Datasheet LM25149-Q1 (Texas Instruments) - 9

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LM25149-Q1 www.ti.com
SNVSBV6 – DECEMBER 2020 TJ = –40°C to +150°C, VIN = 8 V to 18 V. Typical values are at TJ = 25°C and VIN = 12 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tLO-FALL LO fall time (90% to 10%) CLOAD = 2.7 nF 7 ns V I HO = VSW = 0 V, VCBOOT = 5 V, LO-SRC LO peak source current 2.2 A VVCCX = 5 V ILO-SINK LO peak sink current VVCCX = 5 V 3.2 A
ADAPTIVE DEADTIME CONTROL
tDEAD1 HO off to LO on deadtime 12 ns tDEAD2 LO off to HO on deadtime 13 ns
INTERNAL HICCUP MODE
HICDLY Hiccup mode activation delay VISNS+ – VVOUT > 60 mV 512 cycles HICCYCLES HICCUP mode fault VISNS+ – VVOUT > 60 mV 16384 cycles
OVERCURRENT PROTECTION
VCS-TH Current limit threshold Measured from ISNS+ to VOUT 54 60 66 mV tDELAY-ISNS+ ISNS+ delay to output 45 ns
TION
GCS CS amplifier gain 9.5 10 10.5 V/V IBIAS-ISNS+ CS amplifier input bias current 15 nA
MA CONFIGURATION R
RCONF-OPT1 Primary, no spread spectrum 28.7 29.4 30.1 kΩ RCONF-OPT2 Primary, with spread spectrum 40.2 41.2 43.2 kΩ Primary, Interleaved, no spread RCONF-OPT3 53.6 54.9 57.6 kΩ spectrum Primary, Interleaved, with spread RCONF-OPT4 69.8 71.5 73.2 kΩ spectrum RCONF-OPT5 Secondary 88.7 90.9 93.1 kΩ
NCE INFO THERMAL SHUTDOWN A
T
V
J-SD Thermal shutdown threshold (1) Temperature rising 175 °C TJ-HYS Thermal shutdown hysteresis (1) 15 °C
AD
(1) Specified by design. Not production tested.
7.6 Active EMI Filter
TJ = –40°C to 150°C, VAEFVDDA = 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Active EMI Filter
VAEF-UVLO-R Voltage AEF UVLO rising threshold 4.15 V VAEF-UVLO-F Voltage AEF UVLO falling threshold 3.5 V VAEF-HYST Voltage AEF UVLO hysteresis 650 mV AOL DC gain 68 dB FBW-AEF Unity gain bandwidth 300 MHz VAEF-HIGH AEF voltage rising threshold Enable AEF 2 V VAEF-LOW AEF voltage falling threshold Disable AEF 0.8 V VAEF-REF AEF reference voltage 2.5 V Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: LM25149-Q1 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Description (continued) 6 Pin Configuration and Functions 6.1 Wettable Flanks 7 Specifications 7.1 Absolute Maximum Ratings 7.2 ESD Ratings  7.3 Recommended Operating Conditions 7.4 Thermal Information 7.5 Electrical Characteristics 7.6 Active EMI Filter 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Input Voltage Range (VIN) 8.3.2 High-Voltage Bias Supply Regulator (VCC, VCCX, VDDA) 8.3.3 Enable (EN) 8.3.4 Power Good Monitor (PG) 8.3.5 Switching Frequency (RT) 8.3.6 Active EMI Filter 8.3.7 Dual Random Spread Spectrum (DRSS) 8.3.8 Soft-Start 8.3.9 Output Voltage Setpoint (FB) 8.3.10 Minimum Controllable On-Time 8.3.11 Error Amplifier and PWM Comparator (FB, EXTCOMP) 8.3.12 Slope Compensation 8.3.13 Inductor Current Sense (ISNS+, VOUT) 8.3.13.1 Shunt Current Sensing 8.3.13.2 Inductor DCR Current Sensing 8.3.14 Hiccup Mode Current Limiting 8.3.15 High-Side and Low-Side Gate Drivers (HO, LO) 8.3.16 Output Configurations (CNFG) 8.3.17 Single-Output Two-phase Operation 8.4 Device Functional Modes 8.4.1 Standby Modes 8.4.2 Pulse Frequency Modulation and Synchronization (PFM/SYNC) 8.4.3 Thermal Shutdown 9 Application and Implementation 9.1 Application Information 9.1.1 Power Train Components 9.1.1.1 Buck Inductor 9.1.1.2 Output Capacitors 9.1.1.3 Input Capacitors 9.1.1.4 Power MOSFETs 9.1.1.5 EMI Filter 9.1.2 Error Amplifier and Compensation 9.2 Typical Application 9.2.1 Design Requirements 9.2.2 Detailed Design Procedure 9.2.2.1 Custom Design With WEBENCH® Tools 9.2.2.2 Custom Design With Excel Quickstart Tool 9.2.2.3 Buck Inductor 9.2.2.4 Current-Sense Resistance 9.2.2.5 Output Capacitors 9.2.2.6 Input Capacitors 9.2.2.7 Frequency Set Resistor 9.2.2.8 Feedback Resistors 9.2.2.9 Compensation Components 9.2.2.10 Active EMI Components 9.2.3 Application Curves 10 Power Supply Recommendations 11 Layout 11.1 Layout Guidelines 11.1.1 Power Stage Layout 11.1.2 Gate-Drive Layout 11.1.3 PWM Controller Layout 11.1.4 Active EMI Layout 11.1.5 Thermal Design and Layout 11.1.6 Ground Plane Design 11.2 Layout Example 12 Device and Documentation Support 12.1 Device Support 12.1.1 Development Support 12.1.2 Custom Design With WEBENCH® Tools 12.2 Documentation Support 12.2.1 Related Documentation 12.2.1.1 PCB Layout Resources 12.2.1.2 Thermal Design Resources 12.3 Receiving Notification of Documentation Updates 12.4 Support Resources 12.5 Trademarks 12.6 Electrostatic Discharge Caution 12.7 Glossary 13 Mechanical, Packaging, and Orderable Information