Datasheet LTM4626 (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | 20VIN, 12A Step-Down DC/DC µModule Regulator |
| Pages / Page | 28 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). (See Pin … |
| Revision | B |
| File Format / Size | PDF / 1.9 Mb |
| Document Language | English |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). (See Pin Functions, Pin Configuration Table). ORDER INFORMATION
Model Line for this Datasheet
Text Version of Document
LTM4626
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) (See Pin Functions, Pin Configuration Table)
VIN ... –0.3V to 22V V TOP VIEW OUT ... –0.3V to 6V SW INTV T CC .. –0.3V to 3.6V SENSE– 7 RUN .. –0.3V to VIN T GND SENSE+ 6 PGOOD, FREQ, COMPa, COMPb, PGOOD V PHMODE, CLKOUT, FB .. –0.3V to 3.6V OUT 5 PHMODE RUN MODE/CLKIN, TRACK/SS ...–0.3V to INTVCC 4 VIN V + INTVCC OSNS ... –0.3V to 6V 3 VOUT V – VOSNS– MODE/CLKIN OSNS .. –0.3V to 0.3V 2 TRACK/SS Internal Operating Temperature Range VOSNS+ CLKOUT 1 (Notes 2, 5) .. –40°C to 125°C FB COMPb COMPa FREQ Storage Temperature Range .. –55°C to 125°C A B C D E F G Peak Solder Reflow Body Temperature ... 250°C BGA PACKAGE 49-LEAD (6.25mm × 6.25mm × 3.87mm) TJMAX = 125°C, θJCtop = 9.3°C/W, θJCbottom = 4.3°C/W, θJA = 16°C/W, NOTE: 1) θ VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS, WEIGHT 497mg 2) θJA VALUE IS OBTAINED WITH DEMO BOARD 3) REFER TO PAGES 19, 20 FOR LAB MEASUREMENT AND DE-RATING INFORMATION
ORDER INFORMATION PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (Note 2) DEVICE FINISH CODE
LTM4626EY#PBF SAC305 (RoHS) 4626 e1 BGA 3 –40°C to 125°C LTM4626IY#PBF SAC305 (RoHS) 4626 e1 BGA 3 –40°C to 125°C LTM4626IY SnPb 4626 e0 BGA 3 –40°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures container. Pad or ball finish code is per IPC/JEDEC J-STD-609. • LGA and BGA Package and Tray Drawings
ELECTRICAL CHARACTERISTICS The
l
denotes the specifications which apply over the specified internal operating temperature range (Note 2), otherwise specifications are at TA = 25°C. VIN = 12V per the typical application shown on the front page. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS Switching Regulator Section: per Channel
VIN Input DC Voltage VIN l 3.1 20 V VOUT Output Voltage Range l 0.6 5.5 V VOUT(DC) Output Voltage, Total CIN = 22µF, COUT = 100µF Ceramic, RFB = 40.2k, Variation with Line and Load VIN = 3.1V to 12V, IOUT = 0A to 12A (Note 3) (Note 6) –40°C to 125°C l 1.477 1.50 1.523 V VRUN RUN Pin On Threshold VRUN Rising 1.1 1.25 1.35 V Rev B 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Electrical Characteristics Pin Configuration Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Package Description Revision History Package Photo Design Resources Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1) (See Pin Functions, Pin Configuration Table)
VIN ... –0.3V to 22V V TOP VIEW OUT ... –0.3V to 6V SW INTV T CC .. –0.3V to 3.6V SENSE– 7 RUN .. –0.3V to VIN T GND SENSE+ 6 PGOOD, FREQ, COMPa, COMPb, PGOOD V PHMODE, CLKOUT, FB .. –0.3V to 3.6V OUT 5 PHMODE RUN MODE/CLKIN, TRACK/SS ...–0.3V to INTVCC 4 VIN V + INTVCC OSNS ... –0.3V to 6V 3 VOUT V – VOSNS– MODE/CLKIN OSNS .. –0.3V to 0.3V 2 TRACK/SS Internal Operating Temperature Range VOSNS+ CLKOUT 1 (Notes 2, 5) .. –40°C to 125°C FB COMPb COMPa FREQ Storage Temperature Range .. –55°C to 125°C A B C D E F G Peak Solder Reflow Body Temperature ... 250°C BGA PACKAGE 49-LEAD (6.25mm × 6.25mm × 3.87mm) TJMAX = 125°C, θJCtop = 9.3°C/W, θJCbottom = 4.3°C/W, θJA = 16°C/W, NOTE: 1) θ VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS, WEIGHT 497mg 2) θJA VALUE IS OBTAINED WITH DEMO BOARD 3) REFER TO PAGES 19, 20 FOR LAB MEASUREMENT AND DE-RATING INFORMATION
ORDER INFORMATION PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE MSL TEMPERATURE RANGE TYPE RATING (Note 2) DEVICE FINISH CODE
LTM4626EY#PBF SAC305 (RoHS) 4626 e1 BGA 3 –40°C to 125°C LTM4626IY#PBF SAC305 (RoHS) 4626 e1 BGA 3 –40°C to 125°C LTM4626IY SnPb 4626 e0 BGA 3 –40°C to 125°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures container. Pad or ball finish code is per IPC/JEDEC J-STD-609. • LGA and BGA Package and Tray Drawings
ELECTRICAL CHARACTERISTICS The
l
denotes the specifications which apply over the specified internal operating temperature range (Note 2), otherwise specifications are at TA = 25°C. VIN = 12V per the typical application shown on the front page. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS Switching Regulator Section: per Channel
VIN Input DC Voltage VIN l 3.1 20 V VOUT Output Voltage Range l 0.6 5.5 V VOUT(DC) Output Voltage, Total CIN = 22µF, COUT = 100µF Ceramic, RFB = 40.2k, Variation with Line and Load VIN = 3.1V to 12V, IOUT = 0A to 12A (Note 3) (Note 6) –40°C to 125°C l 1.477 1.50 1.523 V VRUN RUN Pin On Threshold VRUN Rising 1.1 1.25 1.35 V Rev B 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Electrical Characteristics Pin Configuration Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Package Description Revision History Package Photo Design Resources Related Parts
