Datasheet BV2HD070EFU-C (Rohm) - 5

BV2HD070EFU-C Absolute Maximum Ratings (Ta = 25 °C)
Parameter Symbol Rating Unit VBB - OUT Voltage VDS -0.3 to Internal clamp(Note 1) V Power Supply Voltage VBB -0.3 to +40 V Set Voltage VSET -0.3 to VBB+0.3 V Input Voltage VIN, VDLY -0.3 to +7.0 V Diagnostic Output Voltage VST - 0.3 to +7.0 V Output Current IOUT Internal limit(Note 2) A Diagnostic Output Current IST 10 mA Storage Temperature Range Tstg -55 to +150 °C Maximum Junction Temperature Tjmax 150 °C Active Clamp Energy (Single Pulse) E Tj AS (25 °C) 120 mJ (START) = 25 °C, IOUT = 2 A(Note 3)(Note 4) Active Clamp Energy (Single Pulse) E Tj AS (150 °C) 50 mJ (START) = 150 °C, IOUT = 2 A(Note 3)(Note 4) Supply Voltage V for Short Circuit Protection(Note 5) BBLIM 24 V
Caution 1:
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings.
Caution 2:
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating. (Note 1) Internally limited by output clamp voltage. (Note 2) Internally limited by fixed over current limit. (Note 3) Maximum active clamp energy using single pulse of IOUT(START) = 2 A and VBB = 14 V. When IC is turned off in the condition that inductive load is connected, the OUT pin is fell below 0 V. This energy is dissipated by BV2HD070EFU-C. This energy can be calculated with following equation: 𝐿 𝑉 𝑅 𝐸 𝐵𝐵 − 𝑉𝐷𝑆 𝐿 × 𝐼𝑂𝑈𝑇(𝑆𝑇𝐴𝑅𝑇) 𝐴𝑆 = 𝑉𝐷𝑆 × × [ × 𝑙𝑛 (1 − ) + 𝐼 𝑅 𝑂𝑈𝑇(𝑆𝑇𝐴𝑅𝑇)] 𝐿 𝑅𝐿 𝑉𝐵𝐵 − 𝑉𝐷𝑆 Following equation simplifies under the assumption of RL = 0 Ω. 1 𝑉 𝐸 2 𝐵𝐵 𝐴𝑆 = × 𝐿 × 𝐼 × ( 1 − ) 2 𝑂𝑈𝑇(𝑆𝑇𝐴𝑅𝑇) 𝑉 𝐵𝐵 − 𝑉𝐷𝑆 (Note 4) Not 100% tested. (Note 5) Maximum power supply voltage that can detect short circuit protection. www.rohm.com
TSZ02201-0G5G1G400040-1-2
© 2019 ROHM Co., Ltd. All rights reserved. 5/34 TSZ22111 • 15 • 001
18.Mar.2019 Rev.001
Document Outline General Description Features Applications Key Specifications Package Typical Application Circuit Table of Contents Pin Configuration Pin Description Block Diagram Definition Absolute Maximum Ratings Thermal Resistance Recommended Operating Conditions Electrical Characteristics Typical Performance Curves Figure 6. Standby Current vs Supply Voltage Figure 7. Standby Current vs Junction Temperature Figure 8. Operating Current vs Supply Voltage Figure 9. Operating Current vs Junction Temperature Figure 10. UVLO Detection Voltage vs Junction Temperature Figure 11. Input Voltage vs Junction Temperature Figure 12. Input Current vs Junction Temperature Figure 13. Output ON Resistance vs Supply Voltage Figure 14. Output ON Resistance vs Junction Temperature Figure 15. Output leak Current vs Junction Temperature Figure 16. Output Slew Rate vs Junction Temperature Figure 17. Output ON, OFF Propagation Delay Time vs Junction Temperature Figure 18. Output Clamp Voltage vs Junction Temperature Figure 19. Diagnostic Output Low Voltage vs Junction Temperature Figure 20. Diagnostic Output ON, OFF Propagation Delay Time vs Junction Temperature Figure 21. Variable Over Current Limit vs Junction Temperature Figure 22. Open Load Detection Voltage vs Junction Temperature Figure 23. Active Clamp Energy vs Output Current Measurement Circuit Timing Chart (Propagation Delay Time) Function Description 1. Protection Function 2. Over Current Protection 2.1 Over Current Limiting Operation in one side channel 2.2 Over Current Detection in Both Outputs 2.3 Over Current Detection by Other Channel while CDLY is Charging (tDLY) 2.4 Setting of Variable Overcurrent Limit Value 2.5 Variable Over Current Limit Mask Time Setting 2.6 The SET Pin and the DLY Pin Setting 3. Open Load Detection 3.1 When the OUT1, OUT2 is pulled down by the load (Normal function) 3.2 If the SW1 is OFF, the output is no longer pulled down by the load 4. Thermal Shutdown, ΔTj Protection Detection 4.1 Thermal Shutdown Protection 4.2 ΔTj Protection 5. Other Protection 5.1 GND Open Protection 5.2 MCU I/O Protection Applications Example I/O Equivalence Circuits Operational Notes 1. Reverse Connection of Power Supply 2. Power Supply Lines 3. Ground Voltage 4. Ground Wiring Pattern 5. Recommended Operating Conditions 6. Inrush Current 7. Testing on Application Boards 8. Inter-pin Short and Mounting Errors 9. Unused Input Pins 10. Ceramic Capacitor 11. Thermal Shutdown Function (TSD) 12. Over Current Protection Function (OCP) 13. Active Clamp Operation 14. Open Power Supply Pin 15. Open GND Pin Ordering Information Marking Diagram Physical Dimension and Packing Information Revision History