Datasheet AD8677 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | 130µV Max Offset voltage Op Amp in TSOT23 |
| Pages / Page | 16 / 5 — AD8677. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter Value. THERMAL … |
| Revision | A |
| File Format / Size | PDF / 330 Kb |
| Document Language | English |
AD8677. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter Value. THERMAL RESISTANCE. Table 4. Package Type. θJA. θJC. Unit. ESD CAUTION
Model Line for this Datasheet
Text Version of Document
AD8677 ABSOLUTE MAXIMUM RATINGS Table 3.
Stresses above those listed under Absolute Maximum Ratings
Parameter Value
may cause permanent damage to the device. This is a stress Supply Voltage ±18 V rating only; functional operation of the device at these or any Input Voltage ±V Supply other conditions above those indicated in the operational Differential Input Voltage ±0.7 V section of this specification is not implied. Exposure to absolute Output Short-Circuit Duration to GND Indefinite maximum rating conditions for extended periods may affect Storage Temperature Range device reliability. UJ-5, R Package −65°C to +150°C
THERMAL RESISTANCE
Operating Temperature Range −40°C to +125°C θJA is specified for the worst-case conditions, that is, a device Junction Temperature Range soldered in a circuit board for surface-mount packages. RM, R Package −65°C to +150°C Lead Temperature (Soldering, 10 sec) +300°C
Table 4. Package Type θJA θJC Unit
5-Lead TSOT (UJ-5) 207 61 °C/W 8-Lead SOIC (R-8) 158 43 °C/W
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. A | Page 5 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION PIN CONFIGURATIONS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE
Stresses above those listed under Absolute Maximum Ratings
Parameter Value
may cause permanent damage to the device. This is a stress Supply Voltage ±18 V rating only; functional operation of the device at these or any Input Voltage ±V Supply other conditions above those indicated in the operational Differential Input Voltage ±0.7 V section of this specification is not implied. Exposure to absolute Output Short-Circuit Duration to GND Indefinite maximum rating conditions for extended periods may affect Storage Temperature Range device reliability. UJ-5, R Package −65°C to +150°C
THERMAL RESISTANCE
Operating Temperature Range −40°C to +125°C θJA is specified for the worst-case conditions, that is, a device Junction Temperature Range soldered in a circuit board for surface-mount packages. RM, R Package −65°C to +150°C Lead Temperature (Soldering, 10 sec) +300°C
Table 4. Package Type θJA θJC Unit
5-Lead TSOT (UJ-5) 207 61 °C/W 8-Lead SOIC (R-8) 158 43 °C/W
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. A | Page 5 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION PIN CONFIGURATIONS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE
