Datasheet RN52 (Microchip) - 7

ManufacturerMicrochip
DescriptionBluetooth Audio Module
Pages / Page26 / 7 — RN52. 1.1. Audio Interface Circuit. Description. FIGURE 1-4:. I2S AND …
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RN52. 1.1. Audio Interface Circuit. Description. FIGURE 1-4:. I2S AND SPDIF CONNECTIONS. DAC/ADC/CODEC/DSP. I2S MASTER. I2S SLAVE. SDOx

RN52 1.1 Audio Interface Circuit Description FIGURE 1-4: I2S AND SPDIF CONNECTIONS DAC/ADC/CODEC/DSP I2S MASTER I2S SLAVE SDOx

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RN52 1.1 Audio Interface Circuit
1.1.1 DIGITAL AUDIO INTERFACE
Description
The stereo audio CODEC interface has a digital audio interface. It supports the I2S and S/PDIF interfaces. The RN52 audio interface circuit consists of: The RN52 I2S interface is I2S Master and provides the • Analog audio interface with differential audio bit clock and phase sync clock. The I2S or S/PDIF inputs and outputs interface can be configured through command console. • Digital audio interface with configurable S/PDIF The typical application interface can be seen in and I2S interface (A2DP audio output only) Figure 1-4. The audio input circuitry has a dual audio input that can The audio resolution supported is 24-bit and the max be configured as single-ended or fully differential and channel size is 32-bit. The supported sample rates are programmed for microphone or line input. It has an 8KHz, 32KHz, 44.1KHz and 48KHz. The audio resolu- analog and digital programmable gain stage so that it tion and the sample rate can be configured using the can be optimized for different microphones. See UART console command. Refer the RN52 command Figure 1-5. specification for more information.
FIGURE 1-4: I2S AND SPDIF CONNECTIONS RN52 DAC/ADC/CODEC/DSP I2S MASTER I2S SLAVE SDOx SDIx SDIx SDOx SCKx Serial Clock SCKx SSx SSx Frame Sync. Pulse RN52 DAC/ADC/CODEC/DSP S/PDIF S/PDIF GND GND S/PDIF OUT S/PDIF IN S/PDIF IN S/PDIF OUT VDD VDD IN
1.1.2 ANALOG AUDIO INTERFACE The audio output circuitry consists of a differential speaker output preceded by a gain stage and a class The audio input circuitry has a dual audio input that can AB amplifier. The speaker outputs SPK_L+, SPK_L-, be configured as single-ended or fully differential and programmed for microphone or line input. It has an SPK_R+ and SPK_R- are shown in Figure 1-6. analog and digital programmable gain stage so that it The fully differential architecture in the analog signal can be optimized for different microphones. The micro- path results in low noise sensitivity and good power phone inputs MIC_L+, MIC_L-, MIC_R+ and MIC_R- supply rejection while effectively doubling the signal are shown in Figure 1-6. amplitude. It operates from a 1.5V single power supply and uses a minimum of external components. The typical application interface is shown in Figure 1-5.  2015 Microchip Technology Inc. DS70005120A-page 7 Document Outline RN52 Features: Applications: RN52 Block Diagram: 1.0 Device Overview TABLE 1-1: General Specifications TABLE 1-2: Weight and Dimensions TABLE 1-3: Electrical Characteristics FIGURE 1-1: Module Dimensions FIGURE 1-2: Recommended PCB Footprint FIGURE 1-3: Pin Diagram TABLE 1-4: Pin Description(1) (Sheet 1 of 3) 1.1 Audio Interface Circuit Description 1.1.1 Digital Audio Interface FIGURE 1-4: I2S and SPDIF Connections 1.1.2 Analog Audio Interface FIGURE 1-5: RN52 Audio Interface Block Diagram FIGURE 1-6: Stereo CODEC Audio Input/Output Stages 1.1.3 Analog-to-Digital Converter (ADC) FIGURE 1-7: ADC Analog Amplifier Block Diagram 1.1.4 Digital-to-Analog Converter (DAC) 1.1.4.1 Speaker Output 1.1.4.2 Microphone Input TABLE 1-5: Digital to Analog Converter TABLE 1-6: AnaLog to Digital Converter 1.2 General Purpose IO (GPIO) Ports TABLE 1-7: Digital Input and Output Voltage Levels 1.3 Power Consumption TABLE 1-8: Power Consumption 2.0 Applications 2.1 Minimizing Radio Interference FIGURE 2-1: Minimizing Radio Interference FIGURE 2-2: PCB Example Layout 2.2 LED Interface FIGURE 2-3: LED interface TABLE 2-1: Status LED Functions 2.3 Device Firmware Updates FIGURE 2-4: USB DFU Port and GPIO3 Schematic 2.4 Restore Factory Defaults with GPIO4 2.5 Power Control and Regulation 2.6 Solder Reflow Profile TABLE 2-2: Paste Solder Recommendations FIGURE 2-5: Solder Reflow Temperature Profile FIGURE 2-6: Solder Reflow Curve 2.7 Typical Application Schematic FIGURE 2-7: Typical Application Circuit for A2DP Audio Streaming and AVRCP Remote Control 3.0 Bluetooth SIG Certification 4.0 Regulatory Approval 4.1 United States 4.1.1 Labeling and User Information Requirements 4.1.2 RF Exposure 4.1.3 HELPFUL WEB SITES 4.2 Canada 4.2.1 Labeling and User Information Requirements 4.2.2 Helpful Web Sites 4.3 Europe 4.3.1 Labeling and User Information Requirements 4.3.2 Antenna Requirements 4.3.3 Helpful Web Sites TABLE 4-1: European Compliance Testing 4.4 Australia 4.4.1 Helpful Web Sites 4.5 New Zealand 4.5.1 Helpful Web Sites 5.0 Ordering Information TABLE 5-1: Ordering Information(1) 6.0 Revision History Revision A (September 2015) Notes: RN52 Bluetooth® Audio Module AMERICAS Corporate Office Atlanta Austin, TX Boston Chicago Cleveland Dallas Detroit Houston, TX Indianapolis Los Angeles New York, NY San Jose, CA Canada - Toronto ASIA/PACIFIC Asia Pacific Office Hong Kong Australia - Sydney China - Beijing China - Chengdu China - Chongqing China - Dongguan China - Hangzhou China - Hong Kong SAR China - Nanjing China - Qingdao China - Shanghai China - Shenyang China - Shenzhen China - Wuhan China - Xian ASIA/PACIFIC China - Xiamen China - Zhuhai India - Bangalore India - New Delhi India - Pune Japan - Osaka Japan - Tokyo Korea - Daegu Korea - Seoul Malaysia - Kuala Lumpur Malaysia - Penang Philippines - Manila Singapore Taiwan - Hsin Chu Taiwan - Kaohsiung Taiwan - Taipei Thailand - Bangkok EUROPE Austria - Wels Denmark - Copenhagen France - Paris Germany - Dusseldorf Germany - Karlsruhe Germany - Munich Italy - Milan Italy - Venice Netherlands - Drunen Poland - Warsaw Spain - Madrid Sweden - Stockholm UK - Wokingham Worldwide Sales and Service
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