Datasheet HMC930A (Analog Devices) - 8

ManufacturerAnalog Devices
DescriptionGaAs, pHEMT, MMIC, 0.25 W Power Amplifier, DC to 40 GHz
Pages / Page16 / 8 — HMC930A. Data Sheet. TYPICAL PERFORMANCE CHARACTERISTICS. +85°C. +25°C …
File Format / SizePDF / 270 Kb
Document LanguageEnglish

HMC930A. Data Sheet. TYPICAL PERFORMANCE CHARACTERISTICS. +85°C. +25°C –55°C. S11. S21 S22. SE (d. –10. N ( AI G. ESPO R. –20. –30. –40

HMC930A Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS +85°C +25°C –55°C S11 S21 S22 SE (d –10 N ( AI G ESPO R –20 –30 –40

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HMC930A Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 20 18 +85°C 10 16 +25°C –55°C ) 0 S11 14 B S21 S22 B) SE (d d N –10 12 N ( AI G ESPO R –20 10 –30 8 –40 6 0 5 10 15 20 25 30 35 40 45 50
009
0 4 8 12 16 20 24 28 32 36 40 44
012
FREQUENCY (GHz)
13738-
FREQUENCY (GHz)
13738- Figure 9. Gain and Return Loss Figure 12. Gain vs. Frequency for Various Temperatures
0 0 +85°C +85°C +25°C +25°C –55°C –55°C –10 –10 B) B) d d ( ( S S S S O O –20 –20 URN L URN L T T RE RE –30 –30 –40 –40 0 4 8 12 16 20 24 28 32 36 40 44
010
0 4 8 12 16 20 24 28 32 36 40 44
013
FREQUENCY (GHz)
13738-
FREQUENCY (GHz)
13738- Figure 10. Input Return Loss vs. Frequency for Various Temperatures Figure 13. Output Return Loss vs. Frequency for Various Temperatures
10 20 10 8 +85°C +25°C –55°C ) 0 ) B S11 dB S21 ( 6 S22 E SE (d –10 R N FIGU –20 E ESPO 4 R OIS N –30 2 –40 –50
1 1
0 0.00001 0.0001 0.001 0.01 0.1 1 10
0
0 4 8 12 16 20 24 28 32 36 40
014
FREQUENCY (GHz)
13738-
FREQUENCY (GHz)
13738- Figure 11. Low Frequency Gain and Return Loss Figure 14. Noise Figure vs. Frequency for Various Temperatures Rev. A | Page 8 of 16 Document Outline Features Applications Functional Block Diagram General Description Revision History Electrical Specifications DC to 12 GHz Frequency Range 12 GHz to 32 GHz Frequency Range 32 GHz to 40 GHz Frequency Range Total Supply Current by VDD Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Biasing Procedures Mounting and Bonding Techniques for Millimeterwave GaAs MMICs Handling Precautions Mounting Wire Bonding Outline Dimensions Die Packaging Information Ordering Guide