Datasheet LTM8029 (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | 36VIN, 600mA Step-Down µModule Converter with 5µA Quiescent Current |
| Pages / Page | 22 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Notes 1, 2). ORDER … |
| Revision | E |
| File Format / Size | PDF / 1.0 Mb |
| Document Language | English |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Notes 1, 2). ORDER INFORMATION. PAD OR BALL. PART MARKING*. PART NUMBER. FINISH. DEVICE
Model Line for this Datasheet
Text Version of Document
LTM8029
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Notes 1, 2)
V TOP VIEW IN, RUN ..40V VOUT, BIAS ..20V V 5 IN V BANK 1 VOUT IN + BIAS ...55V 4 PGOOD , FB, RT ..6V BANK 3 3 BIAS Internal Operating Temperature Range (Note 2) FB PGOOD GND 2 E and I Grades ... –40ºC to 125°C RUN RT BANK 2 MP Grade ..–55ºC to 125ºC 1 Storage Temperature Range ...–65ºC to 150ºC A B C D E F G H Peak Solder Reflow Package Body Temperature ...260°C BGA PACKAGE 35-LEAD (11.25mm × 6.25mm × 3.42mm) TJMAX = 125°C, θJA = 13.8°C/W, θJCtop = 17.2°C/W, θJCbottom = 3.9°C/W, θJB = 9.0°C/W WEIGHT = 0.6g
ORDER INFORMATION PAD OR BALL PART MARKING* PART NUMBER FINISH DEVICE CODE PACKAGE TYPE MSL RATING TEMPERATURE RANGE (Note 2)
LTM8029EY#PBF SAC305 (RoHS) LTM8029Y e1 BGA 3 –40°C to 125°C LTM8029IY#PBF SAC305 (RoHS) LTM8029Y e1 BGA 3 –40°C to 125°C LTM8029IY SnPb (63/37) LTM8029Y e0 BGA 3 –40°C to 125°C LTM8029MPY#PBF SAC305 (RoHS) LTM8029Y e1 BGA 3 –55°C to 125°C LTM8029MPY SnPb (63/37) LTM8029Y e0 BGA 3 –55°C to 125°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • LGA and BGA Package and Tray Drawings Rev. E 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Application Package Description Revision History Package Photo Design Resources Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Notes 1, 2)
V TOP VIEW IN, RUN ..40V VOUT, BIAS ..20V V 5 IN V BANK 1 VOUT IN + BIAS ...55V 4 PGOOD , FB, RT ..6V BANK 3 3 BIAS Internal Operating Temperature Range (Note 2) FB PGOOD GND 2 E and I Grades ... –40ºC to 125°C RUN RT BANK 2 MP Grade ..–55ºC to 125ºC 1 Storage Temperature Range ...–65ºC to 150ºC A B C D E F G H Peak Solder Reflow Package Body Temperature ...260°C BGA PACKAGE 35-LEAD (11.25mm × 6.25mm × 3.42mm) TJMAX = 125°C, θJA = 13.8°C/W, θJCtop = 17.2°C/W, θJCbottom = 3.9°C/W, θJB = 9.0°C/W WEIGHT = 0.6g
ORDER INFORMATION PAD OR BALL PART MARKING* PART NUMBER FINISH DEVICE CODE PACKAGE TYPE MSL RATING TEMPERATURE RANGE (Note 2)
LTM8029EY#PBF SAC305 (RoHS) LTM8029Y e1 BGA 3 –40°C to 125°C LTM8029IY#PBF SAC305 (RoHS) LTM8029Y e1 BGA 3 –40°C to 125°C LTM8029IY SnPb (63/37) LTM8029Y e0 BGA 3 –40°C to 125°C LTM8029MPY#PBF SAC305 (RoHS) LTM8029Y e1 BGA 3 –55°C to 125°C LTM8029MPY SnPb (63/37) LTM8029Y e0 BGA 3 –55°C to 125°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • LGA and BGA Package and Tray Drawings Rev. E 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Application Package Description Revision History Package Photo Design Resources Related Parts
