Datasheet HMC441 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | GaAs pHEMT MMIC MEDIUM POWER AMPLIFIER, 6 - 18 GHz |
| Pages / Page | 8 / 5 — HMC441. GaAs pHEMT MMIC MEDIUM. POWER AMPLIFIER, 6 - 18 GHz. Outline … |
| File Format / Size | PDF / 518 Kb |
| Document Language | English |
HMC441. GaAs pHEMT MMIC MEDIUM. POWER AMPLIFIER, 6 - 18 GHz. Outline Drawing. Die Packaging Information. Pad Descriptions
Model Line for this Datasheet
Text Version of Document
HMC441
v09.0917
GaAs pHEMT MMIC MEDIUM POWER AMPLIFIER, 6 - 18 GHz Outline Drawing
IP H S - C R IE LIF P M R A E W O NOTES: R & P
Die Packaging Information
[1] 1. ALL DIMENSIONS ARE IN INCHES [MM] 2. DIE THICKNESS IS .004” A Standard Alternate 3. TYPICAL BOND IS .004” SQUARE E 4. BACKSIDE METALLIZATION: GOLD GP-2 (Gel Pack) [2] 5. BOND PAD METALLIZATION: GOLD [1] Refer to the “Packaging Information” section for die 6. BACKSIDE METAL IS GROUND. LIN packaging dimensions. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. [2] For alternate packaging information contact Analog Devices, Inc.
Pad Descriptions
Pad Number Function Description Pin Schematic This pad is AC coupled 1 RFIN and matched to 50 Ohms. Power Supply Voltage for the amplifier. An external 2, 3 Vdd1, Vdd2 bypass capacitor of 100 pF is required. This pad is AC coupled 4 RFOUT and matched to 50 Ohms. Optional gate control for amplifier. If left open, the 5, 6 Vgg1, Vgg2 amplifier will run at standard current. Negative voltage applied will reduce current. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
5
Application Support: Phone: 1-800-ANALOG-D
v09.0917
GaAs pHEMT MMIC MEDIUM POWER AMPLIFIER, 6 - 18 GHz Outline Drawing
IP H S - C R IE LIF P M R A E W O NOTES: R & P
Die Packaging Information
[1] 1. ALL DIMENSIONS ARE IN INCHES [MM] 2. DIE THICKNESS IS .004” A Standard Alternate 3. TYPICAL BOND IS .004” SQUARE E 4. BACKSIDE METALLIZATION: GOLD GP-2 (Gel Pack) [2] 5. BOND PAD METALLIZATION: GOLD [1] Refer to the “Packaging Information” section for die 6. BACKSIDE METAL IS GROUND. LIN packaging dimensions. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. [2] For alternate packaging information contact Analog Devices, Inc.
Pad Descriptions
Pad Number Function Description Pin Schematic This pad is AC coupled 1 RFIN and matched to 50 Ohms. Power Supply Voltage for the amplifier. An external 2, 3 Vdd1, Vdd2 bypass capacitor of 100 pF is required. This pad is AC coupled 4 RFOUT and matched to 50 Ohms. Optional gate control for amplifier. If left open, the 5, 6 Vgg1, Vgg2 amplifier will run at standard current. Negative voltage applied will reduce current. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
5
Application Support: Phone: 1-800-ANALOG-D
