Datasheet HMC8412TCPZ-EP (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | Low Noise Amplifier, 0.4 GHz to 11 GHz |
| Pages / Page | 10 / 5 — Enhanced Product. HMC8412TCPZ-EP. ABSOLUTE MAXIMUM RATINGS Table 4. … |
| File Format / Size | PDF / 310 Kb |
| Document Language | English |
Enhanced Product. HMC8412TCPZ-EP. ABSOLUTE MAXIMUM RATINGS Table 4. ELECTROSTATIC DISCHARGE (ESD) RATINGS. Parameter. Rating
Model Line for this Datasheet
Text Version of Document
link to page 10 link to page 5
Enhanced Product HMC8412TCPZ-EP ABSOLUTE MAXIMUM RATINGS Table 4. ELECTROSTATIC DISCHARGE (ESD) RATINGS Parameter Rating
The fol owing ESD information is provided for handling of V ESD-sensitive devices in an ESD protected area only. DD 7 V RF Input Power 25 dBm Human body model (HBM) per ANSI/ESDA/JEDEC JS-001. Continuous Power Dissipation (PDISS) T
ESD Ratings for HMC8412TCPZ-EP
CASE = 85°C 0.82 W TCASE = 125°C 0.46 W
Table 6. HMC8412TCPZ-EP, 6-Lead LFCSP
Temperature
ESD Model Withstand Threshold (V) Class
Storage Range −65°C to +150°C HBM ±500 1B Operating Range −55°C to +125°C Peak Reflow (Moisture Sensitivity Level 1 260°C
POWER DERATING CURVES
(MSL1))1 Figure 2 shows the maximum power dissipation vs. case Junction Temperature to Maintain 1,000,000 175°C temperature. Hours Mean Time to Failure (MTTF)
1.75
Nominal Junction Temperature (TA = 157.8°C 125°C, VDD = 5 V, IDQ = 60 mA
) 1.50 (W
1 See the Ordering Guide for more information.
N IO 1.25
Stresses at or above those listed under Absolute Maximum
T PA
Ratings may cause permanent damage to the product. This is a
ISSI 1.00
stress rating only; functional operation of the product at these
D ER
or any other conditions above those indicated in the
W 0.75
operational section of this specification is not implied.
M PO
Operation beyond the maximum operating conditions for
0.50 MU XI
extended periods may affect product reliability.
MA 0.25 THERMAL RESISTANCE 0 0
Thermal performance is directly linked to printed circuit board
10 20 30 40 50 60 70 80 90 –60 –50 –40 –30 –20 –10 100 110 120 130
007 (PCB) design and operating environment. Close attention to
CASE TEMPERATURE (°C)
25386- PCB thermal design is required. Figure 2. Maximum Power Dissipation vs. Case Temperature θ JC is the junction to case thermal resistance.
Table 5. Thermal Resistance ESD CAUTION Package Type θJC Unit
CP-6-12 109.3 °C/W Rev. 0 | Page 5 of 10 Document Outline Features Enhanced Product Features Applications Functional Block Diagram General Description Revision History Specifications 0.4 GHz to 3 GHz Frequency Range 3 GHz to 9 GHz Frequency Range 9 GHz to 11 GHz Frequency Range Absolute Maximum Ratings Thermal Resistance Electrostatic Discharge (ESD) Ratings ESD Ratings for HMC8412TCPZ-EP Power Derating Curves ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Outline Dimensions Ordering Guide
Enhanced Product HMC8412TCPZ-EP ABSOLUTE MAXIMUM RATINGS Table 4. ELECTROSTATIC DISCHARGE (ESD) RATINGS Parameter Rating
The fol owing ESD information is provided for handling of V ESD-sensitive devices in an ESD protected area only. DD 7 V RF Input Power 25 dBm Human body model (HBM) per ANSI/ESDA/JEDEC JS-001. Continuous Power Dissipation (PDISS) T
ESD Ratings for HMC8412TCPZ-EP
CASE = 85°C 0.82 W TCASE = 125°C 0.46 W
Table 6. HMC8412TCPZ-EP, 6-Lead LFCSP
Temperature
ESD Model Withstand Threshold (V) Class
Storage Range −65°C to +150°C HBM ±500 1B Operating Range −55°C to +125°C Peak Reflow (Moisture Sensitivity Level 1 260°C
POWER DERATING CURVES
(MSL1))1 Figure 2 shows the maximum power dissipation vs. case Junction Temperature to Maintain 1,000,000 175°C temperature. Hours Mean Time to Failure (MTTF)
1.75
Nominal Junction Temperature (TA = 157.8°C 125°C, VDD = 5 V, IDQ = 60 mA
) 1.50 (W
1 See the Ordering Guide for more information.
N IO 1.25
Stresses at or above those listed under Absolute Maximum
T PA
Ratings may cause permanent damage to the product. This is a
ISSI 1.00
stress rating only; functional operation of the product at these
D ER
or any other conditions above those indicated in the
W 0.75
operational section of this specification is not implied.
M PO
Operation beyond the maximum operating conditions for
0.50 MU XI
extended periods may affect product reliability.
MA 0.25 THERMAL RESISTANCE 0 0
Thermal performance is directly linked to printed circuit board
10 20 30 40 50 60 70 80 90 –60 –50 –40 –30 –20 –10 100 110 120 130
007 (PCB) design and operating environment. Close attention to
CASE TEMPERATURE (°C)
25386- PCB thermal design is required. Figure 2. Maximum Power Dissipation vs. Case Temperature θ JC is the junction to case thermal resistance.
Table 5. Thermal Resistance ESD CAUTION Package Type θJC Unit
CP-6-12 109.3 °C/W Rev. 0 | Page 5 of 10 Document Outline Features Enhanced Product Features Applications Functional Block Diagram General Description Revision History Specifications 0.4 GHz to 3 GHz Frequency Range 3 GHz to 9 GHz Frequency Range 9 GHz to 11 GHz Frequency Range Absolute Maximum Ratings Thermal Resistance Electrostatic Discharge (ESD) Ratings ESD Ratings for HMC8412TCPZ-EP Power Derating Curves ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Outline Dimensions Ordering Guide
