Datasheet BPF8089-01SC6 (STMicroelectronics) - 7
| Manufacturer | STMicroelectronics |
| Description | STA8089 / STA8090 LNA impedance matching with ESD protection in SOT23 |
| Pages / Page | 14 / 7 — BPF8089-01SC6. Solder paste. Figure 9. Recommended PCB stack-up. Figure … |
| File Format / Size | PDF / 626 Kb |
| Document Language | English |
BPF8089-01SC6. Solder paste. Figure 9. Recommended PCB stack-up. Figure 10. Recommended stencil opening (mm). 2.1. DS13416. Rev 1
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Text Version of Document
BPF8089-01SC6 Solder paste Figure 9. Recommended PCB stack-up
Top layer Cu = 35 µm FR4 = 254 µm (Er 4.5) GND layer Cu = 17 µm m µ FR4 = 458 µm (Er 4.5) Cu = 17 µm 1070 FR4 = 254 µm (Er 4.5) Bottom layer Cu = 35 µm
Figure 10. Recommended stencil opening (mm)
0.95 1.15 8 1.13 0.569
2.1 Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Use solder paste with fine particles: powder particle size is 20-38 μm.
DS13416
-
Rev 1 page 7/14
Document Outline Cover image Application schematic Product status link / summary Features Applications Description 1 Characteristics 1.1 Characteristics (curves) 2 Recommendation on PCB assembly 2.1 Solder paste 3 Package information 3.1 SOT23-6L package information 3.2 Reflow profile 4 Ordering information Revision history
Top layer Cu = 35 µm FR4 = 254 µm (Er 4.5) GND layer Cu = 17 µm m µ FR4 = 458 µm (Er 4.5) Cu = 17 µm 1070 FR4 = 254 µm (Er 4.5) Bottom layer Cu = 35 µm
Figure 10. Recommended stencil opening (mm)
0.95 1.15 8 1.13 0.569
2.1 Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Use solder paste with fine particles: powder particle size is 20-38 μm.
DS13416
-
Rev 1 page 7/14
Document Outline Cover image Application schematic Product status link / summary Features Applications Description 1 Characteristics 1.1 Characteristics (curves) 2 Recommendation on PCB assembly 2.1 Solder paste 3 Package information 3.1 SOT23-6L package information 3.2 Reflow profile 4 Ordering information Revision history
