Datasheet LT8653S (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | Dual Channel 2A, 42V, Synchronous Step-Down Silent Switcher 2 with 6.2μA Quiescent Current |
| Pages / Page | 30 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. … |
| File Format / Size | PDF / 2.2 Mb |
| Document Language | English |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. PART MARKING*. PACKAGE**. MSL. TEMPERATURE RANGE. PART NUMBER
Text Version of Document
LT8653S
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
V TOP VIEW IN, EN/UV, PG1, PG2 ...42V BIAS ..30V VC2 FB2 SS2 SS1 FB1 VC1 VC1, VC2, SS1, SS2, D0, D1 ...4V 16 15 14 13 12 11 FB1, FB2, SYNC. ..6V RT 17 10 BIAS Operating Junction Temperature Range (Note 2) EN/UV 18 21 9 VCC LT8653SE .. –40 to 125°C GND VIN 19 8 SW2 LT8653SI ... –40 to 125°C VIN 20 7 SW1 Storage Temperature Range ..–65 to 150°C Maximum Reflow (Package Body) Temperature ...260°C 1 2 3 4 5 6 D0 D1 PG2 PG1 SYNC LQFN PACKAGE CLKOUT 20-LEAD (4mm × 3mm × 0.94mm) TJMAX = 125°C, θJA = 28°C/W EXPOSED PAD (PIN 21 IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION PART MARKING* PACKAGE** MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LT8653SEV#PBF LQFN 3 –40°C to 125°C Au (RoHS) 8653SV e4 (Laminate Package with LT8653SIV#PBF QFN Footprint) 3 –40°C to 125°C
AUTOMOTIVE PRODUCTS*
LT8653SEV#WPBF LQFN 3 –40°C to 125°C Au (RoHS) 8653SV e4 (Laminate Package with LT8653SIV#WPBF QFN Footprint) 3 –40°C to 125°C • Consult Marketing for parts specified with wider operating • Recommended LGA and BGA PCB Assembly and Manufacturing Procedures temperature ranges. • LGA and BGA Package and Tray Drawings • *Pad or ball finish code is per IPC/JEDEC J-STD-609. **The LT8653S package has the same dimensions as a standard 4mm × 3mm QFN package
ELECTRICAL CHARACTERISTICS The
l
denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. PARAMETER CONDITIONS MIN TYP MAX UNITS
Minimum Input Voltage l 2.6 3 V VIN Quiescent Current in Shutdown VEN/UV = 0V, VSYNC = 0V 1.7 4 µA l 8 µA VIN + VCC Quiescent Current in Sleep VEN/UV = 2V, VFB1 = VFB2 > 0.8V, VVC1 = VVC2 = VCC, VSYNC = 0V 3.7 8 µA with Internal Compensation l 16 µA VIN + VCC Quiescent Current in Sleep VEN/UV = 2V, VFB1 = VFB2 > 0.8V, VVC1 = VVC2 = Float, VSYNC = 0V 95 160 µA with External Compensation l 180 µA VIN + VCC Quiescent Current VEN/UV = 2V, VFB1 = VFB2 > 0.8V, VVC1 = VVC2 = VCC, VSYNC = 3.4V 7 9 mA when Active VIN Current In Regulation VIN = 6V, VOUT = 0.8V, Output Load = 100µA 45 80 µA VIN = 6V, VOUT = 0.8V, Output Load = 1mA 350 500 µA Rev. 0 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Electrical Characteristics Pin Configuration Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Typical Application Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
V TOP VIEW IN, EN/UV, PG1, PG2 ...42V BIAS ..30V VC2 FB2 SS2 SS1 FB1 VC1 VC1, VC2, SS1, SS2, D0, D1 ...4V 16 15 14 13 12 11 FB1, FB2, SYNC. ..6V RT 17 10 BIAS Operating Junction Temperature Range (Note 2) EN/UV 18 21 9 VCC LT8653SE .. –40 to 125°C GND VIN 19 8 SW2 LT8653SI ... –40 to 125°C VIN 20 7 SW1 Storage Temperature Range ..–65 to 150°C Maximum Reflow (Package Body) Temperature ...260°C 1 2 3 4 5 6 D0 D1 PG2 PG1 SYNC LQFN PACKAGE CLKOUT 20-LEAD (4mm × 3mm × 0.94mm) TJMAX = 125°C, θJA = 28°C/W EXPOSED PAD (PIN 21 IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION PART MARKING* PACKAGE** MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LT8653SEV#PBF LQFN 3 –40°C to 125°C Au (RoHS) 8653SV e4 (Laminate Package with LT8653SIV#PBF QFN Footprint) 3 –40°C to 125°C
AUTOMOTIVE PRODUCTS*
LT8653SEV#WPBF LQFN 3 –40°C to 125°C Au (RoHS) 8653SV e4 (Laminate Package with LT8653SIV#WPBF QFN Footprint) 3 –40°C to 125°C • Consult Marketing for parts specified with wider operating • Recommended LGA and BGA PCB Assembly and Manufacturing Procedures temperature ranges. • LGA and BGA Package and Tray Drawings • *Pad or ball finish code is per IPC/JEDEC J-STD-609. **The LT8653S package has the same dimensions as a standard 4mm × 3mm QFN package
ELECTRICAL CHARACTERISTICS The
l
denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. PARAMETER CONDITIONS MIN TYP MAX UNITS
Minimum Input Voltage l 2.6 3 V VIN Quiescent Current in Shutdown VEN/UV = 0V, VSYNC = 0V 1.7 4 µA l 8 µA VIN + VCC Quiescent Current in Sleep VEN/UV = 2V, VFB1 = VFB2 > 0.8V, VVC1 = VVC2 = VCC, VSYNC = 0V 3.7 8 µA with Internal Compensation l 16 µA VIN + VCC Quiescent Current in Sleep VEN/UV = 2V, VFB1 = VFB2 > 0.8V, VVC1 = VVC2 = Float, VSYNC = 0V 95 160 µA with External Compensation l 180 µA VIN + VCC Quiescent Current VEN/UV = 2V, VFB1 = VFB2 > 0.8V, VVC1 = VVC2 = VCC, VSYNC = 3.4V 7 9 mA when Active VIN Current In Regulation VIN = 6V, VOUT = 0.8V, Output Load = 100µA 45 80 µA VIN = 6V, VOUT = 0.8V, Output Load = 1mA 350 500 µA Rev. 0 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Electrical Characteristics Pin Configuration Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Typical Application Related Parts
