Datasheet PMEG3010EH, PMEG3010EJ, PMEG3010ET (Nexperia) - 7
| Manufacturer | Nexperia |
| Description | 1 A very low VF MEGA Schottky barrier rectifiers |
| Pages / Page | 11 / 7 — Nexperia. PMEG3010EH/EJ/ET. 1 A very low VF MEGA Schottky barrier … |
| Revision | 28082018 |
| File Format / Size | PDF / 670 Kb |
| Document Language | English |
Nexperia. PMEG3010EH/EJ/ET. 1 A very low VF MEGA Schottky barrier rectifiers. 10. Packing information. Table 9. Packing methods
Model Line for this Datasheet
Text Version of Document
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Nexperia PMEG3010EH/EJ/ET 1 A very low VF MEGA Schottky barrier rectifiers 10. Packing information Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity 3000 10000
PMEG3010EH SOD123F 4 mm pitch, 8 mm tape and reel -115 -135 PMEG3010EJ SOD323F 4 mm pitch, 8 mm tape and reel -115 -135 PMEG3010ET SOT23 4 mm pitch, 8 mm tape and reel -215 -235 [1] For further information and the availability of packing methods, see Section 14.
11. Soldering
4.4 4 2.9 1.6 solder lands solder resist 2.1 1.6 1.1 1.2 solder paste occupied area 1.1 (2×) Reflow soldering is the only recommended soldering method. Dimensions in mm
Fig 8. Reflow soldering footprint SOD123F
3.05 2.80 2.10 1.60 solder lands solder resist 1.65 0.95 0.50 0.60 occupied area solder paste 0.50 msa433 (2×) Reflow soldering is the only recommended soldering method. Dimensions in mm
Fig 9. Reflow soldering footprint SOD323F (SC-90)
PMEG3010EH_EJ_ET_4 © Nexperia B.V. 2017. All rights reserved
Product data sheet Rev. 04 — 20 March 2007 7 of 11
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents
Nexperia PMEG3010EH/EJ/ET 1 A very low VF MEGA Schottky barrier rectifiers 10. Packing information Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity 3000 10000
PMEG3010EH SOD123F 4 mm pitch, 8 mm tape and reel -115 -135 PMEG3010EJ SOD323F 4 mm pitch, 8 mm tape and reel -115 -135 PMEG3010ET SOT23 4 mm pitch, 8 mm tape and reel -215 -235 [1] For further information and the availability of packing methods, see Section 14.
11. Soldering
4.4 4 2.9 1.6 solder lands solder resist 2.1 1.6 1.1 1.2 solder paste occupied area 1.1 (2×) Reflow soldering is the only recommended soldering method. Dimensions in mm
Fig 8. Reflow soldering footprint SOD123F
3.05 2.80 2.10 1.60 solder lands solder resist 1.65 0.95 0.50 0.60 occupied area solder paste 0.50 msa433 (2×) Reflow soldering is the only recommended soldering method. Dimensions in mm
Fig 9. Reflow soldering footprint SOD323F (SC-90)
PMEG3010EH_EJ_ET_4 © Nexperia B.V. 2017. All rights reserved
Product data sheet Rev. 04 — 20 March 2007 7 of 11
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Test information 9. Package outline 10. Packing information 11. Soldering 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents
