Datasheet RN4870, RN4871 (Microchip) - 3
| Manufacturer | Microchip |
| Description | Bluetooth Low Energy Module |
| Pages / Page | 51 / 3 — RN4870/71. 1.0. DEVICE OVERVIEW. 1.1. Overview. TABLE 1-1:. RN4870/71 … |
| File Format / Size | PDF / 2.2 Mb |
| Document Language | English |
RN4870/71. 1.0. DEVICE OVERVIEW. 1.1. Overview. TABLE 1-1:. RN4870/71 FAMILY. Number of. Operating. Part Number(1). Antenna. Shielding
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RN4870/71 1.0 DEVICE OVERVIEW
Table 1-1 shows the various options for packaging and features available in the RN4870/71 family. Table 1-2
1.1 Overview
provides the description of the pin functions for all the modules in the RN4870/71 family. Figure 1-1 through The RN4870/71 BLE module integrates Bluetooth 5.0 Figure 1-4 show the pinout for the different modules. baseband controller, on-board Bluetooth stack, digital and analog I/O, and RF power amplifier into one solution.
TABLE 1-1: RN4870/71 FAMILY Number of Operating Part Number(1) Antenna Shielding Dimensions On-Board Pins Temperature Range
RN4870-V/RMXXX Yes Yes 33 12 mm x 22 mm -20°C to +70°C RN4870U-V/RMXXX No No 30 12 mm x 15 mm -20°C to +70°C RN4871-V/RMXXX Yes Yes 16 9 mm x 11.5 mm -20°C to +70°C RN4871U-V/RMXXX No No 17 6 mm x 8 mm -20°C to +70°C RN4870-I/RMXXX Yes Yes 33 12 mm x 22 mm -40°C to +85°C RN4871-I/RMXXX Yes Yes 16 9 mm x 11.5 mm -40°C to +85°C
Note 1:
The last three digits in P/N indicate the firmware version. At the time of publication, the latest firmware version is 1.28. Ensure to check product webpage for latest part number and firmware version.
TABLE 1-2: PIN DESCRIPTION RN4870U RN4870 RN4871U RN4871 Name Type Description
— 1 — — GND Power Ground reference — 2 — — GND Power Ground reference 1 3 12 13 GND Power Ground reference 2 4 11 14 VBAT Power Positive supply input. Range: 1.9V~3.6V — — 10 — BK_IN Power Buck power supply input Can be connected to the VBAT pin Connect to 10 µF low ESR ceramic capacitor Voltage range: 1.9V to 3.6V 3 5 — — P2_2 D I/O GPIO PWM1 (only for RN4870) Default: Input; pulled-high 4 6 — — VDD_IO Power VDD; power input Same input pin as VBAT Can be connected to the VBAT pin 5 7 — — VDD_IO Power VDD; power input Same input pin as VBAT Can be connected to the VBAT pin 6 8 — — ULPC_O Power 1.2V ULPC LDO output Used for diagnostic purposes Do not connect to any pin or device For measurement, connect a bypass 1 µF capacitor to ground 7 9 — — P2_3 D I/O GPIO PWM2 (only for RN4870) Default: Input; pulled-high 8 10 — — BK_O Power 1.55V Buck power supply output for diagnostic purpose Do not connect 2016-2019 Microchip Technology Inc. DS50002489D-page 3 Document Outline Bluetooth® Low Energy Module 1.0 Device Overview 1.1 Overview TABLE 1-1: RN4870/71 Family TABLE 1-2: PIN Description FIGURE 1-1: PIN Diagram - RN4870U FIGURE 1-2: PIN Diagram - RN4870 FIGURE 1-3: PIN Diagram - RN4871U FIGURE 1-4: PIN Diagram - RN4871 1.2 Module Configuration TABLE 1-3: Configurable pins and default functions in the RN4870 and RN4871 TABLE 1-4: Configurable functions and descriptions TABLE 1-5: Status Indication PINs TABLE 1-6: Test points on the bottom side FIGURE 1-5: Block Diagram of the RN4870/71 2.0 Specifications TABLE 2-1: General Specifications TABLE 2-2: Electrical characteristics TABLE 2-3: Current consumption TABLE 2-4: Current consumption during application mode 3.0 Interface PINs FIGURE 3-1: Power Scheme FIGURE 3-2: RN4870/71 Coin cell power scheme 4.0 Physical Dimensions And Attributes 4.1 RN4870 Module FIGURE 4-1: RN4870 module dimensions FIGURE 4-2: RN4870 Recommended PCB footprint FIGURE 4-3: Recommended mounting details 4.2 RN4870U Module FIGURE 4-4: RN4870U module dimensions FIGURE 4-5: RN4870U recommended PCB footprint FIGURE 4-6: RN4870U Recommended PCB mounting 4.3 RN4871 Module FIGURE 4-7: RN4871 module dimensions FIGURE 4-8: RN4871 recommended PCB footprint FIGURE 4-9: RN4871 Recommended PCB mounting suggestion 4.4 RN4871U Module FIGURE 4-10: RN4871U module dimensions FIGURE 4-11: RN4871U recommended PCB footprint FIGURE 4-12: RN4871U Recommended PCB mounting FIGURE 4-13: Recommendations for the placement of the module on the Host PCB board 4.5 Soldering Recommendations 5.0 Application Reference Circuits 5.1 External Configuration and Programming 5.2 Reference Circuit FIGURE 5-1: External programming header configurations FIGURE 5-2: RN4870 reference circuit FIGURE 5-3: RN4870U reference circuit FIGURE 5-4: RN4871 Reference circuit FIGURE 5-5: RN4871U reference circuit 5.3 Power Drop Protection FIGURE 5-6: Power Drop protection circuit 6.0 ASCII Command API 7.0 Supported Services 8.0 Antenna Characteristics FIGURE 8-1: RN4870 Antenna performance FIGURE 8-2: RN4871 Antenna performance 9.0 Timing Characteristics FIGURE 9-1: Timing diagram of RN4870/71 UART ready after reset (in test and application mode) FIGURE 9-2: Timing diagram of RN4870/71 UART when powered on (in test and application mode) TABLE 9-1: Error rate for various baud rates on the RN4870/71 10.0 Regulatory Approval 10.1 United States 10.1.1 Labeling and User Information Requirements 10.1.2 RF Exposure 10.1.3 HELPFUL WEB SITES 10.2 Canada 10.2.1 Labeling and User Information Requirements 10.2.2 RF Exposure 10.2.3 Helpful Web Sites 10.3 Europe 10.3.1 LABELING AND USER INFORMATION REQUIREMENTS 10.3.2 CONFORMITY ASSESSMENT 10.3.3 Helpful web sites 10.4 Japan 10.4.1 LABELING AND USER INFORMATION REQUIREMENTS 10.4.2 HELPFUL WEB SITES 10.5 Korea 10.5.1 LABELING AND USER INFORMATION REQUIREMENTS 10.5.2 HELPFUL WEB SITES 10.6 Taiwan 10.6.1 LABELING AND USER INFORMATION REQUIREMENTS 10.6.2 HELPFUL WEB SITES 10.7 China 10.7.1 LABELING AND USER INFORMATION REQUIREMENTS 10.8 Other Regulatory Jurisdictions 10.9 Other Regulatory Information 11.0 Ordering Information TABLE 11-1: Ordering information Appendix A: Revision History The Microchip WebSite Customer Change Notification Service Customer Support AMERICAS Corporate Office Atlanta Austin, TX Boston Chicago Dallas Detroit Houston, TX Indianapolis Los Angeles Raleigh, NC New York, NY San Jose, CA Canada - Toronto ASIA/PACIFIC Australia - Sydney China - Beijing China - Chengdu China - Chongqing China - Dongguan China - Guangzhou China - Hangzhou China - Hong Kong SAR China - Nanjing China - Qingdao China - Shanghai China - Shenyang China - Shenzhen China - Suzhou China - Wuhan China - Xian China - Xiamen China - Zhuhai ASIA/PACIFIC India - Bangalore India - New Delhi India - Pune Japan - Osaka Japan - Tokyo Korea - Daegu Korea - Seoul Malaysia - Kuala Lumpur Malaysia - Penang Philippines - Manila Singapore Taiwan - Hsin Chu Taiwan - Kaohsiung Taiwan - Taipei Thailand - Bangkok Vietnam - Ho Chi Minh EUROPE Austria - Wels Denmark - Copenhagen Finland - Espoo France - Paris Germany - Garching Germany - Haan Germany - Heilbronn Germany - Karlsruhe Germany - Munich Germany - Rosenheim Israel - Ra’anana Italy - Milan Italy - Padova Netherlands - Drunen Norway - Trondheim Poland - Warsaw Romania - Bucharest Spain - Madrid Sweden - Gothenberg Sweden - Stockholm UK - Wokingham Worldwide Sales and Service Trademarks Worldwide Sales and Service
RN4870/71 1.0 DEVICE OVERVIEW
Table 1-1 shows the various options for packaging and features available in the RN4870/71 family. Table 1-2
1.1 Overview
provides the description of the pin functions for all the modules in the RN4870/71 family. Figure 1-1 through The RN4870/71 BLE module integrates Bluetooth 5.0 Figure 1-4 show the pinout for the different modules. baseband controller, on-board Bluetooth stack, digital and analog I/O, and RF power amplifier into one solution.
