Datasheet DS28E18 (Maxim) - 3
| Manufacturer | Maxim |
| Description | 1-Wire to I2C/SPI Bridge with Command Sequencer |
| Pages / Page | 70 / 3 — Absolute Maximum Ratings. Package Information. 8 TDFN-EP. Thermal … |
| File Format / Size | PDF / 1.2 Mb |
| Document Language | English |
Absolute Maximum Ratings. Package Information. 8 TDFN-EP. Thermal Resistance, Single-Layer Board:
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Absolute Maximum Ratings
Voltage Range on Any Pin Relative to GND ... -0.5V to 4.0V Operating Temperature Range ...-40°C to +85°C Maximum Current into Any Pin.. -20mA to 20mA Junction Temperature ... +125°C Continuous Power Dissipation (Single-Layer Board) (TA = +70°C, Storage Temperature Range ..-40°C to +125°C derate 16.70mW/°C above +70°C).. 1333.30mW Soldering Temperature (reflow) ..+260°C Continuous Power Dissipation (Multilayer Board) (TA = +70°C, Lead Temperature (soldering, 10s)...+260°C derate 16.70mW/°C above +70°C.)... 1333.30mW Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information 8 TDFN-EP
Package Code T823+3C Outline Number 21-0174 Land Pattern Number 90-0091
Thermal Resistance, Single-Layer Board:
Junction-to-Ambient (θJA) 60°C/W Junction-to-Case (θJC) 11°C/W
Thermal Resistance, Four-Layer Board:
Junction-to-Ambient (θJA) 60°C/W Junction-to-Case (θJC) 11°C/W For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/ thermal-tutorial.
Electrical Characteristics
(Limits are 100% tested at TA = +25°C and TA = +85°C. Limits over the operating temperature range and relevant supply voltage range are guaranteed by design and characterization. Specifications marked GBD are guaranteed by design and not production tested. Specifications to the minimum operating temperature are guaranteed by design and are not production tested. )
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS IO PIN: GENERAL DATA
1-Wire Pullup Voltage VPUP (Note 1) 2.97 3.63 V 1-Wire Pullup R Resistance PUP (Note 1, Note 2) 300 1000 Ω 0.1 + Input Capacitance CIO (Note 4) nF CEXT Capacitor External CEXT (Note 1) 399.5 470 nF Voltage Capacitor V External Min CEXT tRSTL = 640μs 1.5 V Input Load Current IL IO pin at VPUP 8.5 300 μA 19-100832 www.maximintegrated.com Maxim Integrated | 3 Document Outline General Description Applications Benefits and Features Simplified Application Block Diagram Absolute Maximum Ratings Package Information 8 TDFN-EP Electrical Characteristics Electrical Characteristics (continued) Typical Operating Characteristics Pin Configuration DS28E18 Pin Description Functional Diagram Block Diagram Detailed Description 64-Bit ROM ID Power-Up ROM ID Serialization 1-Wire Bus System Hardware Configuration Transaction Sequence Initialization 1-Wire ROM Function Commands Search ROM [F0h] Read ROM [33h] Match ROM [55h] Skip ROM [CCh] Resume [A5h] Overdrive-Skip ROM [3Ch] Overdrive-Match ROM [69h] 1-Wire Signaling and Timing Read/Write Time Slots Master-to-Slave Slave-to-Master Improved Network Behavior Device Function Commands Command Start (66h) Write Sequencer Command (11h) Read Sequencer Command (22h) Run Sequencer Command (33h) Device Configuration and Status Commands Write Configuration Command (55h) Read Configuration Command (6Ah) Write GPIO Configuration (83h) Read GPIO Configuration (7Ch) Device Status Command (7Ah) Sequencer Commands I2C Sequencer Interface Commands I2C Start Command I2C Stop Command I2C Write Data Command I2C Read Data Command I2C Read Data with NACK End Command SPI Sequencer Commands SPI Write/Read Byte(s) Command SPI Write/Read Bit(s) Command SS_HIGH Command SS_LOW Command Sequencer Utility Commands GPIO_CTRL Write Command GPIO_CTRL Read Command GPIO_BUF Write Command GPIO_BUF Read Command Delay Command SENS_VDD On Command SENS_VDD Off Command I2C Overview I2C Definitions Bus Idle or Not Busy START Condition STOP Condition Repeated START Condition Data Valid SPI Overview SPI Timing SPI Timing Diagram Power-Up of GPIO/I2C Pins Timeout Typical Application Circuits DS28E18 Configured as an I2C Master Typical Application Circuits (continued) DS28E18 Configured as an SPI Master Ordering Information Revision History
