Datasheet HMC463LP5, 463LP5E (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | GaAs pHEMT MMIC LOW NOISE AGC AMPLIFIER, 2 - 20 GHz |
| Pages / Page | 8 / 5 — HMC463LP5 / 463LP5E. GaAs pHEMT MMIC LOW NOISE. AGC AMPLIFIER, 2 - 20 … |
| File Format / Size | PDF / 1.0 Mb |
| Document Language | English |
HMC463LP5 / 463LP5E. GaAs pHEMT MMIC LOW NOISE. AGC AMPLIFIER, 2 - 20 GHz. 32-Lead Lead Frame Chip Scale Package [LFCSP]
Model Line for this Datasheet
Text Version of Document
HMC463LP5 / 463LP5E
v09.0717
GaAs pHEMT MMIC LOW NOISE AGC AMPLIFIER, 2 - 20 GHz
7
32-Lead Lead Frame Chip Scale Package [LFCSP] Outline Drawing 5 x 5 mm Body and 0.90 mm Package Height (HCP-32-1) Dimensions shown in millimeters
T
DETAIL A
M
(JEDEC 95) 5.10 0.30 5.00 SQ 0.25 PIN 1 4.90 0.18 PIN 1 INDICATOR INDICATOR AREA OPTIONS (SEE DETAIL A)
E - S
25 32 24 1 0.50
IS
BSC EXPOSED 3.80 PAD 3.70 SQ
O
3.60 17 8 16 9 0.45 0.20 MIN
W N
TOP VIEW BOTTOM VIEW 0.40 3.50 REF
O
0.35 0.90 0.85 FOR PROPER CONNECTION OF 0.05 MAX THE EXPOSED PAD, REFER TO 0.80 0.02 NOM THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS COPLANARITY SECTION OF THIS DATA SHEET.
S - L
0.08 SEATING PLANE 0.20 REF
R IE
PKG-004898 COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-4. 03-09-2017-B
LIF 32-Lead Lead Frame Chip Scale Package [LFCSP] 5 mm × 5 mm Body and 0.90 mm Package Height P (HCP-32-1) M Dimensions shown in millimeters A
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] HMC463LP5 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] H463 XXXX HMC463LP5E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] H463 XXXX [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
7 - 5
Application Support: Phone: 1-800-ANALOG-D
v09.0717
GaAs pHEMT MMIC LOW NOISE AGC AMPLIFIER, 2 - 20 GHz
7
32-Lead Lead Frame Chip Scale Package [LFCSP] Outline Drawing 5 x 5 mm Body and 0.90 mm Package Height (HCP-32-1) Dimensions shown in millimeters
T
DETAIL A
M
(JEDEC 95) 5.10 0.30 5.00 SQ 0.25 PIN 1 4.90 0.18 PIN 1 INDICATOR INDICATOR AREA OPTIONS (SEE DETAIL A)
E - S
25 32 24 1 0.50
IS
BSC EXPOSED 3.80 PAD 3.70 SQ
O
3.60 17 8 16 9 0.45 0.20 MIN
W N
TOP VIEW BOTTOM VIEW 0.40 3.50 REF
O
0.35 0.90 0.85 FOR PROPER CONNECTION OF 0.05 MAX THE EXPOSED PAD, REFER TO 0.80 0.02 NOM THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS COPLANARITY SECTION OF THIS DATA SHEET.
S - L
0.08 SEATING PLANE 0.20 REF
R IE
PKG-004898 COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-4. 03-09-2017-B
LIF 32-Lead Lead Frame Chip Scale Package [LFCSP] 5 mm × 5 mm Body and 0.90 mm Package Height P (HCP-32-1) M Dimensions shown in millimeters A
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] HMC463LP5 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 [1] H463 XXXX HMC463LP5E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 [2] H463 XXXX [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
7 - 5
Application Support: Phone: 1-800-ANALOG-D
