Datasheet LTM8078 (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | Dual 1.4A, Single 2.8A Step-Down Silent Switcher μModule Regulator |
| Pages / Page | 24 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. … |
| File Format / Size | PDF / 1.7 Mb |
| Document Language | English |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. PART MARKING. PACKAGE. MSL. TEMPERATURE RANGE. PART NUMBER
Text Version of Document
LTM8078
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
VINn, RUN, PGn ..42V GND RT FB2 FB1 BIAS V 7 OUTn, BIAS ...10V BANK 2 FBn, OM, OMC, TRSSn, RT ..4V TRSS2 TRSS1 OM OMC VOUT2 6 SYNC ..6V RUN Maximum Internal Temperature (Note 2) .. 125°C 5 Storage Temperature ... –55°C to 125°C VIN2 BANK 3 Peak Solder Reflow Package Body Temperature ..260°C 4 V GND IN1 3 PG2 2 BANK 1 PG1 SYNC CLKOUT VOUT1 1 A B C D E F G BGA PACKAGE 49-PIN (6.25mm × 6.25mm × 2.22mm) TJMAX = 125°C, θJA = 31.3°C/W, θJCtop = 30.5°C/W, θJCbot = 10.6°C/W, WEIGHT = 0.23g θ VALUES DETERMINED PER JESD 51-9, 51-12
ORDER INFORMATION PART MARKING PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM8078EY#PBF SAC305 (RoHS) 8078 1 BGA 3 –40°C to 125°C LTM8078IY#PBF • Device temperature grade is indicated by a label on the shipping container. • This product is not recommended for second side reflow. • Pad or ball finish code is per IPC/JEDEC J-STD-609. This product is moisture sensitive. For more information, go to Recommended BGA PCB Assembly and Manufacturing Procedures. • BGA Package and Tray Drawings Rev. 0 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Application Package Description Package Photograph Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
VINn, RUN, PGn ..42V GND RT FB2 FB1 BIAS V 7 OUTn, BIAS ...10V BANK 2 FBn, OM, OMC, TRSSn, RT ..4V TRSS2 TRSS1 OM OMC VOUT2 6 SYNC ..6V RUN Maximum Internal Temperature (Note 2) .. 125°C 5 Storage Temperature ... –55°C to 125°C VIN2 BANK 3 Peak Solder Reflow Package Body Temperature ..260°C 4 V GND IN1 3 PG2 2 BANK 1 PG1 SYNC CLKOUT VOUT1 1 A B C D E F G BGA PACKAGE 49-PIN (6.25mm × 6.25mm × 2.22mm) TJMAX = 125°C, θJA = 31.3°C/W, θJCtop = 30.5°C/W, θJCbot = 10.6°C/W, WEIGHT = 0.23g θ VALUES DETERMINED PER JESD 51-9, 51-12
ORDER INFORMATION PART MARKING PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM8078EY#PBF SAC305 (RoHS) 8078 1 BGA 3 –40°C to 125°C LTM8078IY#PBF • Device temperature grade is indicated by a label on the shipping container. • This product is not recommended for second side reflow. • Pad or ball finish code is per IPC/JEDEC J-STD-609. This product is moisture sensitive. For more information, go to Recommended BGA PCB Assembly and Manufacturing Procedures. • BGA Package and Tray Drawings Rev. 0 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Application Package Description Package Photograph Related Parts