Absolute Maximum Ratings
Voltage Range on Any Pin Relative to GND ... -0.5V to 4.0V Operating Temperature Range ...-40°C to +85°C Maximum Current into Any Pin.. -20mA to 20mA Junction Temperature ... +125°C Continuous Power Dissipation (Single-Layer Board) (TA = +70°C, Storage Temperature Range ..-40°C to +125°C derate 16.70mW/°C above +70°C).. 1333.30mW Soldering Temperature (reflow) ..+260°C Continuous Power Dissipation (Multilayer Board) (TA = +70°C, Lead Temperature (soldering, 10s)...+260°C derate 16.70mW/°C above +70°C.)... 1333.30mW Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information 8 TDFN-EP
Package Code T823+3C Outline Number 21-0174 Land Pattern Number 90-0091
Thermal Resistance, Single-Layer Board:
Junction-to-Ambient (θJA) 60°C/W Junction-to-Case (θJC) 11°C/W
Thermal Resistance, Four-Layer Board:
Junction-to-Ambient (θJA) 60°C/W Junction-to-Case (θJC) 11°C/W For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/ thermal-tutorial.
Electrical Characteristics
(Limits are 100% tested at TA = +25°C and TA = +85°C. Limits over the operating temperature range and relevant supply voltage range are guaranteed by design and characterization. Specifications marked GBD are guaranteed by design and not production tested. Specifications to the minimum operating temperature are guaranteed by design and are not production tested. )
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS IO PIN: GENERAL DATA
1-Wire Pullup Voltage VPUP (Note 1) 2.97 3.63 V 1-Wire Pullup R Resistance PUP (Note 1, Note 2) 300 1000 Ω 0.1 + Input Capacitance CIO (Note 4) nF CEXT Capacitor External CEXT (Note 1) 399.5 470 nF Voltage Capacitor V External Min CEXT tRSTL = 640μs 1.5 V Input Load Current IL IO pin at VPUP 8.5 300 μA 19-100832 www.maximintegrated.com Maxim Integrated | 3 Document Outline General Description Applications Benefits and Features Simplified Application Block Diagram Absolute Maximum Ratings Package Information 8 TDFN-EP Electrical Characteristics Electrical Characteristics (continued) Typical Operating Characteristics Pin Configuration DS28E18 Pin Description Functional Diagram Block Diagram Detailed Description 64-Bit ROM ID Power-Up ROM ID Serialization 1-Wire Bus System Hardware Configuration Transaction Sequence Initialization 1-Wire ROM Function Commands Search ROM [F0h] Read ROM [33h] Match ROM [55h] Skip ROM [CCh] Resume [A5h] Overdrive-Skip ROM [3Ch] Overdrive-Match ROM [69h] 1-Wire Signaling and Timing Read/Write Time Slots Master-to-Slave Slave-to-Master Improved Network Behavior Device Function Commands Command Start (66h) Write Sequencer Command (11h) Read Sequencer Command (22h) Run Sequencer Command (33h) Device Configuration and Status Commands Write Configuration Command (55h) Read Configuration Command (6Ah) Write GPIO Configuration (83h) Read GPIO Configuration (7Ch) Device Status Command (7Ah) Sequencer Commands I2C Sequencer Interface Commands I2C Start Command I2C Stop Command I2C Write Data Command I2C Read Data Command I2C Read Data with NACK End Command SPI Sequencer Commands SPI Write/Read Byte(s) Command SPI Write/Read Bit(s) Command SS_HIGH Command SS_LOW Command Sequencer Utility Commands GPIO_CTRL Write Command GPIO_CTRL Read Command GPIO_BUF Write Command GPIO_BUF Read Command Delay Command SENS_VDD On Command SENS_VDD Off Command I2C Overview I2C Definitions Bus Idle or Not Busy START Condition STOP Condition Repeated START Condition Data Valid SPI Overview SPI Timing SPI Timing Diagram Power-Up of GPIO/I2C Pins Timeout Typical Application Circuits DS28E18 Configured as an I2C Master Typical Application Circuits (continued) DS28E18 Configured as an SPI Master Ordering Information Revision History
