Datasheet nPM1100 (Nordic Semiconductor) - 7

link to page 14 2 About this document This document is organized into chapters that are based on the modules available in the IC. 2.1 Document status The document status reflects the level of maturity of the document.
Document name Description
Objective Product Specification (OPS) Applies to document versions up to 1.0. This document contains target specifications for product development. Product Specification (PS) Applies to document versions 1.0 and higher. This document contains final product specifications. Nordic Semiconductor ASA reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Table 1: Defined document names 2.2 Core component chapters Every core component has a unique capitalized name or an abbreviation of its name, e.g. LED, used for identification and reference. This name is used in chapter headings and references, and it will appear in the C-code header file to identify the component. The core component instance name, which is different from the core component name, is constructed using the core component name followed by a numbered postfix, starting with 0, for example, LED0. A postfix is normally only used if a core component can be instantiated more than once. The core component instance name is also used in the C-code header file to identify the core component instance. The chapters describing core components may include the following information: • A detailed functional description of the core component • Register configuration for the core component • Electrical specification tables, containing performance data which apply for the operating conditions described in Recommended operating conditions on page 14. 4445_367 v1.0 7 Document Outline Contents nPM1100 Feature list Revision history About this document 2.1 Document status 2.2 Core component chapters Product overview 3.1 Block diagram 3.1.1 In circuit configurations 3.2 System description 3.3 Power-on reset (POR) and brownout reset (BOR) 3.4 DPPM — Dynamic power-path management 3.5 Using Ship mode 3.6 Thermal protection 3.7 Battery considerations 3.8 Charging and Error LED drivers 3.9 System electrical parameters 3.10 System efficiency Absolute maximum ratings Recommended operating conditions 5.1 Dissipation ratings 5.2 WLCSP light sensitivity Core components 6.1 SYSREG — System regulator 6.1.1 USB port detection and VBUS current limiting 6.1.2 SYSREG resistance and output voltage 6.1.3 VBUS overvoltage and undervoltage protection 6.1.4 VBUS disconnect 6.1.5 Electrical parameters 6.1.6 Electrical characteristics 6.2 CHARGER — Battery charger 6.2.1 Charging cycle 6.2.2 Battery detection and UVLO 6.2.3 Termination voltage (VTERMSET) 6.2.4 Termination and trickle charge current 6.2.5 Charge current limit (ICHG) 6.2.6 Battery thermal protection using NTC thermistor (NTC) 6.2.7 Charger thermal regulation 6.2.8 Charger error conditions 6.2.9 Charging indication (CHG) and charging error indication (ERR) 6.2.10 DPPM — Dynamic power-path management 6.2.11 Electrical parameters 6.2.12 Electrical characteristics 6.3 BUCK — Buck regulator 6.3.1 Output voltage selection (VOUTBSET0, VOUTBSET1) 6.3.2 BUCK mode selection (MODE) 6.3.3 Component selection 6.3.4 Electrical parameters 6.3.5 Electrical characteristics Application 7.1 Schematic 7.2 Supplying from BUCK 7.3 USB port negotiation 7.4 CHG and ERR 7.5 Termination voltage and current 7.6 NTC configuration 7.7 Ship mode 7.8 Battery monitoring and low battery indication Hardware and layout 8.1 Ball assignments 8.2 Mechanical specifications 8.2.1 WLCSP 2.075x2.075 mm package 8.3 Reference circuitry 8.3.1 Configuration 1 8.3.2 Configuration 2 8.3.3 Configuration 3 8.3.4 PCB guidelines 8.3.5 PCB layout example Ordering information 9.1 IC marking 9.2 Box labels 9.3 Order code 9.4 Code ranges and values 9.5 Product options Legal notices