Multi-Mode Microphone |
| Pages / Page | 41 / 1 — T5808. GENERAL DESCRIPTION. APPLICATIONS. FEATURES. SPEC. HIGH QUALITY … |
| File Format / Size | PDF / 1.6 Mb |
| Document Language | English |
T5808. GENERAL DESCRIPTION. APPLICATIONS. FEATURES. SPEC. HIGH QUALITY MODE. LOW POWER LISTEN. MODE. Sensitivity. SNR. Current. AOP
Model Line for this Datasheet
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T5808
Bottom-Port SoundWire® Digital Multi-Mode Microphone
GENERAL DESCRIPTION APPLICATIONS
• The T5808 is a multi-mode, low noise digital MEMS Smartphones • Microphone Arrays microphone in a small package. The T5808 consists of a • Smart Speakers MEMS microphone element and an impedance converter • Headsets amplifier followed by a fourth-order Σ-Δ modulator. The digital • Tablets and Notebook PCs interface is a MIPI Alliance SoundWire® compliant interface which allows bi-directional data flow.
FEATURES SPEC HIGH QUALITY MODE LOW POWER LISTEN
The T5808 has multiple modes of operation: High Quality,
MODE
Low Power Listen (Always-On), Concurrent and Idle (sleep).
Sensitivity
−41 dB FS ±1 dB −26 dB FS ±1 dB The T5808 has high SNR and high AOP in all operational
SNR
66 dBA 62 dBA modes.
Current
650 µA 215 µA
AOP
135 dB SPL 120 dB SPL The T5808 is available in a standard 3.5 × 2.65 × 0.98 mm
Microphone Data
2.4 Mbps or 3.072 Mbps1 0.6 Mbps or 0.768 Mbps1 surface-mount package. It is reflow solder compatible with
Rate
no sensitivity degradation.
SoundWire Bus
Integer Multiple of Microphone data rate up to 9.6 MHz or
Clock Frequency
12.288 MHz
Note 1:
Acoustic performance for 2.4MHz, 0.768MHz • 3.5 × 2.65 × 0.98 mm surface-mount package • Extended frequency response from 40 Hz to 20 kHz • Low power: 215 µA in Low Power Listen Mode • Sleep (ClockStop) Mode: 9 µA • MIPI Alliance SoundWire Slave v1.1 compliant • IDSEL pin for multi-microphone enumeration (up to 7 devices) • Compatible with Sn/Pb and Pb-free solder processes • RoHS/WEEE compliant
FUNCTIONAL BLOCK DIAGRAM ORDERING INFORMATION PART TEMP RANGE PACKAGING MMICT5808-00-12
−40°C to +85°C 13” Tape and Reel
TDK Corporation
TDK, Inc. reserves the right to change the detail 1745 Technology Drive, San Jose, CA 95110 U.S.A Document Number: DS-000269 specifications as may be required to permit +1(408) 988–7339 Revision: 1.1 improvements in the design of its products. www.tdk.com Release Date: 1/2/2020
Bottom-Port SoundWire® Digital Multi-Mode Microphone
GENERAL DESCRIPTION APPLICATIONS
• The T5808 is a multi-mode, low noise digital MEMS Smartphones • Microphone Arrays microphone in a small package. The T5808 consists of a • Smart Speakers MEMS microphone element and an impedance converter • Headsets amplifier followed by a fourth-order Σ-Δ modulator. The digital • Tablets and Notebook PCs interface is a MIPI Alliance SoundWire® compliant interface which allows bi-directional data flow.
FEATURES SPEC HIGH QUALITY MODE LOW POWER LISTEN
The T5808 has multiple modes of operation: High Quality,
MODE
Low Power Listen (Always-On), Concurrent and Idle (sleep).
Sensitivity
−41 dB FS ±1 dB −26 dB FS ±1 dB The T5808 has high SNR and high AOP in all operational
SNR
66 dBA 62 dBA modes.
Current
650 µA 215 µA
AOP
135 dB SPL 120 dB SPL The T5808 is available in a standard 3.5 × 2.65 × 0.98 mm
Microphone Data
2.4 Mbps or 3.072 Mbps1 0.6 Mbps or 0.768 Mbps1 surface-mount package. It is reflow solder compatible with
Rate
no sensitivity degradation.
SoundWire Bus
Integer Multiple of Microphone data rate up to 9.6 MHz or
Clock Frequency
12.288 MHz
Note 1:
Acoustic performance for 2.4MHz, 0.768MHz • 3.5 × 2.65 × 0.98 mm surface-mount package • Extended frequency response from 40 Hz to 20 kHz • Low power: 215 µA in Low Power Listen Mode • Sleep (ClockStop) Mode: 9 µA • MIPI Alliance SoundWire Slave v1.1 compliant • IDSEL pin for multi-microphone enumeration (up to 7 devices) • Compatible with Sn/Pb and Pb-free solder processes • RoHS/WEEE compliant
FUNCTIONAL BLOCK DIAGRAM ORDERING INFORMATION PART TEMP RANGE PACKAGING MMICT5808-00-12
−40°C to +85°C 13” Tape and Reel
TDK Corporation
TDK, Inc. reserves the right to change the detail 1745 Technology Drive, San Jose, CA 95110 U.S.A Document Number: DS-000269 specifications as may be required to permit +1(408) 988–7339 Revision: 1.1 improvements in the design of its products. www.tdk.com Release Date: 1/2/2020
