Datasheet ES8311 (Everest Semiconductor) - 4

Everest Semiconductor Confidential ES8311 3. TYPICAL APPLICATION CIRCUIT
0R GND(SYS) AGND In the layout, chip is treated as a analog device AGND VA AGND AGND 1uF * 1uF 1uF 1uF AGND 14 * 15* 16* 10 21 11 0.1uF 0.1uF 4 VD * * DVDD 3 F F D D D VP PVDD E E ND R R MI V V V G P 5 AGN AVD 18 DGND MIC1P/DMIC_SDA MIC1P 1uF DAC ADC AGND2 17 MCLK MIC1N MIC1N 6 1uF SCLK/DMIC_SCL 8 LRCK MCU/DSP 7 ES8311 ASDOUT 9 13 DSDIN OUTN OUTN 1uF 1 12 CCLK OUTP OUTP 19 1uF CDATA 20 CE For the best performance,decoupling and filtering capacitors should be located as close to the device package as possible Additional parale capacitors(typical y 0.1 μF) can be used, larger value capacitors(typicaly 10 μF) would also help * Revision 7.0 4 January 2020 Latest datasheet: www.everest-semi.com or info@everest-semi.com Document Outline Block Diagram Pin Out and Description typical APPLICATION CIRCUIT Clock Modes and Sampling Frequencies Micro-controller configuration Interface Digital Audio Interface ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Recommended Operating Conditions ADC Analog and Filter Characteristics and Specifications DAC Analog and Filter Characteristics and Specifications DC Characteristics Serial Audio Port Switching Specifications I2C Switching Specifications (slow speed mode/high speed mode) Package CORPORATe INFORMATION