link to page 2 CS5171, CS5172, CS5173, CS5174 R2 3.72 k D1 V 1 8 OUT V VSW 5 V C MBRS120T3 2 7 FB PGND C1 0.01 mF 3 6 Test AGND CS5171/3 L1 4 5 + C3 SS SS VCC 22 mF 22 mH 3.3 V R3 R1 + 5 k C2 1.28 k 22 mF Figure 1. Applications DiagramMAXIMUM RATINGSRatingValueUnit Junction Temperature Range, TJ −40 to +150 °C Storage Temperature Range, TSTORAGE −65 to +150 °C Package Thermal Resistance, Junction−to−Case, RqJC 45 °C/W Junction−to−Ambient, RqJA 165 °C/W Lead Temperature Soldering: Reflow (Note 1) 260 Peak °C ESD, Human Body Model 1.2 kV Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. 60 second maximum above 183°C. MAXIMUM RATINGSPin NamePin SymbolVMAXVMINISOURCEISINK IC Power Input VCC 35 V −0.3 V N/A 200 mA Shutdown/Sync SS 30 V −0.3 V 1.0 mA 1.0 mA Loop Compensation VC 6.0 V −0.3 V 10 mA 10 mA Voltage Feedback Input FB 10 V −0.3 V 1.0 mA 1.0 mA (CS5171/3 only) Negative Feedback Input NFB −10 V 10 V 1.0 mA 1.0 mA (transient, 10 ms) (CS5172/4 only) Test Pin Test 6.0 V −0.3 V 1.0 mA 1.0 mA Power Ground PGND 0.3 V −0.3 V 4 A 10 mA Analog Ground AGND 0 V 0 V N/A 10 mA Switch Input VSW 40 V −0.3 V 10 mA 3.0 A www.onsemi.com2