Datasheet MYTNA1R86RELA2RA (Murata) - 3

MYTNA1R86RELA2RA
Document Category: Datasheet UltraBK™ 6A DC–DC Converter Module
Absolute Maximum Ratings(1)(2)
PARAMETER
Vin, ON/OFF Pin(3)
Trim(4), POK Pin
Storage Temperature
Soldering / Reflow temperature(5)
ESD Tolerance, HBM(6) MIN
-0.3
-0.3
-40
-MAX
16
5.5
125
260
1000 UNITS
V
V
°C
°C
V Notes:
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections
of the specification are not implied. Exposure to absolute maximum rating conditions for extended periods may extremely reduce
device reliability.
(2) All voltages are with respect to GND plane.
(3) Do NOT exceed more than 0.3V from Vin voltage.
(4) The Trim pin is designed to be connected to GND via a resistor.
(5) Recommended Reflow profile is written in “Soldering Guidelines”.
(6) Human body model, per the JEDEC standard JS-001-2012.
Table 1. Absolute Maximum Ratings Recommended Operating Conditions(1)
PARAMETER
Input Voltage Range
Ambient Temperature(2)
Junction Temperature
Load Current MIN
6.0
-40
-40
0 MAX
14.4
105
120
6 UNITS
V
°C
°C
A Notes:
(1) (2) This module should be operated inside the recommended operating conditions. This module has been designed and tested on the
assumption that it will be used under the recommended operating conditions. Operating in not recommended condition may reduce
reliability of the module.
See the temperature derating curves in the thermal deratings. However, do not condensate.
Table 2. Recommended Operating Conditions Package Thermal Characteristics(1)(2)
PARAMETER
Θjcb-1
Θjcb-2
Θjct-1
Θjct-2
Θja Junction-case-bottom at heat Junction1
Junction-case-bottom at heat Junction2
Junction-case-top a heat Junction1
Junction-case-top a heat Junction2
Junction-air TYP
10.0
47.3
64.9
53.7
19.9 UNITS
°C/W
°C/W
°C/W
°C/W
°C/W Notes:
(1) Package thermal characteristics and performance are acquire and reported in according to the JEDEC standard JESD51-12. See
“Fig.34” below for more information on our measurement conditions.
(2) Junction thermal resistance is a function not only of the internal parts, but it is also extremely sensitive to the environment which
includes, but is not limited to, board thickness, number of layers, copper weight / routes, and air flow. Attention to the board layout is
necessary to realize expected thermal performance.
Table 3. Package Thermal Characteristics http://www.murata.com/products/power
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