HMC8205BCHIPS. Data Sheet. 28V. +85°C. 40V. +25°C. 45V. –10. –55°C. 50V 55V. –20. –30. T A L. –40. URN L. SE I. –50. EVER. INP. –60. –12. –70. –14. –80
HMC8205BCHIPSData Sheet0028V+85°C40V+25°C–245V–10–55°C50V 55V)B)B–20d–4((dSNS–30OIO–6T A L–40URN LSOT–8RESE I–50UT–10EVERINPR–60–12–70–14–800123456 014 0123456 017 FREQUENCY (GHz) 13790- FREQUENCY (GHz) 13790- Figure 15. Input Return Loss vs. Frequency at Various Supply Voltages Figure 18. Reverse Isolation vs. Frequency at Various Temperatures 001300mA+85°C900mA+25°C–2–2500mA–55°CB)B)d–4d–4((SSSSO–6O–6URN L–8URN LTT–8RERE–10UTUTP–10INPUT–12O–12–14–14–160123456 015 0123456 018 FREQUENCY (GHz) 13790- FREQUENCY (GHz) 13790- Figure 16. Input Return Loss vs. Frequency at Various Quiescent Supply Figure 19. Output Return Loss vs. Frequency at Various Temperatures Currents (IDDx) 2028V040V–245V 50VB)–2B)d55Vd–4((SSS–4SOO–6–6URN LURN L–8TT–8RERE–10UTUTP–10PUTUT–12O–12O1300mA–14–14900mA 500mA–16–160123456 016 0123456 019 FREQUENCY (GHz) 13790- FREQUENCY (GHz) 13790- Figure 17. Output Return Loss vs. Frequency at Various Supply Voltages Figure 20. Output Return Loss vs. Frequency at Various Quiescent Supply Currents (IDD1 + IDD2) Rev. A | Page 8 of 19 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTION INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE