Datasheet PUSB3BB2DF (Nexperia) - 2

ManufacturerNexperia
DescriptionExtremely low clamping low capacitance ESD protection
Pages / Page15 / 2 — Nexperia. PUSB3BB2DF. Extremely low clamping low capacitance ESD …
Revision03112020
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Nexperia. PUSB3BB2DF. Extremely low clamping low capacitance ESD protection

Nexperia PUSB3BB2DF Extremely low clamping low capacitance ESD protection

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Nexperia PUSB3BB2DF Extremely low clamping low capacitance ESD protection 5. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol
1 K1 cathode (diode 1) K1 K3 2 K2 cathode (diode 2)[1] 1 2 3 3 K3 cathode (diode 3) K2 aaa-030288 Transparent top view
DFN0603-3 (SOT8013)
[1] recommended for GND connection.
6. Ordering information Table 3. Ordering information Type number Package Name Description Version
PUSB3BB2DF DFN0603-3 DFN0603-3; plastic, ultra small and leadless full encapsulated SOT8013 package; 3 terminals; 0.225 mm pitch; 0.63 mm x 0.33 mm x 0.25 mm body
7. Marking Table 4. Marking codes Type number Marking code
PUSB3BB2DF B
8. Limiting values Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRWM reverse standof voltage -4 4 V IPPM rated peak pulse current tp = 8/20 µs [1] -8 8 A Tamb ambient temperature -40 125 °C Tstg storage temperature -65 150 °C
ESD maximum ratings
VESD electrostatic discharge IEC 61000-4-2; contact discharge [2] -20 20 kV voltage IEC 61000-4-2; air discharge [2] -20 20 kV [1] Device stressed with 8/20 μs exponential decay waveform according to IEC 61000-4-5. [2] Device stressed with ten non-repetitive ESD pulses. PUSB3BB2DF All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2020. Al rights reserved
Product data sheet 3 November 2020 2 / 15
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Characteristics 10. Application information 11. Package outline 12. Soldering 13. Revision history 14. Legal information Contents