Datasheet AD8273 (Analog Devices) - 4
| Manufacturer | Analog Devices |
| Description | Very Low Distortion, Dual-Channel, High Precision Difference Amplifier |
| Pages / Page | 16 / 4 — AD8273. ABSOLUTE MAXIMUM RATINGS. MAXIMUM POWER DISSIPATION. Table 3. … |
| Revision | B |
| File Format / Size | PDF / 331 Kb |
| Document Language | English |
AD8273. ABSOLUTE MAXIMUM RATINGS. MAXIMUM POWER DISSIPATION. Table 3. Parameter Rating. 2.0. TJ MAX = 150°C. θJA = 105°C/W. 1.6. IO T
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AD8273 ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION Table 3.
The maximum safe power dissipation for the AD8273 is limited
Parameter Rating
by the associated rise in junction temperature (T Supply Voltage ±18 V J) on the die. At approximately 150°C, which is the glass transition temperature, Output Short-Circuit Current Observe derating curve the plastic changes its properties. Even temporarily exceeding Voltage at Any Input Pin 40 V this temperature limit may change the stresses that the package Differential Input Voltage 40 V exerts on the die, permanently shifting the parametric performance Current into Any Input Pin 3 mA of the amplifiers. Exceeding a temperature of 150°C for an Human Body Model (HBM) ESD Rating ±4000 V extended period can result in a loss of functionality. Storage Temperature Range −65°C to +130°C The AD8273 has built-in, short-circuit protection that limits the Specified Temperature Range −40°C to +85°C output current to approximately 100 mA (see Figure 2 for more Thermal Resistance information). While the short-circuit condition itself does not θJA 105°C/W damage the part, the heat generated by the condition can cause θJC 36°C/W the part to exceed its maximum junction temperature, with Package Glass Transition Temperature (TG) 150°C corresponding negative effects on reliability. Stresses above those listed under Absolute Maximum Ratings
2.0 TJ MAX = 150°C
may cause permanent damage to the device. This is a stress
θJA = 105°C/W )
rating only; functional operation of the device at these or any
(W 1.6 N
other conditions above those indicated in the operational
IO T
section of this specification is not implied. Exposure to absolute
IPA S 1.2
maximum rating conditions for extended periods may affect
IS D
device reliability.
R E W O 0.8 M P MU XI 0.4 MA 0
3
–50 –25 0 25 50 75 100 125
04 1-
AMBIENT TEMPERATURE (°C)
98 06 Figure 2. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
Rev. B | Page 4 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION CONFIGURATIONS POWER SUPPLIES OUTLINE DIMENSIONS ORDERING GUIDE
AD8273 ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION Table 3.
The maximum safe power dissipation for the AD8273 is limited
Parameter Rating
by the associated rise in junction temperature (T Supply Voltage ±18 V J) on the die. At approximately 150°C, which is the glass transition temperature, Output Short-Circuit Current Observe derating curve the plastic changes its properties. Even temporarily exceeding Voltage at Any Input Pin 40 V this temperature limit may change the stresses that the package Differential Input Voltage 40 V exerts on the die, permanently shifting the parametric performance Current into Any Input Pin 3 mA of the amplifiers. Exceeding a temperature of 150°C for an Human Body Model (HBM) ESD Rating ±4000 V extended period can result in a loss of functionality. Storage Temperature Range −65°C to +130°C The AD8273 has built-in, short-circuit protection that limits the Specified Temperature Range −40°C to +85°C output current to approximately 100 mA (see Figure 2 for more Thermal Resistance information). While the short-circuit condition itself does not θJA 105°C/W damage the part, the heat generated by the condition can cause θJC 36°C/W the part to exceed its maximum junction temperature, with Package Glass Transition Temperature (TG) 150°C corresponding negative effects on reliability. Stresses above those listed under Absolute Maximum Ratings
2.0 TJ MAX = 150°C
may cause permanent damage to the device. This is a stress
θJA = 105°C/W )
rating only; functional operation of the device at these or any
(W 1.6 N
other conditions above those indicated in the operational
IO T
section of this specification is not implied. Exposure to absolute
IPA S 1.2
maximum rating conditions for extended periods may affect
IS D
device reliability.
R E W O 0.8 M P MU XI 0.4 MA 0
3
–50 –25 0 25 50 75 100 125
04 1-
AMBIENT TEMPERATURE (°C)
98 06 Figure 2. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
Rev. B | Page 4 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION CONFIGURATIONS POWER SUPPLIES OUTLINE DIMENSIONS ORDERING GUIDE