TABLE 1-1: RN4870/71 FAMILY Number of Operating Part Number(1) Antenna Shielding Dimensions On-Board Pins Temperature Range
RN4870-V/RMXXX Yes Yes 33 12 mm x 22 mm -20°C to +70°C RN4870U-V/RMXXX No No 30 12 mm x 15 mm -20°C to +70°C RN4871-V/RMXXX Yes Yes 16 9 mm x 11.5 mm -20°C to +70°C RN4871U-V/RMXXX No No 17 6 mm x 8 mm -20°C to +70°C RN4870-I/RMXXX Yes Yes 33 12 mm x 22 mm -40°C to +85°C RN4871-I/RMXXX Yes Yes 16 9 mm x 11.5 mm -40°C to +85°C
Note 1:
The last three digits in P/N indicate the firmware version. At the time of publication, the latest firmware version is 1.28. Ensure to check product webpage for latest part number and firmware version.
TABLE 1-2: PIN DESCRIPTION RN4870U RN4870 RN4871U RN4871 Name Type Description
— 1 — — GND Power Ground reference — 2 — — GND Power Ground reference 1 3 12 13 GND Power Ground reference 2 4 11 14 VBAT Power Positive supply input. Range: 1.9V~3.6V — — 10 — BK_IN Power Buck power supply input Can be connected to the VBAT pin Connect to 10 µF low ESR ceramic capacitor Voltage range: 1.9V to 3.6V 3 5 — — P2_2 D I/O GPIO PWM1 (only for RN4870) Default: Input; pulled-high 4 6 — — VDD_IO Power VDD; power input Same input pin as VBAT Can be connected to the VBAT pin 5 7 — — VDD_IO Power VDD; power input Same input pin as VBAT Can be connected to the VBAT pin 6 8 — — ULPC_O Power 1.2V ULPC LDO output Used for diagnostic purposes Do not connect to any pin or device For measurement, connect a bypass 1 µF capacitor to ground 7 9 — — P2_3 D I/O GPIO PWM2 (only for RN4870) Default: Input; pulled-high 8 10 — — BK_O Power 1.55V Buck power supply output for diagnostic purpose Do not connect 2016-2019 Microchip Technology Inc. DS50002489D-page 3 Document Outline Bluetooth® Low Energy Module 1.0 Device Overview 1.1 Overview TABLE 1-1: RN4870/71 Family TABLE 1-2: PIN Description FIGURE 1-1: PIN Diagram - RN4870U FIGURE 1-2: PIN Diagram - RN4870 FIGURE 1-3: PIN Diagram - RN4871U FIGURE 1-4: PIN Diagram - RN4871 1.2 Module Configuration TABLE 1-3: Configurable pins and default functions in the RN4870 and RN4871 TABLE 1-4: Configurable functions and descriptions TABLE 1-5: Status Indication PINs TABLE 1-6: Test points on the bottom side FIGURE 1-5: Block Diagram of the RN4870/71 2.0 Specifications TABLE 2-1: General Specifications TABLE 2-2: Electrical characteristics TABLE 2-3: Current consumption TABLE 2-4: Current consumption during application mode 3.0 Interface PINs FIGURE 3-1: Power Scheme FIGURE 3-2: RN4870/71 Coin cell power scheme 4.0 Physical Dimensions And Attributes 4.1 RN4870 Module FIGURE 4-1: RN4870 module dimensions FIGURE 4-2: RN4870 Recommended PCB footprint FIGURE 4-3: Recommended mounting details 4.2 RN4870U Module FIGURE 4-4: RN4870U module dimensions FIGURE 4-5: RN4870U recommended PCB footprint FIGURE 4-6: RN4870U Recommended PCB mounting 4.3 RN4871 Module FIGURE 4-7: RN4871 module dimensions FIGURE 4-8: RN4871 recommended PCB footprint FIGURE 4-9: RN4871 Recommended PCB mounting suggestion 4.4 RN4871U Module FIGURE 4-10: RN4871U module dimensions FIGURE 4-11: RN4871U recommended PCB