Datasheet ADP1710, ADP1711 (Analog Devices) - 4
| Manufacturer | Analog Devices |
| Description | 150 mA, Low Dropout, CMOS Linear Regulator |
| Pages / Page | 16 / 4 — ADP1710/ADP1711. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 2. … |
| File Format / Size | PDF / 876 Kb |
| Document Language | English |
ADP1710/ADP1711. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 2. Parameter Rating. Table 3. Thermal Resistance
Model Line for this Datasheet
Text Version of Document
ADP1710/ADP1711 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter Rating
θJA is specified for the worst-case conditions, that is, a device IN to GND –0.3 V to +6 V soldered in a circuit board for surface-mount packages. OUT to GND –0.3 V to IN
Table 3. Thermal Resistance
EN to GND –0.3 V to +6 V
Package Type θJA Unit
ADJ/BYP to GND –0.3 V to +6 V 5-Lead TSOT 170 °C/W Storage Temperature Range –65°C to +150°C Operating Junction Temperature Range –40°C to +125°C Soldering Conditions JEDEC J-STD-020
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. 0 | Page 4 of 16 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUITS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION ADJUSTABLE OUTPUT VOLTAGE (ADP1710 ADJUSTABLE) BYPASS CAPACITOR (ADP1711) ENABLE FEATURE UNDERVOLTAGE LOCKOUT (UVLO) APPLICATION INFORMATION CAPACITOR SELECTION CURRENT LIMIT AND THERMAL OVERLOAD PROTECTION THERMAL CONSIDERATIONS PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE
θJA is specified for the worst-case conditions, that is, a device IN to GND –0.3 V to +6 V soldered in a circuit board for surface-mount packages. OUT to GND –0.3 V to IN
Table 3. Thermal Resistance
EN to GND –0.3 V to +6 V
Package Type θJA Unit
ADJ/BYP to GND –0.3 V to +6 V 5-Lead TSOT 170 °C/W Storage Temperature Range –65°C to +150°C Operating Junction Temperature Range –40°C to +125°C Soldering Conditions JEDEC J-STD-020
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. 0 | Page 4 of 16 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUITS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION ADJUSTABLE OUTPUT VOLTAGE (ADP1710 ADJUSTABLE) BYPASS CAPACITOR (ADP1711) ENABLE FEATURE UNDERVOLTAGE LOCKOUT (UVLO) APPLICATION INFORMATION CAPACITOR SELECTION CURRENT LIMIT AND THERMAL OVERLOAD PROTECTION THERMAL CONSIDERATIONS PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE
