HMC1082LP4E v05.1018 GaAs pHEMT MMIC MEDIUMPOWER AMPLIFIER, 5.5 - 18 GHzAbsolute Maximum RatingsTypical Supply Current vs. Vdd Drain Bias Voltage (Vdd) 5.5V Vdd (V) Idd (mA) T RF Input Power (RFIN) 20 dBm +4 220 M Channel Temperature 175 °C +4.5 220 Continuous Pdiss (T=85 °C) +5 220 1.81W (derate 20mW/°C R - S Thermal Resistance (RTH) 49.8 °C/W Adjust Vgg1 to achieve Idd = 220mA (junction to ground paddle) E Operating Temperature -40°C to +85°C W Storage Temperature -65°C to 150°C O ESD Sensitivity (HBM) Class 0, Passed 100V ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS R & P 24-Lead Lead Frame Chip Scale Package [LFCSP] A 4 x 4 mm Body and 0.85 mm Package Height E Outline Drawing(HCP-24-3)Dimensions shown in millimeters IN DETAIL A(JEDEC 95)4.100.304.00 SQ S - L 0.25PIN 13.900.18PIN 1 R INDICATORINDICATOR AREA OPTIONS(SEE DETAIL A)1924 IE 1810.50BSC2.85 LIF EXPOSEDPAD2.70 SQ P 2.55 M 136 A 0.50127TOP VIEW0.20 MIN0.40BOTTOM VIEW0.300.95FOR PROPER CONNECTION OFTHE EXPOSED PAD, REFER TO0.85SIDE VIEWTHE PIN CONFIGURATION AND0.750.05 MAXFUNCTION DESCRIPTIONS0.02 NOMSECTION OF THIS DATA SHEET.COPLANARITYSEATING0.08PLANE0.20 REFPKG-0494012-08-2017-C 24-Lead Lead Frame Chip Scale Package [LFCSP] 4 mm × 4 mm Body and 0.85 mm Package Height (HCP-24-3) Dimensions shown in millimeters Package Information Part Number Package Body Material Lead Finish MSL Rating [2] Package Marking [1] H1082 HMC1082LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 XXXX [1] 4-Digit lot number XXXX [2] Max peak reflow temperature of 260 °C For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com 7 Application Support: Phone: 1-800-ANALOG-D