Datasheet ISM330DHCX (STMicroelectronics) - 10
Manufacturer | STMicroelectronics |
Description | iNEMO inertial module with Machine Learning Core |
Pages / Page | 167 / 10 — ISM330DHCX. Module specifications. 4.1. Mechanical characteristics. Table … |
File Format / Size | PDF / 2.6 Mb |
Document Language | English |
ISM330DHCX. Module specifications. 4.1. Mechanical characteristics. Table 2. Mechanical characteristics. Symbol. Parameter
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ISM330DHCX Module specifications 4 Module specifications 4.1 Mechanical characteristics
@ Vdd = 1.8 V, T = 25 °C, unless otherwise noted.
Table 2. Mechanical characteristics Symbol Parameter Test conditions Min.(1) Typ. (2) Max.(1) Unit
±2 ±4 LA_FS Linear acceleration measurement range g ±8 ±16 ±125 ±250 ±500 G_FS Angular rate measurement range dps ±1000 ±2000 ±4000 FS = ±2 g 0.061 FS = ±4 g 0.122 LA_So Linear acceleration sensitivity(3) -2% +2% mg/LSB FS = ±8 g 0.244 FS = ±16 g 0.488 FS = ±125 dps 4.375 FS = ±250 dps 8.75 FS = ±500 dps 17.50 G_So Angular rate sensitivity(3) -2% +2% mdps/LSB FS = ±1000 dps 35 FS = ±2000 dps 70 FS = ±4000 dps 140 LA_SoDr Linear acceleration sensitivity change vs. temperature(4) from -40 °C to +105 °C -0.01 ±0.005 +0.01 %/°C G_SoDr Angular rate sensitivity change vs. temperature(4) from -40 °C to +105 °C -0.015 ±0.007 +0.015 %/°C LA_TyOff Linear acceleration zero-g level offset accuracy(5) -65 ±10 +65 mg G_TyOff Angular rate zero-rate level(5) -3 ±1 +3 dps LA_TCOff Linear acceleration zero-g level change vs. temperature(4) -0.5 ±0.1 +0.5 mg/°C G_TCOff Angular rate typical zero-rate level change vs. temperature(4) -0.015 ±0.005 +0.015 dps/°C LA_Cx Linear acceleration cross-axis sensitivity T = 25 °C ±0.5 % G_Cx Angular rate cross-axis sensitivity T = 25 °C ±1 % Rn Rate noise density in high-performance mode(6) 5 8 mdps/√Hz ARW Angular random walk T = 25 °C 0.21 0.34 deg/√h BI Bias instability T = 25 °C 3 deg/h RnRMS Gyroscope RMS noise in low-power mode(7) 70 mdps
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Document Outline Features Applications Description 1 Overview 2 Embedded low-power features 2.1 Finite State Machine 2.2 Machine Learning Core 3 Pin description 3.1 Pin connections 4 Module specifications 4.1 Mechanical characteristics 4.2 Electrical characteristics 4.3 Temperature sensor characteristics 4.4 Communication interface characteristics 4.4.1 SPI - serial peripheral interface 4.4.2 I²C - inter-IC control interface 4.5 Absolute maximum ratings 4.6 Terminology 4.6.1 Sensitivity 4.6.2 Zero-g and zero-rate level 5 Digital interfaces 5.1 I²C/SPI interface 5.1.1 I²C serial interface 5.1.1.1 I²C operation 5.1.2 SPI bus interface 5.1.2.1 SPI read 5.1.2.2 SPI write 5.1.2.3 SPI read in 3-wire mode 5.2 Master I²C interface 5.3 Auxiliary SPI interface 6 Functionality 6.1 Operating modes 6.2 Gyroscope