Datasheet AD8222-KGD (Analog Devices) - 8
| Manufacturer | Analog Devices |
| Description | Precision, Dual-Channel Instrumentation Amplifier |
| Pages / Page | 8 / 8 — AD8222-KGD. Known Good Die. OUTLINE DIMENSIONS. 2.460. 1.094. 1.088. … |
| Revision | A |
| File Format / Size | PDF / 274 Kb |
| Document Language | English |
AD8222-KGD. Known Good Die. OUTLINE DIMENSIONS. 2.460. 1.094. 1.088. 0.3048. 0.702. 0.204. 0.076 × 0.076. (Pads 1-2A, 3B-5, 8-10A, 11B-16)
Model Line for this Datasheet
Text Version of Document
AD8222-KGD Known Good Die OUTLINE DIMENSIONS 2.460 1.094 1.094 1.088 1.088 0.3048 0.702 0.702 0.204 0.204 0.076 × 0.076 (Pads 1-2A, 3B-5, 8-10A, 11B-16) 16 15 14 13 1 12 1.012 2A 11B 0.859 1.011 0.859 2B 11A 1.011 0.675 0.675 0.431 0.431 2.365 0.429 0.43052 1.035 0.672 3A 10B 0.672 0.857 0.857 1.018 3B 10A 1.019 4 9 1.035 5 6 7 8 0.176 × 0.076 TOP VIEW SIDE VIEW (Pads 6-7) (CIRCUIT SIDE) 0.076 × 0.176 0.474 0.472 (Pads 2B-3A and 10B-11A) 0.763 0.763 1.088 1.088 A 1.096 1.096 2019- 09- 10-
Figure 3. 16-Pad Bare Die [CHIP] (C-16-3) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 5. Die Specifications Parameter Value Unit
Scribe Line Width 75 μm Die Size (Maximum Size) 2460 × 2365 μm Thickness 304.8 μm Bond Pads (Minimum Size) 76 × 76 μm Bond Pad Composition Aluminum (Al), copper (Cu), (0.5%) % Backside None1 Not applicable Passivation Doped oxide/silicon (Si), nitride (N) Not applicable ESD, Human Body Model (HBM) 2000 V 1 If connecting the backside to a voltage potential, tie the backside to the −VS pin. Otherwise, leave the backside floating.
Table 6. Assembly Recommendations Assembly Component Recommendation
Die Attach Ablestik 8290 conductive Bonding Method Gold ball or aluminum wedge Bonding Sequence Unspecified
ORDERING GUIDE Model1 Temperature Range Package Description Package Option
AD8222-KGD-WP −40°C to +85°C 16-Pad Bare Die [CHIP], Waffle Pack C-16-3 1 The AD8222-KGD-WP is an RoHS compliant part.
©2019–2020 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D20319-0-1/20(A)
Rev. A | Page 8 of 8 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications Absolute Maximum Ratings Maximum Power Dissipation ESD Caution Pin Configuration and Function Descriptions Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide
Figure 3. 16-Pad Bare Die [CHIP] (C-16-3) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 5. Die Specifications Parameter Value Unit
Scribe Line Width 75 μm Die Size (Maximum Size) 2460 × 2365 μm Thickness 304.8 μm Bond Pads (Minimum Size) 76 × 76 μm Bond Pad Composition Aluminum (Al), copper (Cu), (0.5%) % Backside None1 Not applicable Passivation Doped oxide/silicon (Si), nitride (N) Not applicable ESD, Human Body Model (HBM) 2000 V 1 If connecting the backside to a voltage potential, tie the backside to the −VS pin. Otherwise, leave the backside floating.
Table 6. Assembly Recommendations Assembly Component Recommendation
Die Attach Ablestik 8290 conductive Bonding Method Gold ball or aluminum wedge Bonding Sequence Unspecified
ORDERING GUIDE Model1 Temperature Range Package Description Package Option
AD8222-KGD-WP −40°C to +85°C 16-Pad Bare Die [CHIP], Waffle Pack C-16-3 1 The AD8222-KGD-WP is an RoHS compliant part.
©2019–2020 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D20319-0-1/20(A)
Rev. A | Page 8 of 8 Document Outline Features Applications General Description Functional Block Diagram Revision History Specifications Absolute Maximum Ratings Maximum Power Dissipation ESD Caution Pin Configuration and Function Descriptions Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide
