Datasheet RN52 (Microchip) - 2

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RN52 1.0 DEVICE OVERVIEW
iAP in the capacity of Bluetooth Slave role. RN52SRC supports A2DP, AVRCP, HFP in the capacity of Microchip’s RN52 Bluetooth audio module provides a Bluetooth Master role. highly integrated solution for delivering high-quality ste- RN52 supports wireless iAP profile advertising which is reo audio in a small form factor. It combines a class 2 discoverable by iOS devices. An external host micro- Bluetooth radio with an embedded DSP processor. The module is programmed and controlled with a simple controller is required to implement the iAP protocol and communicate with the authentication coprocessor ASCII command set. while using the RN52 as a data pipe only to transfer the The RN52 module complies with Bluetooth specifica- iAP protocol data over Bluetooth back and forth with tion version 3.0. It integrates an RF radio and a base- the Apple device. A PIC® microcontroller can be used band controller making it a complete Bluetooth to implement the iAP protocol using the Microchip MFi subsystem. The RN52 supports a variety of profiles Library. including A2DP, AVRCP, HSP/HFP, SPP and iAP. It provides a UART interface, several user programmable Table 1-1 provides the general specifications for the module. Table 1-2 and Table 1-3 provide the module’s I/O pins, stereo speaker outputs, microphone inputs, weight, dimensions and electrical characteristics. digital audio interface and a USB port. Standard RN52 and its variants support A2DP, AVRCP, HFP, SPP and
TABLE 1-1: GENERAL SPECIFICATIONS Specification Description
Standard Bluetooth® 3.0, class 2 Frequency Band 2.4 ~ 2.48 GHz Modulation Method GFSK, PI/4-DQPSK, 8 DPSK Maximum Data Rate 3 Mbps RF Input Impedance 50 ohms Interface UART, GPIO, AIO, USB, I2S, S/PDIF, speaker, microphone Operation Range 10 meters (33 feet) Sensitivity -85 dBm at 0.1 % BER RF TX Power 4 dBm
TABLE 1-2: WEIGHT AND DIMENSIONS Specification Description
Dimensions 26.0 mm x 13.5 mm x 2.7 mm Weight 1.2 g
TABLE 1-3: ELECTRICAL CHARACTERISTICS Specification Description
Supply Voltage 3.0-3.6V DC Working current Depends on profiles, 30 mA typical Standby current (disconnected) < 0.5 mA Temperature -40ºC to +85ºC ESD JESD22-A224 class 0 product Humidity 10% ~ 90% non-condensing Figure 1-1 shows the module’s dimensions and Figure 1-2 shows recommended landing pattern and layout. DS70005120A-page 2  2015 Microchip Technology Inc. Document Outline RN52 Features: Applications: RN52 Block Diagram: 1.0 Device Overview TABLE 1-1: General Specifications TABLE 1-2: Weight and Dimensions TABLE 1-3: Electrical Characteristics FIGURE 1-1: Module Dimensions FIGURE 1-2: Recommended PCB Footprint FIGURE 1-3: Pin Diagram TABLE 1-4: Pin Description(1) (Sheet 1 of 3) 1.1 Audio Interface Circuit Description 1.1.1 Digital Audio Interface FIGURE 1-4: I2S and SPDIF Connections 1.1.2 Analog Audio Interface FIGURE 1-5: RN52 Audio Interface Block Diagram FIGURE 1-6: Stereo CODEC Audio Input/Output Stages 1.1.3 Analog-to-Digital Converter (ADC) FIGURE 1-7: ADC Analog Amplifier Block Diagram 1.1.4 Digital-to-Analog Converter (DAC) 1.1.4.1 Speaker Output 1.1.4.2 Microphone Input TABLE 1-5: Digital to Analog Converter TABLE 1-6: AnaLog to Digital Converter 1.2 General Purpose IO (GPIO) Ports TABLE 1-7: Digital Input and Output Voltage Levels 1.3 Power Consumption TABLE 1-8: Power Consumption 2.0 Applications 2.1 Minimizing Radio Interference FIGURE 2-1: Minimizing Radio Interference FIGURE 2-2: PCB Example Layout 2.2 LED Interface FIGURE 2-3: LED interface TABLE 2-1: Status LED Functions 2.3 Device Firmware Updates FIGURE 2-4: USB DFU Port and GPIO3 Schematic 2.4 Restore Factory Defaults with GPIO4 2.5 Power Control and Regulation 2.6 Solder Reflow Profile TABLE 2-2: Paste Solder Recommendations FIGURE 2-5: Solder Reflow Temperature Profile FIGURE 2-6: Solder Reflow Curve 2.7 Typical Application Schematic FIGURE 2-7: Typical Application Circuit for A2DP Audio Streaming and AVRCP Remote Control 3.0 Bluetooth SIG Certification 4.0 Regulatory Approval 4.1 United States 4.1.1 Labeling and User Information Requirements 4.1.2 RF Exposure 4.1.3 HELPFUL WEB SITES 4.2 Canada 4.2.1 Labeling and User Information Requirements 4.2.2 Helpful Web Sites 4.3 Europe 4.3.1 Labeling and User Information Requirements 4.3.2 Antenna Requirements 4.3.3 Helpful Web Sites TABLE 4-1: European Compliance Testing 4.4 Australia 4.4.1 Helpful Web Sites 4.5 New Zealand 4.5.1 Helpful Web Sites 5.0 Ordering Information TABLE 5-1: Ordering Information(1) 6.0 Revision History Revision A (September 2015) Notes: RN52 Bluetooth® Audio Module AMERICAS Corporate Office Atlanta Austin, TX Boston Chicago Cleveland Dallas Detroit Houston, TX Indianapolis Los Angeles New York, NY San Jose, CA Canada - Toronto ASIA/PACIFIC Asia Pacific Office Hong Kong Australia - Sydney China - Beijing China - Chengdu China - Chongqing China - Dongguan China - Hangzhou China - Hong Kong SAR China - Nanjing China - Qingdao China - Shanghai China - Shenyang China - Shenzhen China - Wuhan China - Xian ASIA/PACIFIC China - Xiamen China - Zhuhai India - Bangalore India - New Delhi India - Pune Japan - Osaka Japan - Tokyo Korea - Daegu Korea - Seoul Malaysia - Kuala Lumpur Malaysia - Penang Philippines - Manila Singapore Taiwan - Hsin Chu Taiwan - Kaohsiung Taiwan - Taipei Thailand - Bangkok EUROPE Austria - Wels Denmark - Copenhagen France - Paris Germany - Dusseldorf Germany - Karlsruhe Germany - Munich Italy - Milan Italy - Venice Netherlands - Drunen Poland - Warsaw Spain - Madrid Sweden - Stockholm UK - Wokingham Worldwide Sales and Service