footprint FIGURE 4-12: RN4871U Recommended PCB mounting FIGURE 4-13: Recommendations for the placement of the module on the Host PCB board 4.5 Soldering Recommendations 5.0 Application Reference Circuits 5.1 External Configuration and Programming 5.2 Reference Circuit FIGURE 5-1: External programming header configurations FIGURE 5-2: RN4870 reference circuit FIGURE 5-3: RN4870U reference circuit FIGURE 5-4: RN4871 Reference circuit FIGURE 5-5: RN4871U reference circuit 5.3 Power Drop Protection FIGURE 5-6: Power Drop protection circuit 6.0 ASCII Command API 7.0 Supported Services 8.0 Antenna Characteristics FIGURE 8-1: RN4870 Antenna performance FIGURE 8-2: RN4871 Antenna performance 9.0 Timing Characteristics FIGURE 9-1: Timing diagram of RN4870/71 UART ready after reset (in test and application mode) FIGURE 9-2: Timing diagram of RN4870/71 UART when powered on (in test and application mode) TABLE 9-1: Error rate for various baud rates on the RN4870/71 10.0 Regulatory Approval 10.1 United States 10.1.1 Labeling and User Information Requirements 10.1.2 RF Exposure 10.1.3 HELPFUL WEB SITES 10.2 Canada 10.2.1 Labeling and User Information Requirements 10.2.2 RF Exposure 10.2.3 Helpful Web Sites 10.3 Europe 10.3.1 LABELING AND USER INFORMATION REQUIREMENTS 10.3.2 CONFORMITY ASSESSMENT 10.3.3 Helpful web sites 10.4 Japan 10.4.1 LABELING AND USER INFORMATION REQUIREMENTS 10.4.2 HELPFUL WEB SITES 10.5 Korea 10.5.1 LABELING AND USER INFORMATION REQUIREMENTS 10.5.2 HELPFUL WEB SITES 10.6 Taiwan 10.6.1 LABELING AND USER INFORMATION REQUIREMENTS 10.6.2 HELPFUL WEB SITES 10.7 China 10.7.1 LABELING AND USER INFORMATION REQUIREMENTS 10.8 Other Regulatory Jurisdictions 10.9 Other Regulatory Information 11.0 Ordering Information TABLE 11-1: Ordering information Appendix A: Revision History The Microchip WebSite Customer Change Notification Service Customer Support AMERICAS Corporate Office Atlanta Austin, TX Boston Chicago Dallas Detroit Houston, TX Indianapolis Los Angeles Raleigh, NC New York, NY San Jose, CA Canada - Toronto ASIA/PACIFIC Australia - Sydney China - Beijing China - Chengdu China - Chongqing China - Dongguan China - Guangzhou China - Hangzhou China - Hong Kong SAR China - Nanjing China - Qingdao China - Shanghai China - Shenyang China - Shenzhen China - Suzhou China - Wuhan China - Xian China - Xiamen China - Zhuhai ASIA/PACIFIC India - Bangalore India - New Delhi India - Pune Japan - Osaka Japan - Tokyo Korea - Daegu Korea - Seoul Malaysia - Kuala Lumpur Malaysia - Penang Philippines - Manila Singapore Taiwan - Hsin Chu Taiwan - Kaohsiung Taiwan - Taipei Thailand - Bangkok Vietnam - Ho Chi Minh EUROPE Austria - Wels Denmark - Copenhagen Finland - Espoo France - Paris Germany - Garching Germany - Haan Germany - Heilbronn Germany - Karlsruhe Germany - Munich Germany - Rosenheim Israel - Ra’anana Italy - Milan Italy - Padova Netherlands - Drunen Norway - Trondheim Poland - Warsaw Romania - Bucharest Spain - Madrid Sweden - Gothenberg Sweden - Stockholm UK - Wokingham Worldwide Sales and Service Trademarks Worldwide Sales and Service
