Datasheet HMC976LP3E (Analog Devices) - 5

ManufacturerAnalog Devices
Description400 mA Low Noise, High PSRR Linear Voltage Regulator
Pages / Page12 / 5 — HMC976LP3E. 400mA LOW NOISE, HIGH PSRR. LINEAR VOLTAGE REGULATOR. Table …
File Format / SizePDF / 1.1 Mb
Document LanguageEnglish

HMC976LP3E. 400mA LOW NOISE, HIGH PSRR. LINEAR VOLTAGE REGULATOR. Table 2. Absolute Maximum Ratings

HMC976LP3E 400mA LOW NOISE, HIGH PSRR LINEAR VOLTAGE REGULATOR Table 2 Absolute Maximum Ratings

Model Line for this Datasheet

Text Version of Document

HMC976LP3E
v02.1112
400mA LOW NOISE, HIGH PSRR LINEAR VOLTAGE REGULATOR Table 2. Absolute Maximum Ratings
Vdd to GND Voltage +5.8V / -0.3V Stresses above those listed under Absolute Maximum EN to GND Voltage +5.8V /-0.3V Ratings may cause permanent damage to the device. This RDx / HVx to GND Voltage +5.8V / -0.3V is a stress rating only; functional operation of the device at these or any other conditions above those indicated in Maximum Dissipation 780mW the operational section of this specification is not implied. Thermal Resistance 51.5 °C/W [3] Exposure to absolute maximum rating conditions for (Junction to Ambient) extended periods may affect device reliability. The absolute Thermal Resistance (Junction to 18 °C/W maximum ratings apply individually only, not in combination. Case, Ground Paddle) Maximum Junction Temperature +150 °C Max Output Current 420 mA Storage Temperature -65 to +150 °C ELECTROSTATIC SENSITIVE DEVICE ESD Sensitivity (HBM) Class 1C OBSERVE HANDLING PRECAUTIONS
Table 3. Recommended Operating Condition
Parameter Condition Min. Typ. Max. Units Junction Temperature 115 °C Ambient Temperature -40 85 °C
Outline Drawing
T M G - S IN N IO IT NOTES: [1] PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC D SILICA AND SILICON IMPREGNATED. [2] LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY. N [3] LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN. [4] DIMENSIONS ARE IN INCHES [MILLIMETERS]. O [5] LEAD SPACING TOLERANCE IS NON-CUMULATIVE. [6] PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL BE 0.25m MAX. [7] PACKAGE WARP SHALL NOT EXCEED 0.05mm R C [8] ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB GROUND. E [9] REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN. W
Table 4. Package Information
O P Part Number Package Body Material Lead Finish MSL Rating Package Marking [1] 976 HMC976LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] XXX X [1] 4-Digit lot number XXXX [2] Max peak reflow temperature of 260 °C [3] For standard HMC976LP3E evaluation board, no heat sink (HS) and no air flow, see figures 14, 15, and 16 InfoFro ma r p tion rfiucre nis, d he e d lbiv y e An raly a og n Ded t viceo p s is la be clie o eved rtd o e b re sa: H ccur iattti e te M and re ilicarbloew . a Ho ve C wever, onro For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other poration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 5 978-250-3343 tel • 978-250-3373 fax • O rights of third parties that may result from its use. Specifications subject to change without notice. No rd P e h r O one n : 7-lin 81- e a 329-t w 47 w 0 w.h 0 • O it rd teite r o .nc li o n m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. e at www.analog.com Application S Trademarks and registered trademarks are the property of their respective owners. upport: apps@ A h p i p tliti c te ati .ocom n Support: Phone: 1-800-ANALOG-D