Datasheet HMC602LP4, 602LP4E (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | 70 dB, LOGARITHMIC DETECTOR / CONTROLLER, 1 - 8000 MHz |
| Pages / Page | 8 / 5 — HMC602LP4 / 602LP4E. 70 dB, LOGARITHMIC. DETECTOR / CONTROLLER, 1 - 8000 … |
| File Format / Size | PDF / 540 Kb |
| Document Language | English |
HMC602LP4 / 602LP4E. 70 dB, LOGARITHMIC. DETECTOR / CONTROLLER, 1 - 8000 MHz. Input Return Loss vs Frequency [4]
Model Line for this Datasheet
Text Version of Document
HMC602LP4 / 602LP4E
v03.0209
70 dB, LOGARITHMIC DETECTOR / CONTROLLER, 1 - 8000 MHz Input Return Loss vs Frequency [4] Absolute Maximum Ratings
0 Vcc1, Vcc2, Vcc3 +5.5V EN +5.5V -10 VSET Input Voltage +5.5V LOGOUT Output Current 3 mA -20 RF Input Power +15 dBm Junction Temperature 125 °C -30 Continuous Pdiss (T = 85°C) 1.55 Watts (Derate 7.95 mW/°C above 85°C) INPUT RETURN LOSS (dB) -40 Thermal Resistance (R ) th 42 °C/W (junction to lead) 12 -50 0 1 2 3 4 5 6 7 8 Storage Temperature -65 to +150 °C FREQUENCY (GHz) Operating Temperature -40 to +85 °C T ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS [4] Reference plane at J1 connector on Evaluation PCB
Outline Drawing
S - SM R O T C E T E R D E W O P NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.
Package Information
7. REFER TO HMC APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN. Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] H602 HMC602LP4 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [2] H602 HMC602LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 XXXX [1] Max peak refl ow temperature of 235 °C [2] Max peak refl ow temperature of 260 °C [3] 4-Digit lot number XXXX Information furnis F heod r pri by An ce, de alog Devi lcievs eir s y b , a eliev nd to pla ed to be accu ce o rate anrder d relia sbl, pl e. H ease co owever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone: 978 rights of third parties that may result from its use. Specifications subject to change without notice. No Ph - o 25 ne 0 : 7 -3 81- 3 3 4 29 3 F -470 ax: 978 0 • Orde - r o 25 nlin 0- e a3 t 373
12 - 22
license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com Order On-l Trademarks and registered trademarks are the property of their respective owners. ine at www.hit A ti p te.co plicati m on Support: Phone: 1-800-ANALOG-D
v03.0209
70 dB, LOGARITHMIC DETECTOR / CONTROLLER, 1 - 8000 MHz Input Return Loss vs Frequency [4] Absolute Maximum Ratings
0 Vcc1, Vcc2, Vcc3 +5.5V EN +5.5V -10 VSET Input Voltage +5.5V LOGOUT Output Current 3 mA -20 RF Input Power +15 dBm Junction Temperature 125 °C -30 Continuous Pdiss (T = 85°C) 1.55 Watts (Derate 7.95 mW/°C above 85°C) INPUT RETURN LOSS (dB) -40 Thermal Resistance (R ) th 42 °C/W (junction to lead) 12 -50 0 1 2 3 4 5 6 7 8 Storage Temperature -65 to +150 °C FREQUENCY (GHz) Operating Temperature -40 to +85 °C T ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS [4] Reference plane at J1 connector on Evaluation PCB
Outline Drawing
S - SM R O T C E T E R D E W O P NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND.
Package Information
7. REFER TO HMC APPLICATION NOTE FOR SUGGESTED PCB LAND PATTERN. Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] H602 HMC602LP4 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [2] H602 HMC602LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 XXXX [1] Max peak refl ow temperature of 235 °C [2] Max peak refl ow temperature of 260 °C [3] 4-Digit lot number XXXX Information furnis F heod r pri by An ce, de alog Devi lcievs eir s y b , a eliev nd to pla ed to be accu ce o rate anrder d relia sbl, pl e. H ease co owever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone: 978 rights of third parties that may result from its use. Specifications subject to change without notice. No Ph - o 25 ne 0 : 7 -3 81- 3 3 4 29 3 F -470 ax: 978 0 • Orde - r o 25 nlin 0- e a3 t 373
12 - 22
license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com Order On-l Trademarks and registered trademarks are the property of their respective owners. ine at www.hit A ti p te.co plicati m on Support: Phone: 1-800-ANALOG-D
