Datasheet ADGS1212 (Analog Devices) - 9
| Manufacturer | Analog Devices |
| Description | SPI Interface, Quad SPST Switch, Low QINJ, Low CON, ±15 V/+12 V, Mux Configurable |
| Pages / Page | 24 / 9 — Data Sheet. ADGS1212. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table … |
| File Format / Size | PDF / 655 Kb |
| Document Language | English |
Data Sheet. ADGS1212. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 6. Parameter. Rating. Table 7. Thermal Resistance
Model Line for this Datasheet
Text Version of Document
link to page 6 link to page 6
Data Sheet ADGS1212 ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE Table 6.
Thermal performance is directly linked to printed circuit board
Parameter Rating
(PCB) design and operating environment. Careful attention to V PCB thermal design is required. DD to VSS 35 V VDD to GND −0.3 V to +25 V
Table 7. Thermal Resistance
VSS to GND +0.3 V to −25 V
Package Type θJA θJC ΨJT Unit
VL to GND −0.3 V to +6 V CP-24-151 67 33.7 11.1 °C/W Analog Inputs1 VSS − 0.3 V to VDD + 0.3 V or 30 mA, whichever occurs 1 Thermal impedance simulated values are based on JEDEC 2S2P thermal test first board with four thermal vias. See JEDEC JESD-51. Digital Inputs1 −0.3 V to +6 V Peak Current, Sx or Dx Pins2 38 mA (pulsed at 1 ms,
ESD CAUTION
10% duty cycle maximum) Continuous Current, Sx or Dx Pins2, 3 Data + 15% Operating Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C Reflow Soldering Peak 260(+0/−5)°C Temperature, Pb Free 1 Overvoltages at the digital Sx and Dx pins are clamped by internal diodes. Limit current to the maximum ratings given. 2 Sx refers to the S1 to S4 pins, and Dx refers to the D1 to D4 pins. 3 See Table 3 and Table 4. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Only one absolute maximum rating can be applied at any one time. Rev. 0 | Page 9 of 24 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ±15 V DUAL SUPPLY 12 V SINGLE SUPPLY CONTINUOUS CURRENT PER CHANNEL, Sx OR Dx Four Channels On One Channel On TIMING CHARACTERISTICS Timing Diagrams ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY THEORY OF OPERATION ADDRESS MODE ERROR DETECTION FEATURES Cyclic Redundancy Check (CRC) Error Detection SCLK Count Error Detection Invalid Read/Write Address Error CLEARING THE ERROR FLAGS REGISTER BURST MODE SOFTWARE RESET DAISY-CHAIN MODE POWER-ON RESET APPLICATIONS INFORMATION BREAK-BEFORE-MAKE SWITCHING POWER SUPPLY RAILS POWER SUPPLY RECOMMENDATIONS REGISTER SUMMARY REGISTER DETAILS SWITCH DATA REGISTER ERROR CONFIGURATION REGISTER ERROR FLAGS REGISTER BURST ENABLE REGISTER SOFTWARE RESET REGISTER OUTLINE DIMENSIONS ORDERING GUIDE
Data Sheet ADGS1212 ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAL RESISTANCE Table 6.
Thermal performance is directly linked to printed circuit board
Parameter Rating
(PCB) design and operating environment. Careful attention to V PCB thermal design is required. DD to VSS 35 V VDD to GND −0.3 V to +25 V
Table 7. Thermal Resistance
VSS to GND +0.3 V to −25 V
Package Type θJA θJC ΨJT Unit
VL to GND −0.3 V to +6 V CP-24-151 67 33.7 11.1 °C/W Analog Inputs1 VSS − 0.3 V to VDD + 0.3 V or 30 mA, whichever occurs 1 Thermal impedance simulated values are based on JEDEC 2S2P thermal test first board with four thermal vias. See JEDEC JESD-51. Digital Inputs1 −0.3 V to +6 V Peak Current, Sx or Dx Pins2 38 mA (pulsed at 1 ms,
ESD CAUTION
10% duty cycle maximum) Continuous Current, Sx or Dx Pins2, 3 Data + 15% Operating Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C Reflow Soldering Peak 260(+0/−5)°C Temperature, Pb Free 1 Overvoltages at the digital Sx and Dx pins are clamped by internal diodes. Limit current to the maximum ratings given. 2 Sx refers to the S1 to S4 pins, and Dx refers to the D1 to D4 pins. 3 See Table 3 and Table 4. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Only one absolute maximum rating can be applied at any one time. Rev. 0 | Page 9 of 24 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ±15 V DUAL SUPPLY 12 V SINGLE SUPPLY CONTINUOUS CURRENT PER CHANNEL, Sx OR Dx Four Channels On One Channel On TIMING CHARACTERISTICS Timing Diagrams ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY THEORY OF OPERATION ADDRESS MODE ERROR DETECTION FEATURES Cyclic Redundancy Check (CRC) Error Detection SCLK Count Error Detection Invalid Read/Write Address Error CLEARING THE ERROR FLAGS REGISTER BURST MODE SOFTWARE RESET DAISY-CHAIN MODE POWER-ON RESET APPLICATIONS INFORMATION BREAK-BEFORE-MAKE SWITCHING POWER SUPPLY RAILS POWER SUPPLY RECOMMENDATIONS REGISTER SUMMARY REGISTER DETAILS SWITCH DATA REGISTER ERROR CONFIGURATION REGISTER ERROR FLAGS REGISTER BURST ENABLE REGISTER SOFTWARE RESET REGISTER OUTLINE DIMENSIONS ORDERING GUIDE
