Datasheet LTC4124 (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | 100mA Wireless Li-Ion Charger with Low Battery Disconnect |
| Pages / Page | 30 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Notes 1, 2). ORDER … |
| Revision | A |
| File Format / Size | PDF / 1.9 Mb |
| Document Language | English |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Notes 1, 2). ORDER INFORMATION. PACKAGE**. MSL. PART NUMBER. PART MARKING*. FINISH CODE
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Text Version of Document
LTC4124
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Notes 1, 2)
Input Supply Voltages TOP VIEW DCIN, VCC, BAT .. –0.3V to 6V ACIN ... V DCIN ACIN CC – 40V to VCC + 0.3V Input Supply Currents VCC 1 12 11 10 BAT I(ACIN) .. 200mA CHRG 2 9 NTC 13 I(DCIN) .. 200mA GND PRECHG 3 8 LBSEL CHRG ...–0.3V to VCC + 0.3V Programming Pins VSEL1 4 7 ISEL2 5 6 VSEL1, VSEL2, ISEL1, ISEL2 ..–0.3V to VCC + 0.3V NTC, LBSEL, PRECHG ...–0.3V to V VSEL2 ISEL1 CC + 0.3V Operating Junction Temperature Range LQFN PACKAGE 12-LEAD (2mm × 2mm × 0.74mm) (Note 3) ... –20°C to 85°C TJMAX = 85°C, θJA = 92°C/W EXPOSED PAD (PIN 13) IS GND, MUST BE SOLDERED TO PCB Storage Temperature Range .. –40°C to 125°C Maximum Reflow (Package Body) Temperature ..260°C
ORDER INFORMATION PACKAGE** MSL PART NUMBER PART MARKING* FINISH CODE PAD FINISH TYPE RATING TEMPERATURE RANGE
LTC4124EV#TRPBF LHFW e4 Au (RoHS) LQFN (Laminate Package with QFN Footprint) 3 –20°C to 85°C LTC4124EV#TRMPBF LHFW e4 Au (RoHS) LQFN (Laminate Package with QFN Footprint) 3 –20°C to 85°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is identified by a label on the shipping Procedures container. • LGA and BGA Package and Tray Drawings • Pad finish code is per IPC/JEDEC J-STD-609. Parts ending with PBF are RoHS and WEEE compliant. **The LTC4124 package has the same dimensions as a standard 2mm × 2mm × 0.74mm QFN Package. Rev. A 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Functional Block Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Notes 1, 2)
Input Supply Voltages TOP VIEW DCIN, VCC, BAT .. –0.3V to 6V ACIN ... V DCIN ACIN CC – 40V to VCC + 0.3V Input Supply Currents VCC 1 12 11 10 BAT I(ACIN) .. 200mA CHRG 2 9 NTC 13 I(DCIN) .. 200mA GND PRECHG 3 8 LBSEL CHRG ...–0.3V to VCC + 0.3V Programming Pins VSEL1 4 7 ISEL2 5 6 VSEL1, VSEL2, ISEL1, ISEL2 ..–0.3V to VCC + 0.3V NTC, LBSEL, PRECHG ...–0.3V to V VSEL2 ISEL1 CC + 0.3V Operating Junction Temperature Range LQFN PACKAGE 12-LEAD (2mm × 2mm × 0.74mm) (Note 3) ... –20°C to 85°C TJMAX = 85°C, θJA = 92°C/W EXPOSED PAD (PIN 13) IS GND, MUST BE SOLDERED TO PCB Storage Temperature Range .. –40°C to 125°C Maximum Reflow (Package Body) Temperature ..260°C
ORDER INFORMATION PACKAGE** MSL PART NUMBER PART MARKING* FINISH CODE PAD FINISH TYPE RATING TEMPERATURE RANGE
LTC4124EV#TRPBF LHFW e4 Au (RoHS) LQFN (Laminate Package with QFN Footprint) 3 –20°C to 85°C LTC4124EV#TRMPBF LHFW e4 Au (RoHS) LQFN (Laminate Package with QFN Footprint) 3 –20°C to 85°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is identified by a label on the shipping Procedures container. • LGA and BGA Package and Tray Drawings • Pad finish code is per IPC/JEDEC J-STD-609. Parts ending with PBF are RoHS and WEEE compliant. **The LTC4124 package has the same dimensions as a standard 2mm × 2mm × 0.74mm QFN Package. Rev. A 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Functional Block Diagram Operation Applications Information Typical Applications Package Description Revision History Typical Application Related Parts
