Datasheet ADT7408 (Analog Devices) - 5

ManufacturerAnalog Devices
Description± 2°C Accurate, 12-Bit Digital Temperature Sensor
Pages / Page22 / 5 — Data Sheet. ADT7408. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter Rating. …
RevisionA
File Format / SizePDF / 445 Kb
Document LanguageEnglish

Data Sheet. ADT7408. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter Rating. 60 – 150 SECONDS. RAMP UP. 3°C/SECOND MAX. 260 – 5/+0°C. 217°C

Data Sheet ADT7408 ABSOLUTE MAXIMUM RATINGS Table 3 Parameter Rating 60 – 150 SECONDS RAMP UP 3°C/SECOND MAX 260 – 5/+0°C 217°C

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Data Sheet ADT7408 ABSOLUTE MAXIMUM RATINGS Table 3.
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
Parameter Rating
stress rating only; functional operation of the product at these VDD to VSS −0.3 V to +7 V or any other conditions above those indicated in the operational SDA Input Voltage to VSS −0.3 V to VDD + 0.3 V section of this specification is not implied. Operation beyond SDA Output Voltage to VSS −0.3 V to VDD + 0.3 V the maximum operating conditions for extended periods may SCL Input Voltage to VSS −0.3 V to VDD + 0.3 V affect product reliability. EVENT# Output Voltage to VSS −0.3 V to VDD + 0.3 V
60 – 150 SECONDS
Operating Temperature Range −55°C to +150°C
RAMP UP
Storage Temperature Range −65°C to +160°C
3°C/SECOND MAX
Maximum Junction Temperature, TJMAX 150°C
260 – 5/+0°C
Thermal Resistance1
217°C
θJA, Junction-to-Ambient (Still Air) 85°C/W
150°C – 200°C
IR Reflow Soldering Profile Refer to Figure 3
C) RAMP DOWN E (° 6°C/SECOND R MAX.
1
U
Power Dissipation PMAX = (TJMAX − TA)/θJA, where TA is the ambient
T
temperature. Thermal resistance value relates to the package being used on a standard 2-layer PCB, which gives a worst-case θ
PERA
JA. Some documents may
M
publish junction to case, thermal resistance θJC, but it refers to a component
E T TIME (Seconds)
that is mounted on an ideal heat sink. As a result, junction to ambient, thermal resistance is more practical for air cooled, PCB mounted components.
60 – 180 SECONDS 20 – 40 SECONDS
3 00
480 SECONDS MAX.
716- 05 Figure 3. LFCSP Pb-Free Reflow Profile Based on JEDEC J-STD-20C
ESD CAUTION
Rev. A | Page 5 of 22 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING CHARACTERISTICS TIMING DIAGRAM ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION CIRCUIT INFORMATION CONVERTER DETAILS MODES OF OPERATION REGISTERS ADDRESS POINTER REGISTER (WRITE ONLY) CAPABILITY REGISTER (READ ONLY) CONFIGURATION REGISTER (READ/WRITE) TEMPERATURE TRIP POINT REGISTERS Alarm Temperature Upper Boundary Trip Register (Read/Write) Alarm Temperature Lower Boundary Trip Register (Read/Write) Critical Temperature Trip Register (Read/Write) Temperature Value Register (Read Only) ID REGISTERS Manufacturer ID Register (Read Only) Device ID and Revision Register (Read Only) TEMPERATURE DATA FORMAT 12-Bit Temperature Data Format 10-Bit Temperature Data Format EVENT PIN FUNCTIONALITY Event Thresholds Alarm Window Trip Critical Trip Interrupt Mode Comparator Mode SERIAL INTERFACE Serial Bus Address SMBUS/I2C COMMUNICATIONS Writing Data to a Register Reading Data From the ADT7408 Writing to the Pointer Register for a Subsequent Read Reading from Any Pointer Register APPLICATIONS INFORMATION THERMAL RESPONSE TIME SELF-HEATING EFFECTS SUPPLY DECOUPLING TEMPERATURE MONITORING OUTLINE DIMENSIONS ORDERING GUIDE