Datasheet HMC434-EP (Analog Devices) - 4
| Manufacturer | Analog Devices |
| Description | 0.2 GHz to 8 GHz, GaAs, HBT MMIC, Divide by 8 Prescaler |
| Pages / Page | 7 / 4 — HMC434-EP. Enhanced Product. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL … |
| Revision | B |
| File Format / Size | PDF / 208 Kb |
| Document Language | English |
HMC434-EP. Enhanced Product. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE. Parameter. Rating. Table 3. Thermal Resistance
Model Line for this Datasheet
Text Version of Document
HMC434-EP Enhanced Product ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board Supply Voltage (VCC) −0.3 V to +3.5 V (PCB) design and operating environment. Careful attention to RF Input Power (VCC = 3 V) 13 dBm PCB thermal design is required. Temperature θJA is the natural convection junction to ambient thermal Operating −55°C to +105°C resistance measured in a one cubic foot sealed enclosure. θJC is Storage −65°C to +125°C the junction to case thermal resistance. Junction, TJ 135°C Nominal (TA = 105°C) 119°C
Table 3. Thermal Resistance
Reflow 260°C
Package Type θ 1 2 JA θJC Unit
ESD Sensitivity RJ-6 359 70 °C/W Human Body Model (HBM) Class 0 1 Simulated values per JEDEC JESD51-12 standards. Stresses at or above those listed under Absolute Maximum 2 Junction to GND package pin. Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these
ESD CAUTION
or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 4 of 7 Document Outline Features Enhanced Product Features Applications Functional Block Diagram General Description Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Outline Dimensions Ordering Guide
Thermal performance is directly linked to printed circuit board Supply Voltage (VCC) −0.3 V to +3.5 V (PCB) design and operating environment. Careful attention to RF Input Power (VCC = 3 V) 13 dBm PCB thermal design is required. Temperature θJA is the natural convection junction to ambient thermal Operating −55°C to +105°C resistance measured in a one cubic foot sealed enclosure. θJC is Storage −65°C to +125°C the junction to case thermal resistance. Junction, TJ 135°C Nominal (TA = 105°C) 119°C
Table 3. Thermal Resistance
Reflow 260°C
Package Type θ 1 2 JA θJC Unit
ESD Sensitivity RJ-6 359 70 °C/W Human Body Model (HBM) Class 0 1 Simulated values per JEDEC JESD51-12 standards. Stresses at or above those listed under Absolute Maximum 2 Junction to GND package pin. Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these
ESD CAUTION
or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 4 of 7 Document Outline Features Enhanced Product Features Applications Functional Block Diagram General Description Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Outline Dimensions Ordering Guide