power modes 6.3 Accelerometer power modes 6.4 Block diagram of filters 6.4.1 Block diagrams of the accelerometer filters 6.4.2 Block diagrams of the gyroscope filters 6.5 FIFO 6.5.1 Bypass mode 6.5.2 FIFO mode 6.5.3 Continuous mode 6.5.4 Continuous-to-FIFO mode 6.5.5 Bypass-to-Continuous mode 6.5.6 Bypass-to-FIFO mode 6.5.7 FIFO reading procedure 7 Application hints 7.1 ISM330DHCX electrical connections in Mode 1 7.2 ISM330DHCX electrical connections in Mode 2 7.3 ISM330DHCX electrical connections in Mode 3 and Mode 4 8 Register mapping 9 Register description 9.1 FUNC_CFG_ACCESS (01h) 9.2 PIN_CTRL (02h) 9.3 FIFO_CTRL1 (07h) 9.4 FIFO_CTRL2 (08h) 9.5 FIFO_CTRL3 (09h) 9.6 FIFO_CTRL4 (0Ah) 9.7 COUNTER_BDR_REG1 (0Bh) 9.8 COUNTER_BDR_REG2 (0Ch) 9.9 INT1_CTRL (0Dh) 9.10 INT2_CTRL (0Eh) 9.11 WHO_AM_I (0Fh) 9.12 CTRL1_XL (10h) 9.13 CTRL2_G (11h) 9.14 CTRL3_C (12h) 9.15 CTRL4_C (13h) 9.16 CTRL5_C (14h) 9.17 CTRL6_C (15h) 9.18 CTRL7_G (16h) 9.19 CTRL8_XL (17h) 9.20 CTRL9_XL (18h) 9.21 CTRL10_C (19h) 9.22 ALL_INT_SRC (1A) 9.23 WAKE_UP_SRC (1Bh) 9.24 TAP_SRC (1Ch) 9.25 DRD_SRC (1Dh) 9.26 STATUS_REG (1Eh) / STATUS_SPIAux (1Eh) 9.27 OUT_TEMP_L (20h), OUT_TEMP_H (21h) 9.28 OUTX_L_G (22h) and OUTX_H_G (23h) 9.29 OUTY_L_G (24h) and OUTY_H_G (25h) 9.30 OUTZ_L_G (26h) and OUTZ_H_G (27h) 9.31 OUTX_L_A (28h) and OUTX_H_A (29h) 9.32 OUTY_L_A (2Ah) and OUTY_H_A (2Bh) 9.33 OUTZ_L_A (2Ch) and OUTZ_H_A (2Dh) 9.34 EMB_FUNC_STATUS_MAINPAGE (35h) 9.35 FSM_STATUS_A_MAINPAGE (36h) 9.36 FSM_STATUS_B_MAINPAGE (37h) 9.37 MLC_STATUS_MAINPAGE (38h) 9.38 STATUS_MASTER_MAINPAGE (39h) 9.39 FIFO_STATUS1 (3Ah) 9.40 FIFO_STATUS2 (3Bh) 9.41 TIMESTAMP0 (40h), TIMESTAMP1 (41h), TIMESTAMP2 (42h), and TIMESTAMP3 (43h) 9.42 TAP_CFG0 (56h) 9.43 TAP_CFG1 (57h) 9.44 TAP_CFG2 (58h) 9.45 TAP_THS_6D (59h) 9.46 INT_DUR2 (5Ah) 9.47 WAKE_UP_THS (5Bh) 9.48 WAKE_UP_DUR (5Ch) 9.49 FREE_FALL (5Dh) 9.50 MD1_CFG (5Eh) 9.51 MD2_CFG (5Fh) 9.52 INTERNAL_FREQ_FINE (63h) 9.53 INT_OIS (6Fh) 9.54 CTRL1_OIS (70h) 9.55 CTRL2_OIS (71h) 9.56 CTRL3_OIS (72h) 9.57 X_OFS_USR (73h) 9.58 Y_OFS_USR (74h) 9.59 Z_OFS_USR (75h) 9.60 FIFO_DATA_OUT_TAG (78h) 9.61 FIFO_DATA_OUT_X_L (79h) and FIFO_DATA_OUT_X_H (7Ah) 9.62 FIFO_DATA_OUT_Y_L (7Bh) and FIFO_DATA_OUT_Y_H (7Ch) 9.63 FIFO_DATA_OUT_Z_L (7Dh) and FIFO_DATA_OUT_Z_H (7Eh) 10 Embedded functions register mapping 11 Embedded functions register description 11.1 PAGE_SEL (02h) 11.2 EMB_FUNC_EN_A (04h) 11.3 EMB_FUNC_EN_B (05h) 11.4 PAGE_ADDRESS (08h) 11.5 PAGE_VALUE (09h) 11.6 EMB_FUNC_INT1 (0Ah) 11.7 FSM_INT1_A (0Bh) 11.8 FSM_INT1_B (0Ch) 11.9 MLC_INT1 (0Dh) 11.10 EMB_FUNC_INT2 (0Eh) 11.11 FSM_INT2_A (0Fh) 11.12 FSM_INT2_B (10h) 11.13 MLC_INT2 (11h) 11.14 EMB_FUNC_STATUS (12h) 11.15 FSM_STATUS_A (13h) 11.16 FSM_STATUS_B (14h) 11.17 MLC_STATUS (15h) 11.18 PAGE_RW (17h) 11.19 EMB_FUNC_FIFO_CFG (44h) 11.20 FSM_ENABLE_A (46h) 11.21 FSM_ENABLE_B (47h) 11.22 FSM_LONG_COUNTER_L (48h) and FSM_LONG_COUNTER_H (49h) 11.23 FSM_LONG_COUNTER_CLEAR (4Ah) 11.24 FSM_OUTS1 (4Ch) 11.25 FSM_OUTS2 (4Dh) 11.26 FSM_OUTS3 (4Eh) 11.27 FSM_OUTS4 (4Fh) 11.28 FSM_OUTS5 (50h) 11.29 FSM_OUTS6 (51h) 11.30 FSM_OUTS7 (52h) 11.31 FSM_OUTS8 (53h) 11.32 FSM_OUTS9 (54h) 11.33 FSM_OUTS10 (55h) 11.34 FSM_OUTS11 (56h) 11.35 FSM_OUTS12 (57h) 11.36 FSM_OUTS13 (58h) 11.37 FSM_OUTS14 (59h) 11.38 FSM_OUTS15 (5Ah) 11.39 FSM_OUTS16 (5Bh) 11.40 EMB_FUNC_ODR_CFG_B (5Fh) 11.41 EMB_FUNC_ODR_CFG_C (60h) 11.42 STEP_COUNTER_L (62h) and STEP_COUNTER_H (63h) 11.43 EMB_FUNC_SRC (64h) 11.44 EMB_FUNC_INIT_A (66h) 11.45 EMB_FUNC_INIT_B (67h) 11.46 MLC0_SRC (70h) 11.47 MLC1_SRC (71h) 11.48 MLC2_SRC (72h) 11.49 MLC3_SRC (73h) 11.50 MLC4_SRC (74h) 11.51 MLC5_SRC (75h) 11.52 MLC6_SRC (76h) 11.53 MLC7_SRC (77h) 12 Embedded advanced features pages 13 Embedded advanced features register description 13.1 Page 0 - Embedded advanced features registers 13.1.1 MAG_SENSITIVITY_L (BAh) and MAG_SENSITIVITY_H (BBh) 13.1.2 MAG_OFFX_L (C0h) and MAG_OFFX_H (C1h) 13.1.3 MAG_OFFY_L (C2h) and MAG_OFFY_H (C3h) 13.1.4 MAG_OFFZ_L (C4h) and MAG_OFFZ_H (C5h) 13.1.5 MAG_SI_XX_L (C6h) and MAG_SI_XX_H (C7h) 13.1.6 MAG_SI_XY_L (C8h) and MAG_SI_XY_H (C9h) 13.1.7 MAG_SI_XZ_L (CAh) and MAG_SI_XZ_H (CBh) 13.1.8 MAG_SI_YY_L (CCh) and MAG_SI_YY_H (CDh) 13.1.9 MAG_SI_YZ_L (CEh) and MAG_SI_YZ_H (CFh) 13.1.10 MAG_SI_ZZ_L (D0h) and MAG_SI_ZZ_H (D1h) 13.1.11 MAG_CFG_A (D4h) 13.1.12 MAG_CFG_B (D5h) 13.2 Page 1 - Embedded advanced features registers 13.2.1 FSM_LC_TIMEOUT_L (7Ah) and FSM_LC_TIMEOUT_H (7Bh) 13.2.2 FSM_PROGRAMS (7Ch) 13.2.3 FSM_START_ADD_L (7Eh) and FSM_START_ADD_H (7Fh) 13.2.4 PEDO_CMD_REG (83h) 13.2.5 PEDO_DEB_CONF (84h) 13.2.6 PEDO_SC_DELTAT_L (D0h) and PEDO_SC_DELTAT_H (D1h) 13.2.7 MLC_MAG_SENSITIVITY_L (E8h) and MLC_MAG_SENSITIVITY_H (E9h) 14 Sensor hub register mapping 15 Sensor hub register description 15.1 SENSOR_HUB_1 (02h) 15.2 SENSOR_HUB_2 (03h) 15.3 SENSOR_HUB_3 (04h) 15.4 SENSOR_HUB_4 (05h) 15.5 SENSOR_HUB_5 (06h) 15.6 SENSOR_HUB_6 (07h) 15.7 SENSOR_HUB_7 (08h) 15.8 SENSOR_HUB_8 (09h) 15.9 SENSOR_HUB_9 (0Ah) 15.10 SENSOR_HUB_10 (0Bh) 15.11 SENSOR_HUB_11 (0Ch) 15.12 SENSOR_HUB_12 (0Dh) 15.13 SENSOR_HUB_13 (0Eh) 15.14 SENSOR_HUB_14 (0Fh) 15.15 SENSOR_HUB_15 (10h) 15.16 SENSOR_HUB_16 (11h) 15.17 SENSOR_HUB_17 (12h) 15.18 SENSOR_HUB_18 (13h) 15.19 MASTER_CONFIG (14h) 15.20 SLV0_ADD (15h) 15.21 SLV0_SUBADD (16h) 15.22 SLAVE0_CONFIG (17h) 15.23 SLV1_ADD (18h) 15.24 SLV1_SUBADD (19h) 15.25 SLAVE1_CONFIG (1Ah) 15.26 SLV2_ADD (1Bh) 15.27 SLV2_SUBADD (1Ch) 15.28 SLAVE2_CONFIG (1Dh) 15.29 SLV3_ADD (1Eh) 15.30 SLV3_SUBADD (1Fh) 15.31 SLAVE3_CONFIG (20h) 15.32 DATAWRITE_SLV0 (21h) 15.33 STATUS_MASTER (22h) 16 Soldering information 17 Package information 17.1 LGA-14L package information 17.2 LGA-14 packing information Revision history Contents List of tables List of figures