Datasheet NC7SZ04 (ON Semiconductor) - 8
| Manufacturer | ON Semiconductor |
| Description | TinyLogic UHS Inverter |
| Pages / Page | 11 / 8 — PACKAGE DIMENSIONS. SC−74A. SCALE 2:1. 5X b. DETAIL A. MILLIMETERS. DIM. … |
| Revision | 4 |
| File Format / Size | PDF / 485 Kb |
| Document Language | English |
PACKAGE DIMENSIONS. SC−74A. SCALE 2:1. 5X b. DETAIL A. MILLIMETERS. DIM. MIN. MAX. TOP VIEW. C SEATING. SIDE VIEW. END VIEW. PLANE. RECOMMENDED
Model Line for this Datasheet
NC7SZ04
Text Version of Document
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS SC−74A
CASE 318BQ 5 ISSUE B 1 DATE 18 JAN 2018
SCALE 2:1 5X b
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME 0.20 C A B Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.
M
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
5 4
THICKNESS. MINIMUM LEAD THICKNESS IS THE
E1 E
MINIMUM THICKNESS OF BASE MATERIAL.
1 2 3
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD 0.05
A1
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
L
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
B e
EXCEED 0.15 PER SIDE.
DETAIL A A D MILLIMETERS DIM MIN MAX TOP VIEW A
0.90 1.10
A1
0.01 0.10
A DETAIL A b
0.25 0.50
c
0.10 0.26
D
2.85 3.15
E
2.50 3.00
E1 c
1.35 1.65
e
0.95 BSC
C SEATING SIDE VIEW END VIEW PLANE L
0.20 0.60
M
0 10 _ _
RECOMMENDED GENERIC SOLDERING FOOTPRINT* MARKING DIAGRAM*
0.95 PITCH XXX MG G XXX = Specific Device Code 2.40 M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. 5X Pb−Free indicator, “G” or microdot “ 1.00 5X G”, 0.70 may or may not be present. Some products may not follow the Generic Marking. DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON66279G
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: SC−74A PAGE 1 OF 1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com
PACKAGE DIMENSIONS SC−74A
CASE 318BQ 5 ISSUE B 1 DATE 18 JAN 2018
SCALE 2:1 5X b
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME 0.20 C A B Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.
M
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
5 4
THICKNESS. MINIMUM LEAD THICKNESS IS THE
E1 E
MINIMUM THICKNESS OF BASE MATERIAL.
1 2 3
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD 0.05
A1
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
L
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
B e
EXCEED 0.15 PER SIDE.
DETAIL A A D MILLIMETERS DIM MIN MAX TOP VIEW A
0.90 1.10
A1
0.01 0.10
A DETAIL A b
0.25 0.50
c
0.10 0.26
D
2.85 3.15
E
2.50 3.00
E1 c
1.35 1.65
e
0.95 BSC
C SEATING SIDE VIEW END VIEW PLANE L
0.20 0.60
M
0 10 _ _
RECOMMENDED GENERIC SOLDERING FOOTPRINT* MARKING DIAGRAM*
0.95 PITCH XXX MG G XXX = Specific Device Code 2.40 M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. 5X Pb−Free indicator, “G” or microdot “ 1.00 5X G”, 0.70 may or may not be present. Some products may not follow the Generic Marking. DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON66279G
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: SC−74A PAGE 1 OF 1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com
